JPS6140811A - 溶融用水和シリカおよびこれを用いた溶融シリカの製造方法 - Google Patents

溶融用水和シリカおよびこれを用いた溶融シリカの製造方法

Info

Publication number
JPS6140811A
JPS6140811A JP15913384A JP15913384A JPS6140811A JP S6140811 A JPS6140811 A JP S6140811A JP 15913384 A JP15913384 A JP 15913384A JP 15913384 A JP15913384 A JP 15913384A JP S6140811 A JPS6140811 A JP S6140811A
Authority
JP
Japan
Prior art keywords
silica
melting
hydrated
silica gel
hydrated silica
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP15913384A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0127003B2 (enExample
Inventor
Toshihiko Morishita
森下　敏彦
Hitoshi Koshimizu
興水　仁
Kazuyoshi Torii
鳥井　一義
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nippon Chemical Industrial Co Ltd
Original Assignee
Nippon Chemical Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Chemical Industrial Co Ltd filed Critical Nippon Chemical Industrial Co Ltd
Priority to JP15913384A priority Critical patent/JPS6140811A/ja
Publication of JPS6140811A publication Critical patent/JPS6140811A/ja
Publication of JPH0127003B2 publication Critical patent/JPH0127003B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Silicon Compounds (AREA)
JP15913384A 1984-07-31 1984-07-31 溶融用水和シリカおよびこれを用いた溶融シリカの製造方法 Granted JPS6140811A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP15913384A JPS6140811A (ja) 1984-07-31 1984-07-31 溶融用水和シリカおよびこれを用いた溶融シリカの製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP15913384A JPS6140811A (ja) 1984-07-31 1984-07-31 溶融用水和シリカおよびこれを用いた溶融シリカの製造方法

Publications (2)

Publication Number Publication Date
JPS6140811A true JPS6140811A (ja) 1986-02-27
JPH0127003B2 JPH0127003B2 (enExample) 1989-05-26

Family

ID=15686966

Family Applications (1)

Application Number Title Priority Date Filing Date
JP15913384A Granted JPS6140811A (ja) 1984-07-31 1984-07-31 溶融用水和シリカおよびこれを用いた溶融シリカの製造方法

Country Status (1)

Country Link
JP (1) JPS6140811A (enExample)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01230422A (ja) * 1988-03-10 1989-09-13 Nippon Chem Ind Co Ltd 高純度シリカ及びその製造方法
US7265167B2 (en) 2002-11-12 2007-09-04 Nitto Denko Corporation Epoxy resin composition for semiconductor encapsulation, and semiconductor device using the same
JP2012142439A (ja) * 2010-12-28 2012-07-26 Jgc Catalysts & Chemicals Ltd 半導体装置実装用ペ−スト
JP2014141382A (ja) * 2013-01-25 2014-08-07 Nikon Corp シリカ粒子分散液の製造方法およびシリカ粒子分散液を用いた研磨方法

Citations (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5125235A (enExample) * 1974-08-23 1976-03-01 Ichikoh Industries Ltd
JPS54141569A (en) * 1978-04-26 1979-11-02 Toshiba Corp Semiconductor device
JPS554952A (en) * 1978-06-28 1980-01-14 Toshiba Corp Semiconductor device
JPS5610947A (en) * 1979-07-10 1981-02-03 Toshiba Corp Semiconductor sealing resin composition
JPS5659837A (en) * 1979-09-28 1981-05-23 Hitachi Chem Co Ltd Epoxy resin composition
JPS5693749A (en) * 1979-12-27 1981-07-29 Hitachi Chem Co Ltd Epoxy resin composition
JPS56116647A (en) * 1980-02-20 1981-09-12 Hitachi Ltd Manufacturing of silica-alumina type filler for semiconductor memory element covering resin
JPS57195151A (en) * 1981-05-27 1982-11-30 Denki Kagaku Kogyo Kk Low-radioactive resin composition
JPS57212224A (en) * 1981-06-24 1982-12-27 Nitto Electric Ind Co Ltd Epoxy resin composition for encapsulation of semiconductor
JPS58145613A (ja) * 1982-02-15 1983-08-30 Denki Kagaku Kogyo Kk 溶融シリカ球状体、その製造法およびその装置
JPS5954632A (ja) * 1982-09-21 1984-03-29 Mitsubishi Metal Corp 石英ガラス粉末の製造法
JPS5955722A (ja) * 1982-09-27 1984-03-30 Nichias Corp 弗素樹脂製隔膜の製造法
JPS59107937A (ja) * 1982-12-10 1984-06-22 Seiko Epson Corp 石英ガラスの製造法

Patent Citations (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5125235A (enExample) * 1974-08-23 1976-03-01 Ichikoh Industries Ltd
JPS54141569A (en) * 1978-04-26 1979-11-02 Toshiba Corp Semiconductor device
JPS554952A (en) * 1978-06-28 1980-01-14 Toshiba Corp Semiconductor device
JPS5610947A (en) * 1979-07-10 1981-02-03 Toshiba Corp Semiconductor sealing resin composition
JPS5659837A (en) * 1979-09-28 1981-05-23 Hitachi Chem Co Ltd Epoxy resin composition
JPS5693749A (en) * 1979-12-27 1981-07-29 Hitachi Chem Co Ltd Epoxy resin composition
JPS56116647A (en) * 1980-02-20 1981-09-12 Hitachi Ltd Manufacturing of silica-alumina type filler for semiconductor memory element covering resin
JPS57195151A (en) * 1981-05-27 1982-11-30 Denki Kagaku Kogyo Kk Low-radioactive resin composition
JPS57212224A (en) * 1981-06-24 1982-12-27 Nitto Electric Ind Co Ltd Epoxy resin composition for encapsulation of semiconductor
JPS58145613A (ja) * 1982-02-15 1983-08-30 Denki Kagaku Kogyo Kk 溶融シリカ球状体、その製造法およびその装置
JPS5954632A (ja) * 1982-09-21 1984-03-29 Mitsubishi Metal Corp 石英ガラス粉末の製造法
JPS5955722A (ja) * 1982-09-27 1984-03-30 Nichias Corp 弗素樹脂製隔膜の製造法
JPS59107937A (ja) * 1982-12-10 1984-06-22 Seiko Epson Corp 石英ガラスの製造法

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01230422A (ja) * 1988-03-10 1989-09-13 Nippon Chem Ind Co Ltd 高純度シリカ及びその製造方法
US7265167B2 (en) 2002-11-12 2007-09-04 Nitto Denko Corporation Epoxy resin composition for semiconductor encapsulation, and semiconductor device using the same
JP2012142439A (ja) * 2010-12-28 2012-07-26 Jgc Catalysts & Chemicals Ltd 半導体装置実装用ペ−スト
JP2014141382A (ja) * 2013-01-25 2014-08-07 Nikon Corp シリカ粒子分散液の製造方法およびシリカ粒子分散液を用いた研磨方法

Also Published As

Publication number Publication date
JPH0127003B2 (enExample) 1989-05-26

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