JPS53139972A - Production of semiconductor device - Google Patents

Production of semiconductor device

Info

Publication number
JPS53139972A
JPS53139972A JP5562477A JP5562477A JPS53139972A JP S53139972 A JPS53139972 A JP S53139972A JP 5562477 A JP5562477 A JP 5562477A JP 5562477 A JP5562477 A JP 5562477A JP S53139972 A JPS53139972 A JP S53139972A
Authority
JP
Japan
Prior art keywords
production
semiconductor device
electrodes
sides
device capable
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP5562477A
Other languages
Japanese (ja)
Inventor
Hiroaki Fujimoto
Masaharu Noyori
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP5562477A priority Critical patent/JPS53139972A/en
Priority to US05/882,152 priority patent/US4246595A/en
Priority to GB8586/78A priority patent/GB1588377A/en
Priority to CA298,234A priority patent/CA1108305A/en
Priority to DE2810054A priority patent/DE2810054C2/en
Publication of JPS53139972A publication Critical patent/JPS53139972A/en
Priority to US06/168,418 priority patent/US4356374A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/82—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected by forming build-up interconnects at chip-level, e.g. for high density interconnects [HDI]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/04105—Bonding areas formed on an encapsulation of the semiconductor or solid-state body, e.g. bonding areas on chip-scale packages
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/16227—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation the bump connector connecting to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/18—High density interconnect [HDI] connectors; Manufacturing methods related thereto
    • H01L2224/19—Manufacturing methods of high density interconnect preforms
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/91—Methods for connecting semiconductor or solid state bodies including different methods provided for in two or more of groups H01L2224/80 - H01L2224/90
    • H01L2224/92—Specific sequence of method steps
    • H01L2224/921—Connecting a surface with connectors of different types
    • H01L2224/9212—Sequential connecting processes
    • H01L2224/92142—Sequential connecting processes the first connecting process involving a layer connector
    • H01L2224/92144—Sequential connecting processes the first connecting process involving a layer connector the second connecting process involving a build-up interconnect
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)

Abstract

PURPOSE: To form a device capable of making wireless bonding even for semiconductor elements formed with electrodes on both sides or for elements having no metal bumps on the electrodes.
COPYRIGHT: (C)1978,JPO&Japio
JP5562477A 1977-03-08 1977-05-13 Production of semiconductor device Pending JPS53139972A (en)

Priority Applications (6)

Application Number Priority Date Filing Date Title
JP5562477A JPS53139972A (en) 1977-05-13 1977-05-13 Production of semiconductor device
US05/882,152 US4246595A (en) 1977-03-08 1978-02-28 Electronics circuit device and method of making the same
GB8586/78A GB1588377A (en) 1977-03-08 1978-03-03 Electronic circuit devices and methods of making the same
CA298,234A CA1108305A (en) 1977-03-08 1978-03-06 Electronic circuit device and method of making the same
DE2810054A DE2810054C2 (en) 1977-03-08 1978-03-08 Electronic circuit arrangement and method for its manufacture
US06/168,418 US4356374A (en) 1977-03-08 1980-07-10 Electronics circuit device and method of making the same

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP5562477A JPS53139972A (en) 1977-05-13 1977-05-13 Production of semiconductor device

Publications (1)

Publication Number Publication Date
JPS53139972A true JPS53139972A (en) 1978-12-06

Family

ID=13003927

Family Applications (1)

Application Number Title Priority Date Filing Date
JP5562477A Pending JPS53139972A (en) 1977-03-08 1977-05-13 Production of semiconductor device

Country Status (1)

Country Link
JP (1) JPS53139972A (en)

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4831507A (en) * 1971-08-26 1973-04-25
JPS5216166A (en) * 1975-07-29 1977-02-07 Matsushita Electric Ind Co Ltd Semiconductor device

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4831507A (en) * 1971-08-26 1973-04-25
JPS5216166A (en) * 1975-07-29 1977-02-07 Matsushita Electric Ind Co Ltd Semiconductor device

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