JPS6024031A - 半導体ウエハプロ−バ - Google Patents

半導体ウエハプロ−バ

Info

Publication number
JPS6024031A
JPS6024031A JP13218083A JP13218083A JPS6024031A JP S6024031 A JPS6024031 A JP S6024031A JP 13218083 A JP13218083 A JP 13218083A JP 13218083 A JP13218083 A JP 13218083A JP S6024031 A JPS6024031 A JP S6024031A
Authority
JP
Japan
Prior art keywords
wafer
defective
chip
mark
chips
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP13218083A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0441496B2 (enrdf_load_stackoverflow
Inventor
Junichi Inoue
準一 井上
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
TELMEC CO Ltd
Original Assignee
TELMEC CO Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by TELMEC CO Ltd filed Critical TELMEC CO Ltd
Priority to JP13218083A priority Critical patent/JPS6024031A/ja
Publication of JPS6024031A publication Critical patent/JPS6024031A/ja
Publication of JPH0441496B2 publication Critical patent/JPH0441496B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
JP13218083A 1983-07-19 1983-07-19 半導体ウエハプロ−バ Granted JPS6024031A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP13218083A JPS6024031A (ja) 1983-07-19 1983-07-19 半導体ウエハプロ−バ

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP13218083A JPS6024031A (ja) 1983-07-19 1983-07-19 半導体ウエハプロ−バ

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP13943393A Division JPH08274133A (ja) 1993-05-18 1993-05-18 半導体ウエハプローバ

Publications (2)

Publication Number Publication Date
JPS6024031A true JPS6024031A (ja) 1985-02-06
JPH0441496B2 JPH0441496B2 (enrdf_load_stackoverflow) 1992-07-08

Family

ID=15075249

Family Applications (1)

Application Number Title Priority Date Filing Date
JP13218083A Granted JPS6024031A (ja) 1983-07-19 1983-07-19 半導体ウエハプロ−バ

Country Status (1)

Country Link
JP (1) JPS6024031A (enrdf_load_stackoverflow)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62224943A (ja) * 1986-03-27 1987-10-02 Rohm Co Ltd ウエハプロ−バ
JPS63127545A (ja) * 1986-11-17 1988-05-31 Tokyo Electron Ltd プロ−ブ装置
US4965515A (en) * 1986-10-15 1990-10-23 Tokyo Electron Limited Apparatus and method of testing a semiconductor wafer
JPH08274134A (ja) * 1996-04-22 1996-10-18 Tokyo Electron Ltd 不良素子へのマーキング方法
JPH08330367A (ja) * 1995-05-31 1996-12-13 Nec Yamagata Ltd 半導体ウェハのマーキング装置及びそのマーキング方法
JP2019091773A (ja) * 2017-11-14 2019-06-13 三菱電機株式会社 半導体装置用評価装置および半導体装置の評価方法

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5717873A (en) * 1980-07-04 1982-01-29 Mitsubishi Electric Corp Inspection method of semiconductor element
JPS5818936A (ja) * 1981-07-27 1983-02-03 Toshiba Corp 半導体素子の選別方式

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5717873A (en) * 1980-07-04 1982-01-29 Mitsubishi Electric Corp Inspection method of semiconductor element
JPS5818936A (ja) * 1981-07-27 1983-02-03 Toshiba Corp 半導体素子の選別方式

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62224943A (ja) * 1986-03-27 1987-10-02 Rohm Co Ltd ウエハプロ−バ
US4965515A (en) * 1986-10-15 1990-10-23 Tokyo Electron Limited Apparatus and method of testing a semiconductor wafer
JPS63127545A (ja) * 1986-11-17 1988-05-31 Tokyo Electron Ltd プロ−ブ装置
JPH08330367A (ja) * 1995-05-31 1996-12-13 Nec Yamagata Ltd 半導体ウェハのマーキング装置及びそのマーキング方法
JPH08274134A (ja) * 1996-04-22 1996-10-18 Tokyo Electron Ltd 不良素子へのマーキング方法
JP2019091773A (ja) * 2017-11-14 2019-06-13 三菱電機株式会社 半導体装置用評価装置および半導体装置の評価方法

Also Published As

Publication number Publication date
JPH0441496B2 (enrdf_load_stackoverflow) 1992-07-08

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