JPS6127681A - 超格子構造のチヤネル部をもつ電界効果トランジスタ - Google Patents
超格子構造のチヤネル部をもつ電界効果トランジスタInfo
- Publication number
- JPS6127681A JPS6127681A JP14795784A JP14795784A JPS6127681A JP S6127681 A JPS6127681 A JP S6127681A JP 14795784 A JP14795784 A JP 14795784A JP 14795784 A JP14795784 A JP 14795784A JP S6127681 A JPS6127681 A JP S6127681A
- Authority
- JP
- Japan
- Prior art keywords
- superlattice structure
- field effect
- effect transistor
- layer
- channel part
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D30/00—Field-effect transistors [FET]
- H10D30/60—Insulated-gate field-effect transistors [IGFET]
- H10D30/751—Insulated-gate field-effect transistors [IGFET] having composition variations in the channel regions
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D30/00—Field-effect transistors [FET]
- H10D30/60—Insulated-gate field-effect transistors [IGFET]
- H10D30/67—Thin-film transistors [TFT]
- H10D30/674—Thin-film transistors [TFT] characterised by the active materials
- H10D30/6741—Group IV materials, e.g. germanium or silicon carbide
- H10D30/6748—Group IV materials, e.g. germanium or silicon carbide having a multilayer structure or superlattice structure
Landscapes
- Junction Field-Effect Transistors (AREA)
- Recrystallisation Techniques (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP14795784A JPS6127681A (ja) | 1984-07-17 | 1984-07-17 | 超格子構造のチヤネル部をもつ電界効果トランジスタ |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP14795784A JPS6127681A (ja) | 1984-07-17 | 1984-07-17 | 超格子構造のチヤネル部をもつ電界効果トランジスタ |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS6127681A true JPS6127681A (ja) | 1986-02-07 |
JPH0224025B2 JPH0224025B2 (enrdf_load_stackoverflow) | 1990-05-28 |
Family
ID=15441903
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP14795784A Granted JPS6127681A (ja) | 1984-07-17 | 1984-07-17 | 超格子構造のチヤネル部をもつ電界効果トランジスタ |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6127681A (enrdf_load_stackoverflow) |
Cited By (46)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS61230374A (ja) * | 1985-04-05 | 1986-10-14 | Seiko Epson Corp | 電界効果型トランジスタ及びその製造方法 |
JPS62279672A (ja) * | 1986-05-28 | 1987-12-04 | Kanegafuchi Chem Ind Co Ltd | 半導体装置 |
JPS6394682A (ja) * | 1986-10-08 | 1988-04-25 | Semiconductor Energy Lab Co Ltd | 絶縁ゲイト型電界効果半導体装置 |
JPS6394681A (ja) * | 1986-10-08 | 1988-04-25 | Semiconductor Energy Lab Co Ltd | 絶縁ゲイト型電界効果半導体装置の作製方法 |
JPS6394680A (ja) * | 1986-10-08 | 1988-04-25 | Semiconductor Energy Lab Co Ltd | 絶縁ゲイト型電界効果半導体装置 |
US4806998A (en) * | 1986-06-30 | 1989-02-21 | Thomson-Csf | Heterojunction and dual channel semiconductor field effect transistor or negative transconductive device |
US4908678A (en) * | 1986-10-08 | 1990-03-13 | Semiconductor Energy Laboratory Co., Ltd. | FET with a super lattice channel |
US5051786A (en) * | 1989-10-24 | 1991-09-24 | Mcnc | Passivated polycrystalline semiconductors quantum well/superlattice structures fabricated thereof |
EP0694756A2 (en) | 1994-07-27 | 1996-01-31 | Shimadzu Corporation | Elongation measurement using a laser non-contact extensometer |
WO2002001641A1 (en) * | 2000-06-27 | 2002-01-03 | Matsushita Electric Industrial Co., Ltd. | Semiconductor device |
WO2002043157A1 (en) * | 2000-11-21 | 2002-05-30 | Matsushita Electric Industrial Co.,Ltd. | Semiconductor device and its manufacturing method |
US6460418B1 (en) | 2000-01-19 | 2002-10-08 | Kishimoto Sangyo Co., Ltd. | Method of and apparatus for measuring elongation of a test specimen |
WO2005018005A1 (en) * | 2003-06-26 | 2005-02-24 | Rj Mears, Llc | Semiconductor device including mosfet having band-engineered superlattice |
WO2005018004A1 (en) * | 2003-06-26 | 2005-02-24 | Rj Mears, Llc | Method for making semiconductor device including band-engineered superlattice |
WO2005034245A1 (en) * | 2003-06-26 | 2005-04-14 | Rj Mears, Llc | Semiconductor device including band-engineered superlattice |
US6993222B2 (en) | 1999-03-03 | 2006-01-31 | Rj Mears, Llc | Optical filter device with aperiodically arranged grating elements |
US7045813B2 (en) | 2003-06-26 | 2006-05-16 | Rj Mears, Llc | Semiconductor device including a superlattice with regions defining a semiconductor junction |
US7045377B2 (en) | 2003-06-26 | 2006-05-16 | Rj Mears, Llc | Method for making a semiconductor device including a superlattice and adjacent semiconductor layer with doped regions defining a semiconductor junction |
US7123792B1 (en) | 1999-03-05 | 2006-10-17 | Rj Mears, Llc | Configurable aperiodic grating device |
US7227174B2 (en) | 2003-06-26 | 2007-06-05 | Rj Mears, Llc | Semiconductor device including a superlattice and adjacent semiconductor layer with doped regions defining a semiconductor junction |
US7229902B2 (en) | 2003-06-26 | 2007-06-12 | Rj Mears, Llc | Method for making a semiconductor device including a superlattice with regions defining a semiconductor junction |
US7446002B2 (en) | 2003-06-26 | 2008-11-04 | Mears Technologies, Inc. | Method for making a semiconductor device comprising a superlattice dielectric interface layer |
US7491587B2 (en) | 2003-06-26 | 2009-02-17 | Mears Technologies, Inc. | Method for making a semiconductor device having a semiconductor-on-insulator (SOI) configuration and including a superlattice on a thin semiconductor layer |
US7514328B2 (en) | 2003-06-26 | 2009-04-07 | Mears Technologies, Inc. | Method for making a semiconductor device including shallow trench isolation (STI) regions with a superlattice therebetween |
US7517702B2 (en) | 2005-12-22 | 2009-04-14 | Mears Technologies, Inc. | Method for making an electronic device including a poled superlattice having a net electrical dipole moment |
US7531850B2 (en) | 2003-06-26 | 2009-05-12 | Mears Technologies, Inc. | Semiconductor device including a memory cell with a negative differential resistance (NDR) device |
US7531828B2 (en) | 2003-06-26 | 2009-05-12 | Mears Technologies, Inc. | Semiconductor device including a strained superlattice between at least one pair of spaced apart stress regions |
US7531829B2 (en) | 2003-06-26 | 2009-05-12 | Mears Technologies, Inc. | Semiconductor device including regions of band-engineered semiconductor superlattice to reduce device-on resistance |
US7535041B2 (en) | 2003-06-26 | 2009-05-19 | Mears Technologies, Inc. | Method for making a semiconductor device including regions of band-engineered semiconductor superlattice to reduce device-on resistance |
US7586165B2 (en) | 2003-06-26 | 2009-09-08 | Mears Technologies, Inc. | Microelectromechanical systems (MEMS) device including a superlattice |
US7586116B2 (en) | 2003-06-26 | 2009-09-08 | Mears Technologies, Inc. | Semiconductor device having a semiconductor-on-insulator configuration and a superlattice |
US7598515B2 (en) | 2003-06-26 | 2009-10-06 | Mears Technologies, Inc. | Semiconductor device including a strained superlattice and overlying stress layer and related methods |
US7612366B2 (en) | 2003-06-26 | 2009-11-03 | Mears Technologies, Inc. | Semiconductor device including a strained superlattice layer above a stress layer |
US7659539B2 (en) | 2003-06-26 | 2010-02-09 | Mears Technologies, Inc. | Semiconductor device including a floating gate memory cell with a superlattice channel |
US7700447B2 (en) | 2006-02-21 | 2010-04-20 | Mears Technologies, Inc. | Method for making a semiconductor device comprising a lattice matching layer |
US7781827B2 (en) | 2007-01-24 | 2010-08-24 | Mears Technologies, Inc. | Semiconductor device with a vertical MOSFET including a superlattice and related methods |
US7812339B2 (en) | 2007-04-23 | 2010-10-12 | Mears Technologies, Inc. | Method for making a semiconductor device including shallow trench isolation (STI) regions with maskless superlattice deposition following STI formation and related structures |
US7863066B2 (en) | 2007-02-16 | 2011-01-04 | Mears Technologies, Inc. | Method for making a multiple-wavelength opto-electronic device including a superlattice |
US7880161B2 (en) | 2007-02-16 | 2011-02-01 | Mears Technologies, Inc. | Multiple-wavelength opto-electronic device including a superlattice |
US7928425B2 (en) | 2007-01-25 | 2011-04-19 | Mears Technologies, Inc. | Semiconductor device including a metal-to-semiconductor superlattice interface layer and related methods |
US9716147B2 (en) | 2014-06-09 | 2017-07-25 | Atomera Incorporated | Semiconductor devices with enhanced deterministic doping and related methods |
US9721790B2 (en) | 2015-06-02 | 2017-08-01 | Atomera Incorporated | Method for making enhanced semiconductor structures in single wafer processing chamber with desired uniformity control |
US9722046B2 (en) | 2014-11-25 | 2017-08-01 | Atomera Incorporated | Semiconductor device including a superlattice and replacement metal gate structure and related methods |
US9899479B2 (en) | 2015-05-15 | 2018-02-20 | Atomera Incorporated | Semiconductor devices with superlattice layers providing halo implant peak confinement and related methods |
US9972685B2 (en) | 2013-11-22 | 2018-05-15 | Atomera Incorporated | Vertical semiconductor devices including superlattice punch through stop layer and related methods |
US10381242B2 (en) | 2017-05-16 | 2019-08-13 | Atomera Incorporated | Method for making a semiconductor device including a superlattice as a gettering layer |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS53131779A (en) * | 1977-04-20 | 1978-11-16 | Ibm | Semiconductor superlattice structure |
JPS55117281A (en) * | 1979-03-05 | 1980-09-09 | Nippon Telegr & Teleph Corp <Ntt> | 3[5 group compound semiconductor hetero structure mosfet |
JPS5984475A (ja) * | 1982-11-05 | 1984-05-16 | Hitachi Ltd | 電界効果型トランジスタ |
-
1984
- 1984-07-17 JP JP14795784A patent/JPS6127681A/ja active Granted
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS53131779A (en) * | 1977-04-20 | 1978-11-16 | Ibm | Semiconductor superlattice structure |
JPS55117281A (en) * | 1979-03-05 | 1980-09-09 | Nippon Telegr & Teleph Corp <Ntt> | 3[5 group compound semiconductor hetero structure mosfet |
JPS5984475A (ja) * | 1982-11-05 | 1984-05-16 | Hitachi Ltd | 電界効果型トランジスタ |
Cited By (78)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS61230374A (ja) * | 1985-04-05 | 1986-10-14 | Seiko Epson Corp | 電界効果型トランジスタ及びその製造方法 |
JPS62279672A (ja) * | 1986-05-28 | 1987-12-04 | Kanegafuchi Chem Ind Co Ltd | 半導体装置 |
US4806998A (en) * | 1986-06-30 | 1989-02-21 | Thomson-Csf | Heterojunction and dual channel semiconductor field effect transistor or negative transconductive device |
JPS6394682A (ja) * | 1986-10-08 | 1988-04-25 | Semiconductor Energy Lab Co Ltd | 絶縁ゲイト型電界効果半導体装置 |
JPS6394681A (ja) * | 1986-10-08 | 1988-04-25 | Semiconductor Energy Lab Co Ltd | 絶縁ゲイト型電界効果半導体装置の作製方法 |
JPS6394680A (ja) * | 1986-10-08 | 1988-04-25 | Semiconductor Energy Lab Co Ltd | 絶縁ゲイト型電界効果半導体装置 |
US4908678A (en) * | 1986-10-08 | 1990-03-13 | Semiconductor Energy Laboratory Co., Ltd. | FET with a super lattice channel |
US4988634A (en) * | 1986-10-08 | 1991-01-29 | Semiconductor Energy Laboratory Co., Ltd. | Method for forming FET with a super lattice channel |
US5008211A (en) * | 1986-10-08 | 1991-04-16 | Semiconductor Energy Laboratory Co., Ltd. | Method for forming FET with a super lattice channel |
US5021839A (en) * | 1986-10-08 | 1991-06-04 | Semiconductor Energy Laboratory Co., Ltd. | FET with a super lattice channel |
US5051786A (en) * | 1989-10-24 | 1991-09-24 | Mcnc | Passivated polycrystalline semiconductors quantum well/superlattice structures fabricated thereof |
EP0694756A2 (en) | 1994-07-27 | 1996-01-31 | Shimadzu Corporation | Elongation measurement using a laser non-contact extensometer |
US6993222B2 (en) | 1999-03-03 | 2006-01-31 | Rj Mears, Llc | Optical filter device with aperiodically arranged grating elements |
US7123792B1 (en) | 1999-03-05 | 2006-10-17 | Rj Mears, Llc | Configurable aperiodic grating device |
US6460418B1 (en) | 2000-01-19 | 2002-10-08 | Kishimoto Sangyo Co., Ltd. | Method of and apparatus for measuring elongation of a test specimen |
WO2002001641A1 (en) * | 2000-06-27 | 2002-01-03 | Matsushita Electric Industrial Co., Ltd. | Semiconductor device |
US6674131B2 (en) | 2000-06-27 | 2004-01-06 | Matsushita Electric Industrial Co., Ltd. | Semiconductor power device for high-temperature applications |
WO2002043157A1 (en) * | 2000-11-21 | 2002-05-30 | Matsushita Electric Industrial Co.,Ltd. | Semiconductor device and its manufacturing method |
US6580125B2 (en) | 2000-11-21 | 2003-06-17 | Matsushita Electric Industrial Co., Ltd. | Semiconductor device and method for fabricating the same |
JPWO2002043157A1 (ja) * | 2000-11-21 | 2004-04-02 | 松下電器産業株式会社 | 半導体装置およびその製造方法 |
AU2004300981B2 (en) * | 2003-06-26 | 2007-10-18 | Mears Technologies, Inc. | Method for making semiconductor device including band-engineered superlattice |
US7514328B2 (en) | 2003-06-26 | 2009-04-07 | Mears Technologies, Inc. | Method for making a semiconductor device including shallow trench isolation (STI) regions with a superlattice therebetween |
WO2005034245A1 (en) * | 2003-06-26 | 2005-04-14 | Rj Mears, Llc | Semiconductor device including band-engineered superlattice |
WO2005013371A3 (en) * | 2003-06-26 | 2005-04-14 | Rj Mears Llc | Semiconductor device including band-engineered superlattice |
US6952018B2 (en) | 2003-06-26 | 2005-10-04 | Rj Mears, Llc | Semiconductor device including band-engineered superlattice |
US6958486B2 (en) | 2003-06-26 | 2005-10-25 | Rj Mears, Llc | Semiconductor device including band-engineered superlattice |
US7018900B2 (en) | 2003-06-26 | 2006-03-28 | Rj Mears, Llc | Method for making a semiconductor device comprising a superlattice channel vertically stepped above source and drain regions |
US7034329B2 (en) | 2003-06-26 | 2006-04-25 | Rj Mears, Llc | Semiconductor device including band-engineered superlattice having 3/1-5/1 germanium layer structure |
US7033437B2 (en) | 2003-06-26 | 2006-04-25 | Rj Mears, Llc | Method for making semiconductor device including band-engineered superlattice |
US7045813B2 (en) | 2003-06-26 | 2006-05-16 | Rj Mears, Llc | Semiconductor device including a superlattice with regions defining a semiconductor junction |
US7045377B2 (en) | 2003-06-26 | 2006-05-16 | Rj Mears, Llc | Method for making a semiconductor device including a superlattice and adjacent semiconductor layer with doped regions defining a semiconductor junction |
US7071119B2 (en) | 2003-06-26 | 2006-07-04 | Rj Mears, Llc | Method for making a semiconductor device including band-engineered superlattice having 3/1-5/1 germanium layer structure |
US7109052B2 (en) | 2003-06-26 | 2006-09-19 | Rj Mears, Llc | Method for making an integrated circuit comprising a waveguide having an energy band engineered superlattice |
US7227174B2 (en) | 2003-06-26 | 2007-06-05 | Rj Mears, Llc | Semiconductor device including a superlattice and adjacent semiconductor layer with doped regions defining a semiconductor junction |
US7229902B2 (en) | 2003-06-26 | 2007-06-12 | Rj Mears, Llc | Method for making a semiconductor device including a superlattice with regions defining a semiconductor junction |
US7265002B2 (en) | 2003-06-26 | 2007-09-04 | Rj Mears, Llc | Method for making a semiconductor device including a MOSFET having a band-engineered superlattice with a semiconductor cap layer providing a channel |
US7279699B2 (en) | 2003-06-26 | 2007-10-09 | Rj Mears, Llc | Integrated circuit comprising a waveguide having an energy band engineered superlattice |
US7279701B2 (en) | 2003-06-26 | 2007-10-09 | Rj Mears, Llc | Semiconductor device comprising a superlattice with upper portions extending above adjacent upper portions of source and drain regions |
WO2005018005A1 (en) * | 2003-06-26 | 2005-02-24 | Rj Mears, Llc | Semiconductor device including mosfet having band-engineered superlattice |
AU2004306355B2 (en) * | 2003-06-26 | 2007-10-18 | Mears Technologies, Inc. | Semiconductor device including band-engineered superlattice |
AU2004300982B2 (en) * | 2003-06-26 | 2007-10-25 | Mears Technologies, Inc. | Semiconductor device including MOSFET having band-engineered superlattice |
US7288457B2 (en) | 2003-06-26 | 2007-10-30 | Rj Mears, Llc | Method for making semiconductor device comprising a superlattice with upper portions extending above adjacent upper portions of source and drain regions |
US7303948B2 (en) | 2003-06-26 | 2007-12-04 | Mears Technologies, Inc. | Semiconductor device including MOSFET having band-engineered superlattice |
US7432524B2 (en) | 2003-06-26 | 2008-10-07 | Mears Technologies, Inc. | Integrated circuit comprising an active optical device having an energy band engineered superlattice |
US7435988B2 (en) | 2003-06-26 | 2008-10-14 | Mears Technologies, Inc. | Semiconductor device including a MOSFET having a band-engineered superlattice with a semiconductor cap layer providing a channel |
US7436026B2 (en) | 2003-06-26 | 2008-10-14 | Mears Technologies, Inc. | Semiconductor device comprising a superlattice channel vertically stepped above source and drain regions |
US7446002B2 (en) | 2003-06-26 | 2008-11-04 | Mears Technologies, Inc. | Method for making a semiconductor device comprising a superlattice dielectric interface layer |
US7446334B2 (en) | 2003-06-26 | 2008-11-04 | Mears Technologies, Inc. | Electronic device comprising active optical devices with an energy band engineered superlattice |
US7491587B2 (en) | 2003-06-26 | 2009-02-17 | Mears Technologies, Inc. | Method for making a semiconductor device having a semiconductor-on-insulator (SOI) configuration and including a superlattice on a thin semiconductor layer |
WO2005018004A1 (en) * | 2003-06-26 | 2005-02-24 | Rj Mears, Llc | Method for making semiconductor device including band-engineered superlattice |
US7659539B2 (en) | 2003-06-26 | 2010-02-09 | Mears Technologies, Inc. | Semiconductor device including a floating gate memory cell with a superlattice channel |
US7531850B2 (en) | 2003-06-26 | 2009-05-12 | Mears Technologies, Inc. | Semiconductor device including a memory cell with a negative differential resistance (NDR) device |
US7531828B2 (en) | 2003-06-26 | 2009-05-12 | Mears Technologies, Inc. | Semiconductor device including a strained superlattice between at least one pair of spaced apart stress regions |
US7531829B2 (en) | 2003-06-26 | 2009-05-12 | Mears Technologies, Inc. | Semiconductor device including regions of band-engineered semiconductor superlattice to reduce device-on resistance |
US7535041B2 (en) | 2003-06-26 | 2009-05-19 | Mears Technologies, Inc. | Method for making a semiconductor device including regions of band-engineered semiconductor superlattice to reduce device-on resistance |
US7586165B2 (en) | 2003-06-26 | 2009-09-08 | Mears Technologies, Inc. | Microelectromechanical systems (MEMS) device including a superlattice |
US7586116B2 (en) | 2003-06-26 | 2009-09-08 | Mears Technologies, Inc. | Semiconductor device having a semiconductor-on-insulator configuration and a superlattice |
US7598515B2 (en) | 2003-06-26 | 2009-10-06 | Mears Technologies, Inc. | Semiconductor device including a strained superlattice and overlying stress layer and related methods |
US7612366B2 (en) | 2003-06-26 | 2009-11-03 | Mears Technologies, Inc. | Semiconductor device including a strained superlattice layer above a stress layer |
US7517702B2 (en) | 2005-12-22 | 2009-04-14 | Mears Technologies, Inc. | Method for making an electronic device including a poled superlattice having a net electrical dipole moment |
US7700447B2 (en) | 2006-02-21 | 2010-04-20 | Mears Technologies, Inc. | Method for making a semiconductor device comprising a lattice matching layer |
US7718996B2 (en) | 2006-02-21 | 2010-05-18 | Mears Technologies, Inc. | Semiconductor device comprising a lattice matching layer |
US7781827B2 (en) | 2007-01-24 | 2010-08-24 | Mears Technologies, Inc. | Semiconductor device with a vertical MOSFET including a superlattice and related methods |
US7928425B2 (en) | 2007-01-25 | 2011-04-19 | Mears Technologies, Inc. | Semiconductor device including a metal-to-semiconductor superlattice interface layer and related methods |
US8389974B2 (en) | 2007-02-16 | 2013-03-05 | Mears Technologies, Inc. | Multiple-wavelength opto-electronic device including a superlattice |
US7863066B2 (en) | 2007-02-16 | 2011-01-04 | Mears Technologies, Inc. | Method for making a multiple-wavelength opto-electronic device including a superlattice |
US7880161B2 (en) | 2007-02-16 | 2011-02-01 | Mears Technologies, Inc. | Multiple-wavelength opto-electronic device including a superlattice |
US7812339B2 (en) | 2007-04-23 | 2010-10-12 | Mears Technologies, Inc. | Method for making a semiconductor device including shallow trench isolation (STI) regions with maskless superlattice deposition following STI formation and related structures |
US9972685B2 (en) | 2013-11-22 | 2018-05-15 | Atomera Incorporated | Vertical semiconductor devices including superlattice punch through stop layer and related methods |
US9716147B2 (en) | 2014-06-09 | 2017-07-25 | Atomera Incorporated | Semiconductor devices with enhanced deterministic doping and related methods |
US10170560B2 (en) | 2014-06-09 | 2019-01-01 | Atomera Incorporated | Semiconductor devices with enhanced deterministic doping and related methods |
US9722046B2 (en) | 2014-11-25 | 2017-08-01 | Atomera Incorporated | Semiconductor device including a superlattice and replacement metal gate structure and related methods |
US10084045B2 (en) | 2014-11-25 | 2018-09-25 | Atomera Incorporated | Semiconductor device including a superlattice and replacement metal gate structure and related methods |
US9899479B2 (en) | 2015-05-15 | 2018-02-20 | Atomera Incorporated | Semiconductor devices with superlattice layers providing halo implant peak confinement and related methods |
US9941359B2 (en) | 2015-05-15 | 2018-04-10 | Atomera Incorporated | Semiconductor devices with superlattice and punch-through stop (PTS) layers at different depths and related methods |
US9721790B2 (en) | 2015-06-02 | 2017-08-01 | Atomera Incorporated | Method for making enhanced semiconductor structures in single wafer processing chamber with desired uniformity control |
US10381242B2 (en) | 2017-05-16 | 2019-08-13 | Atomera Incorporated | Method for making a semiconductor device including a superlattice as a gettering layer |
US10410880B2 (en) | 2017-05-16 | 2019-09-10 | Atomera Incorporated | Semiconductor device including a superlattice as a gettering layer |
Also Published As
Publication number | Publication date |
---|---|
JPH0224025B2 (enrdf_load_stackoverflow) | 1990-05-28 |
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