JPS6464393A - Mounting apparatus for circuit device - Google Patents

Mounting apparatus for circuit device

Info

Publication number
JPS6464393A
JPS6464393A JP22133887A JP22133887A JPS6464393A JP S6464393 A JPS6464393 A JP S6464393A JP 22133887 A JP22133887 A JP 22133887A JP 22133887 A JP22133887 A JP 22133887A JP S6464393 A JPS6464393 A JP S6464393A
Authority
JP
Japan
Prior art keywords
circuit device
space
mounting
solder
mounting lands
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP22133887A
Other languages
Japanese (ja)
Inventor
Minoru Oba
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP22133887A priority Critical patent/JPS6464393A/en
Publication of JPS6464393A publication Critical patent/JPS6464393A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3431—Leadless components

Landscapes

  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

PURPOSE:To increase the number of patterns passing through mounting lands by a method wherein a space between the mounting lands on which a circuit device is mounted is set to be wider than a space between electrodes of the circuit device. CONSTITUTION:A space A between mounting lands 2, 2 is set to be wider than a space B between electrodes 5, 5 of a circuit device 4. This assembly is second- bonded by using a solder. If the center between the electrodes 5, 5 of the circuit device 4 is aligned with the center of the mounting lands 2, 2 and both are attached, a part where the electrode 5 is fixed by the solder is limited to the mounting land 2 which protrudes from an outer shape of the electrode 5; a part inside the outer shape of the electrode 5 at the mounting land 2 does not contribute to a fixing action by the solder. Accordingly, solder bonding strength of the circuit device 4 is equal. Because the space A between the mounting lands 2, 2 is made wide, many patterns can be arranged as long as they have an equal width.
JP22133887A 1987-09-04 1987-09-04 Mounting apparatus for circuit device Pending JPS6464393A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP22133887A JPS6464393A (en) 1987-09-04 1987-09-04 Mounting apparatus for circuit device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP22133887A JPS6464393A (en) 1987-09-04 1987-09-04 Mounting apparatus for circuit device

Publications (1)

Publication Number Publication Date
JPS6464393A true JPS6464393A (en) 1989-03-10

Family

ID=16765240

Family Applications (1)

Application Number Title Priority Date Filing Date
JP22133887A Pending JPS6464393A (en) 1987-09-04 1987-09-04 Mounting apparatus for circuit device

Country Status (1)

Country Link
JP (1) JPS6464393A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0802706A1 (en) * 1996-04-18 1997-10-22 Lucent Technologies Inc. Uni-pad for suface mount component package

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0802706A1 (en) * 1996-04-18 1997-10-22 Lucent Technologies Inc. Uni-pad for suface mount component package

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