JPH0476504B2 - - Google Patents

Info

Publication number
JPH0476504B2
JPH0476504B2 JP61008379A JP837986A JPH0476504B2 JP H0476504 B2 JPH0476504 B2 JP H0476504B2 JP 61008379 A JP61008379 A JP 61008379A JP 837986 A JP837986 A JP 837986A JP H0476504 B2 JPH0476504 B2 JP H0476504B2
Authority
JP
Japan
Prior art keywords
resin
metal member
oxide film
integrated circuit
silicon oxide
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP61008379A
Other languages
English (en)
Japanese (ja)
Other versions
JPS62166553A (ja
Inventor
Sunao Kato
Osamu Nakagawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP61008379A priority Critical patent/JPS62166553A/ja
Publication of JPS62166553A publication Critical patent/JPS62166553A/ja
Publication of JPH0476504B2 publication Critical patent/JPH0476504B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H10W70/458—
    • H10W72/5449—
    • H10W90/756—

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Lead Frames For Integrated Circuits (AREA)
JP61008379A 1986-01-18 1986-01-18 樹脂封止型半導体装置 Granted JPS62166553A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP61008379A JPS62166553A (ja) 1986-01-18 1986-01-18 樹脂封止型半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP61008379A JPS62166553A (ja) 1986-01-18 1986-01-18 樹脂封止型半導体装置

Publications (2)

Publication Number Publication Date
JPS62166553A JPS62166553A (ja) 1987-07-23
JPH0476504B2 true JPH0476504B2 (enExample) 1992-12-03

Family

ID=11691587

Family Applications (1)

Application Number Title Priority Date Filing Date
JP61008379A Granted JPS62166553A (ja) 1986-01-18 1986-01-18 樹脂封止型半導体装置

Country Status (1)

Country Link
JP (1) JPS62166553A (enExample)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0587966U (ja) * 1992-04-28 1993-11-26 シャープ株式会社 リードフレーム
CN1185704C (zh) * 1997-03-18 2005-01-19 精工爱普生株式会社 半导体装置及其制造方法
JP5761280B2 (ja) * 2013-09-12 2015-08-12 株式会社デンソー 半導体パッケージおよびその製造方法

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60201651A (ja) * 1984-03-26 1985-10-12 Hitachi Cable Ltd 半導体用リ−ドフレ−ム

Also Published As

Publication number Publication date
JPS62166553A (ja) 1987-07-23

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