JPS53105175A - Lead frame for resin sealing semiconductor device - Google Patents

Lead frame for resin sealing semiconductor device

Info

Publication number
JPS53105175A
JPS53105175A JP1922977A JP1922977A JPS53105175A JP S53105175 A JPS53105175 A JP S53105175A JP 1922977 A JP1922977 A JP 1922977A JP 1922977 A JP1922977 A JP 1922977A JP S53105175 A JPS53105175 A JP S53105175A
Authority
JP
Japan
Prior art keywords
lead frame
semiconductor device
resin sealing
sealing semiconductor
lead
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1922977A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6122469B2 (enrdf_load_stackoverflow
Inventor
Yoshiaki Wakashima
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP1922977A priority Critical patent/JPS53105175A/ja
Publication of JPS53105175A publication Critical patent/JPS53105175A/ja
Publication of JPS6122469B2 publication Critical patent/JPS6122469B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Lead Frames For Integrated Circuits (AREA)
JP1922977A 1977-02-25 1977-02-25 Lead frame for resin sealing semiconductor device Granted JPS53105175A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1922977A JPS53105175A (en) 1977-02-25 1977-02-25 Lead frame for resin sealing semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1922977A JPS53105175A (en) 1977-02-25 1977-02-25 Lead frame for resin sealing semiconductor device

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP14030285A Division JPS6163047A (ja) 1985-06-28 1985-06-28 樹脂封止型形半導体装置用リ−ドフレ−ム

Publications (2)

Publication Number Publication Date
JPS53105175A true JPS53105175A (en) 1978-09-13
JPS6122469B2 JPS6122469B2 (enrdf_load_stackoverflow) 1986-05-31

Family

ID=11993538

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1922977A Granted JPS53105175A (en) 1977-02-25 1977-02-25 Lead frame for resin sealing semiconductor device

Country Status (1)

Country Link
JP (1) JPS53105175A (enrdf_load_stackoverflow)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS55162251A (en) * 1979-06-04 1980-12-17 Hitachi Ltd Lead frame
JPS58170834U (ja) * 1982-05-07 1983-11-15 日本電気株式会社 リ−ドフレ−ムのアイランド吊り構造
JPS6163047A (ja) * 1985-06-28 1986-04-01 Hitachi Ltd 樹脂封止型形半導体装置用リ−ドフレ−ム
JPS63232359A (ja) * 1986-11-24 1988-09-28 アメリカン　テレフォン　アンド　テレグラフ　カムパニー 半導体集積回路のパッケージ
JPH0217856U (enrdf_load_stackoverflow) * 1988-07-22 1990-02-06
JP2008253946A (ja) * 2007-04-06 2008-10-23 Japan Envirotic Industry Co Ltd フィルタープレス装置およびそのケーキ除去方法

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS55162251A (en) * 1979-06-04 1980-12-17 Hitachi Ltd Lead frame
JPS58170834U (ja) * 1982-05-07 1983-11-15 日本電気株式会社 リ−ドフレ−ムのアイランド吊り構造
JPS6163047A (ja) * 1985-06-28 1986-04-01 Hitachi Ltd 樹脂封止型形半導体装置用リ−ドフレ−ム
JPS63232359A (ja) * 1986-11-24 1988-09-28 アメリカン　テレフォン　アンド　テレグラフ　カムパニー 半導体集積回路のパッケージ
JPH0217856U (enrdf_load_stackoverflow) * 1988-07-22 1990-02-06
JP2008253946A (ja) * 2007-04-06 2008-10-23 Japan Envirotic Industry Co Ltd フィルタープレス装置およびそのケーキ除去方法

Also Published As

Publication number Publication date
JPS6122469B2 (enrdf_load_stackoverflow) 1986-05-31

Similar Documents

Publication Publication Date Title
JPS53105175A (en) Lead frame for resin sealing semiconductor device
JPS5212573A (en) Reed frame
JPS5433665A (en) Manufacture for resin sealed type semiconductor device and resin sealed metal mold
JPS52172A (en) Semiconductor
JPS5381076A (en) Lroduction of resin seal semiconductor device
JPS5338974A (en) Manufacture of semiconductor device
JPS5315762A (en) Production of semiconductor device
JPS52131464A (en) Manufacture of semiconductor device
JPS5252576A (en) Production of semiconductor device
JPS5314563A (en) Fixing method of semiconductor pellet to lead frame
JPS53142185A (en) Manufacture of walled emitter type semiconductor device
JPS5385160A (en) Production of semiconductor device
JPS5434752A (en) Manufacture of semiconductor device
JPS5432269A (en) Manufacture for semiconductor device
JPS51117575A (en) Electronic circuit and its manufacturing method
JPS52117068A (en) Preparation of resin-sealed type semiconductor device
JPS5443470A (en) Manufacture of semiconductor device
JPS5394769A (en) Manufacture of semiconductor device
JPS5624960A (en) Lead frame for semiconductor device
JPS53142176A (en) Manufacture of semiconductor device
JPS52149067A (en) Glass mold type semiconductor device
JPS52156562A (en) Semiconductor device
JPS5338979A (en) Manufacture of resin mold type semiconductor device
JPS52127760A (en) Glass-seal type semiconductor unit
JPS5325394A (en) Se miconductor device