JPS602840U - 樹脂封止形半導体装置 - Google Patents

樹脂封止形半導体装置

Info

Publication number
JPS602840U
JPS602840U JP1983094606U JP9460683U JPS602840U JP S602840 U JPS602840 U JP S602840U JP 1983094606 U JP1983094606 U JP 1983094606U JP 9460683 U JP9460683 U JP 9460683U JP S602840 U JPS602840 U JP S602840U
Authority
JP
Japan
Prior art keywords
resin
semiconductor device
encapsulated semiconductor
semiconductor chip
sealed
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1983094606U
Other languages
English (en)
Inventor
豊 脇
Original Assignee
日本電気株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日本電気株式会社 filed Critical 日本電気株式会社
Priority to JP1983094606U priority Critical patent/JPS602840U/ja
Publication of JPS602840U publication Critical patent/JPS602840U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/06—Structure, shape, material or disposition of the bonding areas prior to the connecting process of a plurality of bonding areas
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。

Description

【図面の簡単な説明】
第１図ａ、　　ｂは各々本考案の実施例を説明するため
の抵抗およびトランジスタの断面図、第２図は本考案の
１実施例を説明するための半導体チップ搭載図である。 なお図において、１・・・・・・Ｎ形半導体、２・・・
・・・Ｐ形半導体、３・・・・・・表面保護膜、４・・
・・・・電極、５・・・・・・半導体チップ、６・・・
・・・抵抗、７・・・・・・マウント基板、８・・・・
・・抵抗の電極、９・・・・・・ボンディングワイヤ、
１０．１１・・・・・・外部リード、である。

Claims (1)

    【実用新案登録請求の範囲】
  1. 半導体チップの外周が樹脂で封止される樹脂封止形半導
    体装置において、半導体チップと同一基板上に半導体チ
    ップを加熱することを目的とする−　　抵抗または能動
    素子を形成することを特徴とする樹脂封止形半導体装置
    。
JP1983094606U 1983-06-20 1983-06-20 樹脂封止形半導体装置 Pending JPS602840U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1983094606U JPS602840U (ja) 1983-06-20 1983-06-20 樹脂封止形半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1983094606U JPS602840U (ja) 1983-06-20 1983-06-20 樹脂封止形半導体装置

Publications (1)

Publication Number Publication Date
JPS602840U true JPS602840U (ja) 1985-01-10

Family

ID=30226378

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1983094606U Pending JPS602840U (ja) 1983-06-20 1983-06-20 樹脂封止形半導体装置

Country Status (1)

Country Link
JP (1) JPS602840U (ja)

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