JPS53116777A - Production of electronic parts - Google Patents
Production of electronic partsInfo
- Publication number
- JPS53116777A JPS53116777A JP3126877A JP3126877A JPS53116777A JP S53116777 A JPS53116777 A JP S53116777A JP 3126877 A JP3126877 A JP 3126877A JP 3126877 A JP3126877 A JP 3126877A JP S53116777 A JPS53116777 A JP S53116777A
- Authority
- JP
- Japan
- Prior art keywords
- production
- volume
- electronic parts
- solder
- bumps
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Wire Bonding (AREA)
Abstract
PURPOSE: To reduce the volume of solder accumulating in bump electrodes and to make even the volume of the solder of the bumps uniform by providing a dummy electrode in proximity to the electrode in which the volume of solder increases at the time of forming the bumps on the connection electrodes of an electronic part having a plurality of connection electrodes.
COPYRIGHT: (C)1978,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP3126877A JPS53116777A (en) | 1977-03-22 | 1977-03-22 | Production of electronic parts |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP3126877A JPS53116777A (en) | 1977-03-22 | 1977-03-22 | Production of electronic parts |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS53116777A true JPS53116777A (en) | 1978-10-12 |
JPS616545B2 JPS616545B2 (en) | 1986-02-27 |
Family
ID=12326578
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP3126877A Granted JPS53116777A (en) | 1977-03-22 | 1977-03-22 | Production of electronic parts |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS53116777A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH08186109A (en) * | 1994-12-28 | 1996-07-16 | Nec Corp | Semiconductor integrated circuit device |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH09283562A (en) * | 1996-04-18 | 1997-10-31 | Nec Corp | Integrated circuit device and method of connecting it to substrate |
-
1977
- 1977-03-22 JP JP3126877A patent/JPS53116777A/en active Granted
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH08186109A (en) * | 1994-12-28 | 1996-07-16 | Nec Corp | Semiconductor integrated circuit device |
Also Published As
Publication number | Publication date |
---|---|
JPS616545B2 (en) | 1986-02-27 |
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