JPS614451U - 光学結合素子 - Google Patents

光学結合素子

Info

Publication number
JPS614451U
JPS614451U JP1985067004U JP6700485U JPS614451U JP S614451 U JPS614451 U JP S614451U JP 1985067004 U JP1985067004 U JP 1985067004U JP 6700485 U JP6700485 U JP 6700485U JP S614451 U JPS614451 U JP S614451U
Authority
JP
Japan
Prior art keywords
lid
lens
support
coupling element
optical coupling
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1985067004U
Other languages
English (en)
Other versions
JPS6144458Y2 (ja
Inventor
ヘンドリカス・ゲラルダス・コツク
Original Assignee
エヌ・ベ−・フイリツプス・フル−イランペンフアブリケン
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by エヌ・ベ−・フイリツプス・フル−イランペンフアブリケン filed Critical エヌ・ベ−・フイリツプス・フル−イランペンフアブリケン
Publication of JPS614451U publication Critical patent/JPS614451U/ja
Application granted granted Critical
Publication of JPS6144458Y2 publication Critical patent/JPS6144458Y2/ja
Granted legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4248—Feed-through connections for the hermetical passage of fibres through a package wall
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4204—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/0225—Out-coupling of light
    • H01S5/02251—Out-coupling of light using optical fibres
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/855—Optical field-shaping means, e.g. lenses

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Optical Couplings Of Light Guides (AREA)
  • Led Device Packages (AREA)
  • Semiconductor Lasers (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。

Description

【図面の簡単な説明】
図は本考案の光学素子の断面図である。 −２０・・・・・・結合声子、３１・・・・・・支持体
、３３・・・・・・ブッシング状の蓋体、３５・・・・
・・光源（発光ダイオード、半導体レーザダイオード）
、３９・・・・・・レンズ、４１・・・・・・ハウジン
グ、５３・・・・・・冷却部材、４７，４−”９ａ，４
９ｂ・・・・・・接続導線、５７・・・・・・ガラス貫
通部材、５９・・・・・・可塑性金属ハンダ層、６１・
・・・・・フランジ、３７・・・・・・環状ホルダ、３
９ａ・・・・・・カラス板、３９ｂ・・・・・・凸レン
ズ、４０・・・・・・スペース、４３・・・・・・光学
ファイバ用支持体、４５・・・・・・光学ファイバ、４
５ｂ・・・・・・光学ファイバの端部、５１・・・・・
・感光半導体ダイオード、５５・・・・・・放熱部材、
：６３・・・・・・中心孔、６５・・・・・・入口孔、
６７・・・・・・（硬化）接着剤、６９・・・・・・頚
部、７１・・・・・・保護外被。

Claims (1)

  1. 【実用新案登録請求の範囲】 １ 支持体と、この支持体に取付けられた蓋体と、この
    蓋体の麹側で前記支持体上に取付けられ、動作時に光ビ
    ームを放射する光源とミこの光源と対向する位置に該光
    源から放射される光ビームの通路内において前記蓋体に
    取付けられたレンズとを有する光学結合素子において、
    蓋体はフランジを有し、レンズは０．１ｍｍから２ｍｍ
    の間の厚さの可塑性金属ハンダ層によって前記のフラン
    ジで蓋体に固着され、前記の支持体、蓋体およびレンズ
    が光源を気密封止するスペースを形成し、前記の蓋体は
    ブツシング状で金属接合によって支持体に固着され、前
    記のレンズーは、環状金属ホルダと該ホルダに取付けら
    れたレンズとより成る組立体であり、前記の環状金属ホ
    ルダは、可塑性金属ハンダ層によって前記の蓋体のフラ
    ンジに固着されたフランジを有することを特徴とする光
    学結合素子。 ２ 環状金属ホルダは、レンズを取付ける環状突出部を
    有し、この突出部とレンズとは蓋体のフランジと支持体
    との間に位置子る特許請求の範囲第１項記載の光学結合
    素子。 ３ 可塑性金属ハンダ層はインジウムを有する特許請求
    の範囲第１項記載の光学結合素子。 ４ 可塑性金属ハンダ層はインジウムまたは鉛の合金を
    有する特許請求の範囲第１項記載の光学結合素子。
JP1985067004U 1979-05-31 1985-05-08 光学結合素子 Granted JPS614451U (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
NL7904283A NL7904283A (nl) 1979-05-31 1979-05-31 Koppelelement met een lichtbron en en lensvormig element.
NL7904283 1979-05-31

Publications (2)

Publication Number Publication Date
JPS614451U true JPS614451U (ja) 1986-01-11
JPS6144458Y2 JPS6144458Y2 (ja) 1986-12-15

Family

ID=19833275

Family Applications (3)

Application Number Title Priority Date Filing Date
JP7364980A Pending JPS55162286A (en) 1979-05-31 1980-05-31 Coupling element
JP1985067003U Granted JPS614450U (ja) 1979-05-31 1985-05-08 光学結合素子
JP1985067004U Granted JPS614451U (ja) 1979-05-31 1985-05-08 光学結合素子

Family Applications Before (2)

Application Number Title Priority Date Filing Date
JP7364980A Pending JPS55162286A (en) 1979-05-31 1980-05-31 Coupling element
JP1985067003U Granted JPS614450U (ja) 1979-05-31 1985-05-08 光学結合素子

Country Status (6)

Country Link
US (1) US4355323A (ja)
EP (1) EP0021473B1 (ja)
JP (3) JPS55162286A (ja)
CA (1) CA1143462A (ja)
DE (1) DE3061601D1 (ja)
NL (1) NL7904283A (ja)

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* Cited by examiner, † Cited by third party
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JPH03216250A (ja) * 1990-01-22 1991-09-24 Kawasaki Steel Corp ビームブランク用連続鋳造装置
JP2011066394A (ja) * 2009-08-18 2011-03-31 Mitsubishi Electric Corp 光源装置、及び光源装置の製造方法

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FR2526176A1 (fr) * 1982-04-29 1983-11-04 Thomson Csf Procede d'assemblage d'un dispositif optique contenant un laser semi-conducteur, dispositif et banc de montage de mise en oeuvre
FR2536867B1 (fr) * 1982-11-30 1986-02-07 Thomson Csf Procede d'alignement d'un dispositif optoelectronique
JPS6043889A (ja) * 1983-08-22 1985-03-08 Hitachi Ltd 光ファイバー付レーザーダイオード装置の組立方法
CA1243105A (en) * 1984-07-09 1988-10-11 Giok D. Khoe Electro-optical device comprising a laser diode, an input transmission fibre and an output transmission fibre
FR2571154B1 (fr) * 1984-09-28 1987-01-23 Radiotechnique Compelec Procede de fabrication d'un composant d'extremite pour fibre optique, et composant ainsi obtenu
NL8403535A (nl) * 1984-11-21 1986-06-16 Philips Nv Inrichting voor het optisch koppelen van een stralingsbron aan een optische transmissievezel.
US4720602A (en) * 1986-09-08 1988-01-19 Mobil Oil Corporation Process for converting C2 to C12 aliphatics to aromatics over a zinc-activated zeolite
FR2607626B1 (fr) * 1986-11-28 1989-02-03 Radiotechnique Compelec Embase comportant un micro-composant opto-electronique
US5177806A (en) * 1986-12-05 1993-01-05 E. I. Du Pont De Nemours And Company Optical fiber feedthrough
GB8708034D0 (en) * 1987-04-03 1987-05-07 British Telecomm Optical fibre device fabrication
US5222170A (en) * 1987-04-03 1993-06-22 Bt&D Technologies Ltd. Optical fiber device fabrication
US4865410A (en) * 1988-01-25 1989-09-12 E. I. Du Pont De Nemours And Company Decoupled fiber optic feedthrough assembly
US4854659A (en) * 1988-05-31 1989-08-08 Bt&D Technologies, Ltd. Optical devices
NL8801443A (nl) * 1988-06-06 1990-01-02 Koninkl Philips Electronics Nv Opto-elektrische inrichting met een koppeling tussen een optische transmissievezel en een halfgeleiderlaserdiode.
EP0348714B1 (de) * 1988-07-01 1993-09-01 Siemens Aktiengesellschaft Vorrichtung zum Justieren und Fixieren einer Kugellinse sowie Verfahren zum Betrieb der Vorrichtung
JPH02139984A (ja) * 1988-11-18 1990-05-29 Mitsubishi Electric Corp 半導体レーザ装置及びその製造方法
GB2229856B (en) * 1989-03-31 1993-04-21 Stc Plc Electro-optic transducer assembly
US5255333A (en) * 1989-08-09 1993-10-19 Siemens Aktiengesellschaft Opto-electronic transducer arrangement having a lens-type optical coupling
NL9000027A (nl) * 1990-01-05 1991-08-01 Philips Nv Opto-elektronische inrichting met een, een lens omvattende koppeling tussen een optische transmissievezel en een halfgeleiderlaserdiode.
EP0454174B1 (en) * 1990-04-27 1997-03-05 Omron Corporation Light emitting semiconductor device with Fresnel lens
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DE4136690C2 (de) * 1991-11-07 1996-01-18 Siemens Ag Anordnung zum optischen Anschluß von optischen Sende/-Empfangselementen jeweils an Lichtwellenleiter und Verfahren zu seiner Herstellung
CA2117003A1 (en) * 1993-04-13 1994-10-14 Dana Craig Bookbinder Method of encapsulating optical components and products produced by that method
US5692085A (en) * 1994-08-23 1997-11-25 U.S. Philips Corporation Method of assembling a radiation source unit for supplying short-wave optical radiation
US6198580B1 (en) 1998-08-17 2001-03-06 Newport Corporation Gimballed optical mount
US6516130B1 (en) 1998-12-30 2003-02-04 Newport Corporation Clip that aligns a fiber optic cable with a laser diode within a fiber optic module
FR2790115B1 (fr) 1999-02-23 2001-05-04 Micro Controle Procede et dispositif pour deplacer un mobile sur une base montee elastiquement par rapport au sol
US6996506B2 (en) 1999-02-23 2006-02-07 Newport Corporation Process and device for displacing a moveable unit on a base
US6213651B1 (en) 1999-05-26 2001-04-10 E20 Communications, Inc. Method and apparatus for vertical board construction of fiber optic transmitters, receivers and transceivers
US6901221B1 (en) 1999-05-27 2005-05-31 Jds Uniphase Corporation Method and apparatus for improved optical elements for vertical PCB fiber optic modules
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US6655840B2 (en) 2001-02-13 2003-12-02 Newport Corporation Stiff cross roller bearing configuration
US6601524B2 (en) 2001-03-28 2003-08-05 Newport Corporation Translation table with a spring biased dovetail bearing
JP2002305346A (ja) * 2001-04-05 2002-10-18 Hamamatsu Photonics Kk 半導体レーザ装置及びその製造方法
US6791058B2 (en) 2001-04-25 2004-09-14 Newport Corporation Automatic laser weld machine for assembling photonic components
US6568666B2 (en) 2001-06-13 2003-05-27 Newport Corporation Method for providing high vertical damping to pneumatic isolators during large amplitude disturbances of isolated payload
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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03216250A (ja) * 1990-01-22 1991-09-24 Kawasaki Steel Corp ビームブランク用連続鋳造装置
JP2011066394A (ja) * 2009-08-18 2011-03-31 Mitsubishi Electric Corp 光源装置、及び光源装置の製造方法
JP2014187407A (ja) * 2009-08-18 2014-10-02 Mitsubishi Electric Corp 光源装置、及び光源装置の製造方法

Also Published As

Publication number Publication date
JPS6144457Y2 (ja) 1986-12-15
EP0021473A1 (en) 1981-01-07
JPS614450U (ja) 1986-01-11
JPS55162286A (en) 1980-12-17
JPS6144458Y2 (ja) 1986-12-15
DE3061601D1 (en) 1983-02-17
EP0021473B1 (en) 1983-01-12
CA1143462A (en) 1983-03-22
US4355323A (en) 1982-10-19
NL7904283A (nl) 1980-12-02

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