JPS6122469B2 - - Google Patents
Info
- Publication number
- JPS6122469B2 JPS6122469B2 JP1922977A JP1922977A JPS6122469B2 JP S6122469 B2 JPS6122469 B2 JP S6122469B2 JP 1922977 A JP1922977 A JP 1922977A JP 1922977 A JP1922977 A JP 1922977A JP S6122469 B2 JPS6122469 B2 JP S6122469B2
- Authority
- JP
- Japan
- Prior art keywords
- lead
- tab
- tab lead
- lead frame
- frame
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000004065 semiconductor Substances 0.000 claims description 14
- 239000011347 resin Substances 0.000 claims description 12
- 229920005989 resin Polymers 0.000 claims description 12
- 238000007789 sealing Methods 0.000 claims description 11
- 239000008188 pellet Substances 0.000 claims description 9
- 238000004519 manufacturing process Methods 0.000 description 3
- 229910000906 Bronze Inorganic materials 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- 239000010974 bronze Substances 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- KUNSUQLRTQLHQQ-UHFFFAOYSA-N copper tin Chemical compound [Cu].[Sn] KUNSUQLRTQLHQQ-UHFFFAOYSA-N 0.000 description 1
- 229910000833 kovar Inorganic materials 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 230000035882 stress Effects 0.000 description 1
- 230000008646 thermal stress Effects 0.000 description 1
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1922977A JPS53105175A (en) | 1977-02-25 | 1977-02-25 | Lead frame for resin sealing semiconductor device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1922977A JPS53105175A (en) | 1977-02-25 | 1977-02-25 | Lead frame for resin sealing semiconductor device |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP14030285A Division JPS6163047A (ja) | 1985-06-28 | 1985-06-28 | 樹脂封止型形半導体装置用リ−ドフレ−ム |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS53105175A JPS53105175A (en) | 1978-09-13 |
| JPS6122469B2 true JPS6122469B2 (enrdf_load_stackoverflow) | 1986-05-31 |
Family
ID=11993538
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1922977A Granted JPS53105175A (en) | 1977-02-25 | 1977-02-25 | Lead frame for resin sealing semiconductor device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS53105175A (enrdf_load_stackoverflow) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS55162251A (en) * | 1979-06-04 | 1980-12-17 | Hitachi Ltd | Lead frame |
| JPS58170834U (ja) * | 1982-05-07 | 1983-11-15 | 日本電気株式会社 | リ−ドフレ−ムのアイランド吊り構造 |
| JPS6163047A (ja) * | 1985-06-28 | 1986-04-01 | Hitachi Ltd | 樹脂封止型形半導体装置用リ−ドフレ−ム |
| US4803540A (en) * | 1986-11-24 | 1989-02-07 | American Telephone And Telegraph Co., At&T Bell Labs | Semiconductor integrated circuit packages |
| JPH0217856U (enrdf_load_stackoverflow) * | 1988-07-22 | 1990-02-06 | ||
| JP4936962B2 (ja) * | 2007-04-06 | 2012-05-23 | 日本エンバイロ工業株式会社 | フィルタープレス装置およびそのケーキ除去方法 |
-
1977
- 1977-02-25 JP JP1922977A patent/JPS53105175A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS53105175A (en) | 1978-09-13 |
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