JPS53116777A - Production of electronic parts - Google Patents

Production of electronic parts

Info

Publication number
JPS53116777A
JPS53116777A JP3126877A JP3126877A JPS53116777A JP S53116777 A JPS53116777 A JP S53116777A JP 3126877 A JP3126877 A JP 3126877A JP 3126877 A JP3126877 A JP 3126877A JP S53116777 A JPS53116777 A JP S53116777A
Authority
JP
Japan
Prior art keywords
production
volume
electronic parts
solder
bumps
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP3126877A
Other languages
Japanese (ja)
Other versions
JPS616545B2 (en
Inventor
Koichi Togashi
Takayasu Handa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp, Nippon Electric Co Ltd filed Critical NEC Corp
Priority to JP3126877A priority Critical patent/JPS53116777A/en
Publication of JPS53116777A publication Critical patent/JPS53116777A/en
Publication of JPS616545B2 publication Critical patent/JPS616545B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Wire Bonding (AREA)

Abstract

PURPOSE: To reduce the volume of solder accumulating in bump electrodes and to make even the volume of the solder of the bumps uniform by providing a dummy electrode in proximity to the electrode in which the volume of solder increases at the time of forming the bumps on the connection electrodes of an electronic part having a plurality of connection electrodes.
COPYRIGHT: (C)1978,JPO&Japio
JP3126877A 1977-03-22 1977-03-22 Production of electronic parts Granted JPS53116777A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP3126877A JPS53116777A (en) 1977-03-22 1977-03-22 Production of electronic parts

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP3126877A JPS53116777A (en) 1977-03-22 1977-03-22 Production of electronic parts

Publications (2)

Publication Number Publication Date
JPS53116777A true JPS53116777A (en) 1978-10-12
JPS616545B2 JPS616545B2 (en) 1986-02-27

Family

ID=12326578

Family Applications (1)

Application Number Title Priority Date Filing Date
JP3126877A Granted JPS53116777A (en) 1977-03-22 1977-03-22 Production of electronic parts

Country Status (1)

Country Link
JP (1) JPS53116777A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08186109A (en) * 1994-12-28 1996-07-16 Nec Corp Semiconductor integrated circuit device

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09283562A (en) * 1996-04-18 1997-10-31 Nec Corp Integrated circuit device and method of connecting it to substrate

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08186109A (en) * 1994-12-28 1996-07-16 Nec Corp Semiconductor integrated circuit device

Also Published As

Publication number Publication date
JPS616545B2 (en) 1986-02-27

Similar Documents

Publication Publication Date Title
JPS5412761A (en) Display device
JPS53116777A (en) Production of electronic parts
JPS5434272A (en) Electronic wristwatch
JPS5412286A (en) Semiconductor device
JPS5230381A (en) Semiconductor integrating circuit
JPS5434678A (en) Semiconductor device
JPS5411487A (en) Lead conductor welding
JPS5249767A (en) Semiconductor device
JPS548972A (en) Forming method for fine electrode of semiconductor element
JPS5380161A (en) Electrode formation of semiconductor
JPS5228263A (en) Process of face bonding of flip tip
JPS5353968A (en) Electronic circuit device
JPS53140967A (en) Production of electrodes of semiconductor device
JPS5232265A (en) Sos-ic with bump electrode
JPS5341173A (en) Manufacture of semiconductor device
JPS53124976A (en) Mounting method of electronic parts
JPS5368163A (en) Production of flip chip
JPS5333060A (en) Electrode lead-out method
JPS53139972A (en) Production of semiconductor device
JPS5268366A (en) Solder vamp formation onto semiconductor substrate
JPS5232264A (en) Formation method for solder electrode
JPS5354493A (en) Electronic watch
JPS5344172A (en) Semiconductor integrated circuit
JPS53124970A (en) Semiconductor device
JPS542664A (en) Semiconductor device