JPS6180844A - 半導体リ−ドフレ−ム用条材 - Google Patents

半導体リ−ドフレ−ム用条材

Info

Publication number
JPS6180844A
JPS6180844A JP59201469A JP20146984A JPS6180844A JP S6180844 A JPS6180844 A JP S6180844A JP 59201469 A JP59201469 A JP 59201469A JP 20146984 A JP20146984 A JP 20146984A JP S6180844 A JPS6180844 A JP S6180844A
Authority
JP
Japan
Prior art keywords
surface layer
lead frame
strength
oxygen
plating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP59201469A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0160948B2 (enExample
Inventor
Shoji Shiga
志賀　章二
Toru Tanigawa
徹 谷川
Hiroki Suzuki
鈴木　比呂輝
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Furukawa Electric Co Ltd
Original Assignee
Furukawa Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Furukawa Electric Co Ltd filed Critical Furukawa Electric Co Ltd
Priority to JP59201469A priority Critical patent/JPS6180844A/ja
Publication of JPS6180844A publication Critical patent/JPS6180844A/ja
Publication of JPH0160948B2 publication Critical patent/JPH0160948B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H10W70/457—
    • H10W72/07551—
    • H10W72/50—
    • H10W72/536—
    • H10W72/5363—
    • H10W72/884—
    • H10W74/00—
    • H10W90/736—
    • H10W90/756—

Landscapes

  • Lead Frames For Integrated Circuits (AREA)
JP59201469A 1984-09-28 1984-09-28 半導体リ−ドフレ−ム用条材 Granted JPS6180844A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP59201469A JPS6180844A (ja) 1984-09-28 1984-09-28 半導体リ−ドフレ−ム用条材

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP59201469A JPS6180844A (ja) 1984-09-28 1984-09-28 半導体リ−ドフレ−ム用条材

Publications (2)

Publication Number Publication Date
JPS6180844A true JPS6180844A (ja) 1986-04-24
JPH0160948B2 JPH0160948B2 (enExample) 1989-12-26

Family

ID=16441598

Family Applications (1)

Application Number Title Priority Date Filing Date
JP59201469A Granted JPS6180844A (ja) 1984-09-28 1984-09-28 半導体リ−ドフレ−ム用条材

Country Status (1)

Country Link
JP (1) JPS6180844A (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6117566A (en) * 1997-02-03 2000-09-12 Nippon Denkai, Ltd. Lead frame material

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS52149973A (en) * 1976-06-09 1977-12-13 Hitachi Ltd External lead of electronic parts
JPS53141577A (en) * 1977-05-17 1978-12-09 Mitsubishi Electric Corp Lead frame for integrated circuit
JPS57122554A (en) * 1981-01-22 1982-07-30 Toshiba Corp Lead frame for semiconductor device
JPS5867053A (ja) * 1981-10-19 1983-04-21 Toshiba Corp リ−ドフレ−ム
JPS58169947A (ja) * 1982-02-08 1983-10-06 Nippon Gakki Seizo Kk 半導体用リ−ドフレ−ム及びその製法
JPS58191456A (ja) * 1982-04-30 1983-11-08 Nippon Gakki Seizo Kk 半導体用リ−ドフレ−ム及びその製法
JPS5958833A (ja) * 1982-09-28 1984-04-04 Shinkawa Ltd 半導体装置
JPS60183758A (ja) * 1984-03-02 1985-09-19 Nec Corp リ−ドフレ−ム

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS52149973A (en) * 1976-06-09 1977-12-13 Hitachi Ltd External lead of electronic parts
JPS53141577A (en) * 1977-05-17 1978-12-09 Mitsubishi Electric Corp Lead frame for integrated circuit
JPS57122554A (en) * 1981-01-22 1982-07-30 Toshiba Corp Lead frame for semiconductor device
JPS5867053A (ja) * 1981-10-19 1983-04-21 Toshiba Corp リ−ドフレ−ム
JPS58169947A (ja) * 1982-02-08 1983-10-06 Nippon Gakki Seizo Kk 半導体用リ−ドフレ−ム及びその製法
JPS58191456A (ja) * 1982-04-30 1983-11-08 Nippon Gakki Seizo Kk 半導体用リ−ドフレ−ム及びその製法
JPS5958833A (ja) * 1982-09-28 1984-04-04 Shinkawa Ltd 半導体装置
JPS60183758A (ja) * 1984-03-02 1985-09-19 Nec Corp リ−ドフレ−ム

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6117566A (en) * 1997-02-03 2000-09-12 Nippon Denkai, Ltd. Lead frame material

Also Published As

Publication number Publication date
JPH0160948B2 (enExample) 1989-12-26

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