JPS5333060A - Electrode lead-out method - Google Patents

Electrode lead-out method

Info

Publication number
JPS5333060A
JPS5333060A JP10741376A JP10741376A JPS5333060A JP S5333060 A JPS5333060 A JP S5333060A JP 10741376 A JP10741376 A JP 10741376A JP 10741376 A JP10741376 A JP 10741376A JP S5333060 A JPS5333060 A JP S5333060A
Authority
JP
Japan
Prior art keywords
electrode lead
out method
electrodes
finger
pad
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP10741376A
Other languages
Japanese (ja)
Inventor
Yoshihiro Maeda
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Seiko Epson Corp
Suwa Seikosha KK
Original Assignee
Seiko Epson Corp
Suwa Seikosha KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Seiko Epson Corp, Suwa Seikosha KK filed Critical Seiko Epson Corp
Priority to JP10741376A priority Critical patent/JPS5333060A/en
Publication of JPS5333060A publication Critical patent/JPS5333060A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto

Abstract

PURPOSE: To increase the adhesion strength of electrodes and simplify electrode leadout process by using the two bump electrodes on an IC pad having mutually intermeshing form and a protruding lead wire (finger) which can be fitted therein.
COPYRIGHT: (C)1978,JPO&Japio
JP10741376A 1976-09-08 1976-09-08 Electrode lead-out method Pending JPS5333060A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP10741376A JPS5333060A (en) 1976-09-08 1976-09-08 Electrode lead-out method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10741376A JPS5333060A (en) 1976-09-08 1976-09-08 Electrode lead-out method

Publications (1)

Publication Number Publication Date
JPS5333060A true JPS5333060A (en) 1978-03-28

Family

ID=14458508

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10741376A Pending JPS5333060A (en) 1976-09-08 1976-09-08 Electrode lead-out method

Country Status (1)

Country Link
JP (1) JPS5333060A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08124969A (en) * 1994-10-27 1996-05-17 Nec Corp Mounting structure of semiconductor chip

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08124969A (en) * 1994-10-27 1996-05-17 Nec Corp Mounting structure of semiconductor chip

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