JPS55162251A - Lead frame - Google Patents

Lead frame

Info

Publication number
JPS55162251A
JPS55162251A JP6894779A JP6894779A JPS55162251A JP S55162251 A JPS55162251 A JP S55162251A JP 6894779 A JP6894779 A JP 6894779A JP 6894779 A JP6894779 A JP 6894779A JP S55162251 A JPS55162251 A JP S55162251A
Authority
JP
Japan
Prior art keywords
tab
leads
sides
joints
distortion
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP6894779A
Other languages
Japanese (ja)
Other versions
JPS6216552B2 (en
Inventor
Kazuo Hoya
Kazuo Shimizu
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP6894779A priority Critical patent/JPS55162251A/en
Publication of JPS55162251A publication Critical patent/JPS55162251A/en
Publication of JPS6216552B2 publication Critical patent/JPS6216552B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49503—Lead-frames or other flat leads characterised by the die pad
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Lead Frames For Integrated Circuits (AREA)

Abstract

PURPOSE:To increase distortion absorbing effect by the method wherein a distortion absorbing through hole is provided on the joint between a tab for fastening a semiconductor chip and a tab lead for connecting this to an outer frame, and at the same time, the joints on both sides of the through hole are made symmetrical with respect to the center axis of the tab lead. CONSTITUTION:Tab leads 8 are made to project from the center of both sides of tab 5 for fastening IC chip 6. In parallel to these on both sides of leads 8, leads 4 for leading out electrodes are provided. In this lead frame so constructed, usually through holes 9 for absorbing distortion are provided at the parts where the ends of leads 8 come into contact with the outer frame of frame 2. In this device, these are not provided here. Instead, they are formed on the joints with tab 5, and at the same time, the joints on both sides of through holes 9 are made symmetrical with respect to the center axis of leads 8. By this, distortion absorbing effect is increased and no deviation occurs for the tab.
JP6894779A 1979-06-04 1979-06-04 Lead frame Granted JPS55162251A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP6894779A JPS55162251A (en) 1979-06-04 1979-06-04 Lead frame

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP6894779A JPS55162251A (en) 1979-06-04 1979-06-04 Lead frame

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2866288A Division JPS63211661A (en) 1988-02-12 1988-02-12 Lead frame

Publications (2)

Publication Number Publication Date
JPS55162251A true JPS55162251A (en) 1980-12-17
JPS6216552B2 JPS6216552B2 (en) 1987-04-13

Family

ID=13388359

Family Applications (1)

Application Number Title Priority Date Filing Date
JP6894779A Granted JPS55162251A (en) 1979-06-04 1979-06-04 Lead frame

Country Status (1)

Country Link
JP (1) JPS55162251A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4791472A (en) * 1985-09-23 1988-12-13 Hitachi, Ltd. Lead frame and semiconductor device using the same
US4870474A (en) * 1986-12-12 1989-09-26 Texas Instruments Incorporated Lead frame
JPH0549806U (en) * 1991-12-16 1993-07-02 住友ゴム工業株式会社 Elastic blocks for paving

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5039102U (en) * 1973-08-07 1975-04-22
JPS53105175A (en) * 1977-02-25 1978-09-13 Hitachi Ltd Lead frame for resin sealing semiconductor device

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5039102U (en) * 1973-08-07 1975-04-22
JPS53105175A (en) * 1977-02-25 1978-09-13 Hitachi Ltd Lead frame for resin sealing semiconductor device

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4791472A (en) * 1985-09-23 1988-12-13 Hitachi, Ltd. Lead frame and semiconductor device using the same
US4870474A (en) * 1986-12-12 1989-09-26 Texas Instruments Incorporated Lead frame
JPH0549806U (en) * 1991-12-16 1993-07-02 住友ゴム工業株式会社 Elastic blocks for paving

Also Published As

Publication number Publication date
JPS6216552B2 (en) 1987-04-13

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