JPH0312463B2 - - Google Patents
Info
- Publication number
- JPH0312463B2 JPH0312463B2 JP8695682A JP8695682A JPH0312463B2 JP H0312463 B2 JPH0312463 B2 JP H0312463B2 JP 8695682 A JP8695682 A JP 8695682A JP 8695682 A JP8695682 A JP 8695682A JP H0312463 B2 JPH0312463 B2 JP H0312463B2
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor
- prober
- semiconductor wafer
- marking
- inspection
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000004065 semiconductor Substances 0.000 claims description 65
- 235000012431 wafers Nutrition 0.000 claims description 58
- 238000007689 inspection Methods 0.000 claims description 27
- 230000002950 deficient Effects 0.000 claims description 17
- 238000000034 method Methods 0.000 claims description 14
- 238000012360 testing method Methods 0.000 claims description 8
- 230000006870 function Effects 0.000 claims description 7
- 230000006386 memory function Effects 0.000 claims description 5
- 238000003672 processing method Methods 0.000 claims description 2
- 239000000523 sample Substances 0.000 description 8
- 230000007547 defect Effects 0.000 description 3
- 239000003550 marker Substances 0.000 description 3
- 238000013507 mapping Methods 0.000 description 2
- 230000002411 adverse Effects 0.000 description 1
- 238000007664 blowing Methods 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000011179 visual inspection Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8695682A JPS58218132A (ja) | 1982-05-21 | 1982-05-21 | 半導体ウエ−ハ特性検査処理方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8695682A JPS58218132A (ja) | 1982-05-21 | 1982-05-21 | 半導体ウエ−ハ特性検査処理方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS58218132A JPS58218132A (ja) | 1983-12-19 |
| JPH0312463B2 true JPH0312463B2 (enrdf_load_stackoverflow) | 1991-02-20 |
Family
ID=13901319
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8695682A Granted JPS58218132A (ja) | 1982-05-21 | 1982-05-21 | 半導体ウエ−ハ特性検査処理方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS58218132A (enrdf_load_stackoverflow) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0669053B2 (ja) * | 1984-04-06 | 1994-08-31 | 株式会社東京精密 | プロービングマシン |
| JPH0692882B2 (ja) * | 1986-06-12 | 1994-11-16 | 松下電器産業株式会社 | プリント基板の検査装置 |
-
1982
- 1982-05-21 JP JP8695682A patent/JPS58218132A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS58218132A (ja) | 1983-12-19 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US6021380A (en) | Automatic semiconductor wafer sorter/prober with extended optical inspection | |
| WO1998001745A9 (en) | Automatic semiconductor wafer sorter/prober with extended optical inspection | |
| JPH0312463B2 (enrdf_load_stackoverflow) | ||
| US9134342B2 (en) | Intergrated apparatus and method for testing of semiconductor components using a turret machine | |
| JP2913609B2 (ja) | プロービング装置、プロービング方法およびプローブカード | |
| JPH0669053B2 (ja) | プロービングマシン | |
| JPH0441495B2 (enrdf_load_stackoverflow) | ||
| JPS6184029A (ja) | 半導体検査装置 | |
| JPS6024031A (ja) | 半導体ウエハプロ−バ | |
| JP2952882B2 (ja) | Ｉｃウェハ及びｉｃの良否識別方法 | |
| JPS60103639A (ja) | ウエハチツプの選別方法 | |
| JPH021141A (ja) | プローブ装置 | |
| JPS63299352A (ja) | プロ−ブ装置 | |
| JPS6399541A (ja) | 半導体ウエハプロ−バ装置 | |
| JPS5821838A (ja) | ウエハテストシステム | |
| JPH09183025A (ja) | ワーク配列治具及びワーク検査方法 | |
| KR20030097365A (ko) | 반도체 칩의 전기적 특성 검사 방법 | |
| KR100595139B1 (ko) | 프루브 카드의 아이디 인식 장치 및 그 인식 방법 | |
| JPS62152138A (ja) | 半導体装置の製造方法 | |
| JPS5817632A (ja) | Ｉｃチツプの選別方法 | |
| KR0134031B1 (ko) | 웨이퍼 프로우버의 자동위치 맞춤방법 | |
| JPH06275686A (ja) | 半導体装置の製造方法及び製造装置 | |
| JPH0715927B2 (ja) | プローブ装置 | |
| JPH0712872A (ja) | ワークの検査・補修装置 | |
| JPH08274134A (ja) | 不良素子へのマーキング方法 |