JPH0382067A - 樹脂封止型半導体装置 - Google Patents

樹脂封止型半導体装置

Info

Publication number
JPH0382067A
JPH0382067A JP1218979A JP21897989A JPH0382067A JP H0382067 A JPH0382067 A JP H0382067A JP 1218979 A JP1218979 A JP 1218979A JP 21897989 A JP21897989 A JP 21897989A JP H0382067 A JPH0382067 A JP H0382067A
Authority
JP
Japan
Prior art keywords
recess
resin
lead
semiconductor device
internal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1218979A
Other languages
English (en)
Inventor
Takumi Matsukura
松倉　巧
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp filed Critical NEC Corp
Priority to JP1218979A priority Critical patent/JPH0382067A/ja
Publication of JPH0382067A publication Critical patent/JPH0382067A/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L24/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H01L2224/48248—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item the bond pad being disposed in a recess of the surface of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
    • H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/4912—Layout
    • H01L2224/49171—Fan-out arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01078—Platinum [Pt]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01082—Lead [Pb]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)
  • Lead Frames For Integrated Circuits (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。

Description

【発明の詳細な説明】 〔産業上の利用分野〕 本発明は樹脂封止型半導体装置に関し、特に樹脂封止型
表面実装半導体装置に関する。
〔従来の技術〕
従来、この種の樹脂封止型半導体装置は、第５図に示す
ように、多数の電極パッドを有する半導体チップ１を中
央部に搭載するアイランド部２とアイランド部２の周辺
を囲ってアイランド部２に対して放射状に形成した複数
の内部リード５ａとを有し、各電極パッドとそれに対応
する内部り−ド５ａとの間をワイヤー３でワイヤボンデ
ィングした後、外周を樹脂４で気密封止する構成となっ
ていた。
表面実装型半導体装置はプリント基板に搭載する際に外
部リード部５ｂのみを半田ごてで加熱して半田付けを行
ない、樹脂４には熱がほとんどかからなかった為、何ら
問題は発生していなかった。
〔発明が解決しようとする課題〕
しかしながら近年その実装方法に変化がおこり、実装効
率を向上させるためにＶＰＳや赤外線リフロー等のよう
にパッケージ全体を加熱して半田付けする方法になって
きた。このような実装方法では第６図に示すように熱ス
トレスでワイヤー３と内部リード５ａの接合部にクラッ
ク６が発生して信頼性上の重大な問題が発生する。すな
わち、基板への実装時に半導体装置の温度が２１０〜２
６０℃の高温になって樹脂４がガラス転移点（１６０℃
前ｆ＆　）を越えてしまうため、樹脂４の熱膨張率が急
激に大きくなって、樹脂４がパッケージ外側へ向って膨
張しそれにともなってワイヤー３も一緒に移動するが、
ワイヤー３の先端は内部リード５ａと接合している為に
応力が集中し、ワイヤー３の最も弱いリード側ネック部
分にクラック６が発生することになる。
本発明の目的は、実装時の耐熱ショック性を向上させた
樹脂封止型半導体装置を提供することにある。
〔課題を解決するための手段〕
本発明の樹脂封止型半導体装置は、内部リードの先端に
表面が他の表面よりも低い凹部を設け、その凹部にワイ
ヤボンディングをほどこした構造となっている。
内部リードの先端の凹部はハーフエッチ、プレス等によ
って形成することができる。
〔実施例〕
次に、本発明について図面を参照して説明する。
第１図乃至第３図を参照すると、本発明の一実施例の樹
脂封止型半導体装置においては、表面がメツキ７された
複数の内部リード５ａに囲まれたアイランド部２（リー
ド５と一体に形成されたリードフレームの状態から分離
されたもの〉に半導体素子１が接着されており、内部リ
ード５ａの先端から２００〜３００μｍの位置に深さ３
０〜５０μｍ、巾３０Ｃ）−５００μｍの凹部８がハー
フエッチ−ングにより形成されている。半導体素子１上
の電極パッドと内部リード５ａの凹部８との間はボンデ
ィングワイヤー３によりそれぞれ接続されており、外部
リード５ｂを除く全体は樹脂４（点線で示す）により気
密封止されている。
このような構成にすることにより、ＶＰＳや赤外線リフ
ローによる自動実装時にパッケージ全体が加熱されて樹
脂４がパッケージ外側に向って膨張し応力が生じても、
凹部８により樹脂のハガレによるズレが抑制され、また
ワイヤーの最も弱いリード側ネック部分にかかる応力も
分散・緩和される為にワイヤーのクラックを防止するこ
とができる。
第４図は本発明の他の実施例による内部リード５ａ先端
部を示す６本実施例では、内部リード５ａの先端部にハ
ーフエツチングで凹部を設けるかわりに、デイプレス加
工９をほどこして凹部を形成した。この実施例では凹部
をリードフレーム加工工程で形成できるため量産性がよ
く、また凹部の深さをリードフレーム厚以上に大きくで
きるという利点がある。
〔発明の効果〕
以上説明したように本発明は、内部リードの先端部に凹
部を設け、その凹部にボンディングをほどこすことによ
り、樹脂封止後の実装時の熱ストレスが加わっても、こ
の凹部によりワイヤーに直接かかる応力が緩和され、ま
た樹脂と内部リードの密着がよくなる為に樹脂の移動も
抑制され、ワイヤーのクラックを防止することができ、
従って自動実装時の半導体装置の信頼性を著しく向上さ
せる効果がある。
【図面の簡単な説明】
第１図は本発明の樹脂封止型半導体装置の一実施例の樹
脂を除いた状態の平面図、第２図は第１図のＡ−Ａ’線
断面図、第３図は第２図の一部拡大断面図、第４図は本
発明の他の実施例によるリード先端部分の拡大断面図、
第５図は従来の半導体装置の断面図、第６図は第５図の
部分拡大断面図である。 １・・・半導体素子、２・・・アイランド部、３・・・
ボンディングワイヤー　４・・・樹脂、５・・・リード
、６・・・クラック、７・・・メツキ層、８・・・リー
ドの凹部、９・・・デイプレス。

Claims (1)

    【特許請求の範囲】
  1. 樹脂に封止される内部リードの先端部に凹部を設け、ボ
    ンディングワイヤの前記リードへのボンディングが前記
    凹部において行なわれていることを特徴とする樹脂封止
    型半導体装置。
JP1218979A 1989-08-24 1989-08-24 樹脂封止型半導体装置 Pending JPH0382067A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1218979A JPH0382067A (ja) 1989-08-24 1989-08-24 樹脂封止型半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1218979A JPH0382067A (ja) 1989-08-24 1989-08-24 樹脂封止型半導体装置

Publications (1)

Publication Number Publication Date
JPH0382067A true JPH0382067A (ja) 1991-04-08

Family

ID=16728365

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1218979A Pending JPH0382067A (ja) 1989-08-24 1989-08-24 樹脂封止型半導体装置

Country Status (1)

Country Link
JP (1) JPH0382067A (ja)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06334082A (ja) * 1993-05-25 1994-12-02 Rohm Co Ltd ボンディングパッド面の圧印加工方法
JP2006056582A (ja) * 2004-08-23 2006-03-02 Hokuto Kagaku Kogyo Kk 不透水性吸収シート及び生鮮食品保冷方法

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06334082A (ja) * 1993-05-25 1994-12-02 Rohm Co Ltd ボンディングパッド面の圧印加工方法
JP2006056582A (ja) * 2004-08-23 2006-03-02 Hokuto Kagaku Kogyo Kk 不透水性吸収シート及び生鮮食品保冷方法

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