JPS634354B2 - - Google Patents
Info
- Publication number
- JPS634354B2 JPS634354B2 JP132380A JP132380A JPS634354B2 JP S634354 B2 JPS634354 B2 JP S634354B2 JP 132380 A JP132380 A JP 132380A JP 132380 A JP132380 A JP 132380A JP S634354 B2 JPS634354 B2 JP S634354B2
- Authority
- JP
- Japan
- Prior art keywords
- tab
- dam
- frame
- lead
- lead frame
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 230000008646 thermal stress Effects 0.000 description 12
- 239000004065 semiconductor Substances 0.000 description 10
- 239000008188 pellet Substances 0.000 description 6
- 239000011347 resin Substances 0.000 description 6
- 229920005989 resin Polymers 0.000 description 6
- 238000000034 method Methods 0.000 description 4
- 238000000465 moulding Methods 0.000 description 4
- 238000004806 packaging method and process Methods 0.000 description 3
- 239000000956 alloy Substances 0.000 description 2
- 229910045601 alloy Inorganic materials 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 238000004080 punching Methods 0.000 description 2
- 239000004859 Copal Substances 0.000 description 1
- 241000782205 Guibourtia conjugata Species 0.000 description 1
- 230000005489 elastic deformation Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 229910000833 kovar Inorganic materials 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000012858 packaging process Methods 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 230000035882 stress Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
- H01L23/49541—Geometry of the lead-frame
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP132380A JPS5698852A (en) | 1980-01-11 | 1980-01-11 | Lead frame |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP132380A JPS5698852A (en) | 1980-01-11 | 1980-01-11 | Lead frame |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP30642586A Division JPS62169334A (ja) | 1986-12-24 | 1986-12-24 | 半導体装置の組立方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5698852A JPS5698852A (en) | 1981-08-08 |
| JPS634354B2 true JPS634354B2 (enrdf_load_stackoverflow) | 1988-01-28 |
Family
ID=11498277
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP132380A Granted JPS5698852A (en) | 1980-01-11 | 1980-01-11 | Lead frame |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5698852A (enrdf_load_stackoverflow) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5821362A (ja) * | 1981-07-30 | 1983-02-08 | Shinko Electric Ind Co Ltd | リ−ドフレ−ム |
| JPS58182438U (ja) * | 1982-05-31 | 1983-12-05 | 富士通株式会社 | 半導体装置 |
| JPS62254456A (ja) * | 1986-04-26 | 1987-11-06 | Yamada Seisakusho:Kk | リ−ドフレ−ム |
| JPS63148670A (ja) * | 1986-12-12 | 1988-06-21 | Texas Instr Japan Ltd | リ−ドフレ−ム材 |
| JP4496793B2 (ja) * | 2004-01-27 | 2010-07-07 | パナソニック電工株式会社 | 回路基板及びその製造方法 |
-
1980
- 1980-01-11 JP JP132380A patent/JPS5698852A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5698852A (en) | 1981-08-08 |
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