JPS6152237B2 - - Google Patents
Info
- Publication number
- JPS6152237B2 JPS6152237B2 JP9336384A JP9336384A JPS6152237B2 JP S6152237 B2 JPS6152237 B2 JP S6152237B2 JP 9336384 A JP9336384 A JP 9336384A JP 9336384 A JP9336384 A JP 9336384A JP S6152237 B2 JPS6152237 B2 JP S6152237B2
- Authority
- JP
- Japan
- Prior art keywords
- masking tape
- plating
- treatment
- parts
- pressure
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0073—Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/24—Reinforcing of the conductive pattern
- H05K3/241—Reinforcing of the conductive pattern characterised by the electroplating method; means therefor, e.g. baths or apparatus
Landscapes
- Electroplating Methods And Accessories (AREA)
- Coating With Molten Metal (AREA)
- Physical Vapour Deposition (AREA)
- Chemical Vapour Deposition (AREA)
- ing And Chemical Polishing (AREA)
- Chemically Coating (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9336384A JPS60238497A (ja) | 1984-05-09 | 1984-05-09 | 部分メツキなどの部分処理方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9336384A JPS60238497A (ja) | 1984-05-09 | 1984-05-09 | 部分メツキなどの部分処理方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS60238497A JPS60238497A (ja) | 1985-11-27 |
| JPS6152237B2 true JPS6152237B2 (ref) | 1986-11-12 |
Family
ID=14080204
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9336384A Granted JPS60238497A (ja) | 1984-05-09 | 1984-05-09 | 部分メツキなどの部分処理方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS60238497A (ref) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2019188996A1 (ja) | 2018-03-30 | 2019-10-03 | 日本ゼオン株式会社 | 中空樹脂粒子及びシート |
Families Citing this family (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4601776B2 (ja) * | 2000-07-17 | 2010-12-22 | 大日本印刷株式会社 | 短冊状リードフレームの搬送方法 |
| JP4155315B2 (ja) * | 2006-06-28 | 2008-09-24 | オムロン株式会社 | 金属膜の製造方法、下地組成物、金属膜およびその利用 |
| JP4321653B2 (ja) | 2007-12-27 | 2009-08-26 | オムロン株式会社 | 金属膜の製造方法 |
| JP4321652B2 (ja) | 2007-12-27 | 2009-08-26 | オムロン株式会社 | 金属膜の製造方法 |
| JP4458188B2 (ja) | 2008-09-26 | 2010-04-28 | オムロン株式会社 | ハーフミラーおよびその製造方法 |
| JP4853596B1 (ja) | 2011-03-15 | 2012-01-11 | オムロン株式会社 | 酸化金属膜を備えたセンサおよびその利用 |
| EP3205751B1 (en) * | 2014-10-06 | 2024-08-28 | Nitto Denko Corporation | Masking sheet for anodizing |
| EP3562902A2 (en) * | 2016-12-30 | 2019-11-06 | 3M Innovative Properties Company | Tapes and methods of use for masking aluminum surfaces in chromic acid anodization |
-
1984
- 1984-05-09 JP JP9336384A patent/JPS60238497A/ja active Granted
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2019188996A1 (ja) | 2018-03-30 | 2019-10-03 | 日本ゼオン株式会社 | 中空樹脂粒子及びシート |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS60238497A (ja) | 1985-11-27 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| EP0157508B1 (en) | Thin adhesive sheet for use in working semiconductor wafers | |
| US5637395A (en) | Thin adhesive sheet for working semiconductor wafers | |
| DE60119955T2 (de) | Durch strahlung härtbare, thermisch ablösbare, druckempfindliche klebefolie sowie verfahren zur herstellung geschnittener teile unter verwendung dieser klebefolie | |
| US20100294423A1 (en) | Protective film for laser processing and processing method using the same | |
| JPS60223139A (ja) | 半導体ウエハ固定用接着薄板 | |
| JP5953337B2 (ja) | マスキングテープ及びウエハの表面処理方法 | |
| JPS6152237B2 (ref) | ||
| KR19990022993A (ko) | 내식막의 제거방법, 및 이에 사용되는 접착제 또는 접착 시트 | |
| JPS62153376A (ja) | ウェハダイシング用粘着シート | |
| JPH0578629A (ja) | 放射線硬化性粘着テープ | |
| KR20020063818A (ko) | 레지스트 제거를 위한 접착 테이프 및 방법 | |
| JP2003342540A (ja) | 半導体加工用粘着シート | |
| JPH01251737A (ja) | 半導体ウェハ固定用粘着シート | |
| JPS60189938A (ja) | 半導体ウエハの保護方法 | |
| JPH08139067A (ja) | 半導体ウエハに付着した異物の除去用粘着テ―プと除去方法 | |
| JPS6259684A (ja) | 接着フイルム | |
| JPH01289132A (ja) | 印刷配線に重合体材料を貼着する方法および装置 | |
| JPS60201647A (ja) | 半導体ウエハの固定方法 | |
| JPH0472386B2 (ref) | ||
| JPS60201646A (ja) | 半導体ウエハの固定方法 | |
| JP7705934B2 (ja) | 電子装置の製造方法 | |
| JPH05179206A (ja) | 光硬化型粘着シ―ト類の接着剥離方法 | |
| JPH0582868B2 (ref) | ||
| JPH0472387B2 (ref) | ||
| JPS6197848A (ja) | 半導体チツプの製造法 |