JPS5717873A - Inspection method of semiconductor element - Google Patents
Inspection method of semiconductor elementInfo
- Publication number
- JPS5717873A JPS5717873A JP9243680A JP9243680A JPS5717873A JP S5717873 A JPS5717873 A JP S5717873A JP 9243680 A JP9243680 A JP 9243680A JP 9243680 A JP9243680 A JP 9243680A JP S5717873 A JPS5717873 A JP S5717873A
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor element
- defect
- stamp
- measuring
- measured
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/26—Testing of individual semiconductor devices
- G01R31/265—Contactless testing
- G01R31/2656—Contactless testing using non-ionising electromagnetic radiation, e.g. optical radiation
Landscapes
- Physics & Mathematics (AREA)
- Health & Medical Sciences (AREA)
- Electromagnetism (AREA)
- Toxicology (AREA)
- General Physics & Mathematics (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
Abstract
PURPOSE:To prevent omission of a defect stamp in the test of semiconductor element and accomplish a highly reliable inspection by adding a detecting method of a defect stamp. CONSTITUTION:Electrical information is applied to each electrode in the condition that a probe 2 is made to contact with electrodes of a semiconductor element of a semiconductor wafer 1, and its change is detected for measuring electrical characteristics of the semiconductor element to be measured. Based on this result, if the measuring semiconductor element is out of the specilfication, after the surface reflectvity of the measuring semiconductor element is measured by the light source 4 and a photodetecting part 5, and ink marker 3 is worked to apply a defect stamp. Then, the surface reflectivity of the measuring semiconductor element is again measured, and this value is compared with the numerical value before the stamping the defect mark, if its difference is not greater than 25%, a defect stamp is applied again, and this operation is repeated. Thus, unclearness of the defect stamp and mismark can be eliminated and a test of high reliability can be carried out.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9243680A JPS5717873A (en) | 1980-07-04 | 1980-07-04 | Inspection method of semiconductor element |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9243680A JPS5717873A (en) | 1980-07-04 | 1980-07-04 | Inspection method of semiconductor element |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS5717873A true JPS5717873A (en) | 1982-01-29 |
Family
ID=14054375
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9243680A Pending JPS5717873A (en) | 1980-07-04 | 1980-07-04 | Inspection method of semiconductor element |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5717873A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS59116163A (en) * | 1982-12-16 | 1984-07-04 | デイナミ−ト・ノ−ベル・アクチエンゲゼルシヤフト | Manufacture of hardenable water-containing molding material and molded body |
| JPS6024031A (en) * | 1983-07-19 | 1985-02-06 | Telmec Co Ltd | Semiconductor wafer prober |
| JPH08274133A (en) * | 1993-05-18 | 1996-10-18 | Tokyo Electron Ltd | Semiconductor wafer prober |
-
1980
- 1980-07-04 JP JP9243680A patent/JPS5717873A/en active Pending
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS59116163A (en) * | 1982-12-16 | 1984-07-04 | デイナミ−ト・ノ−ベル・アクチエンゲゼルシヤフト | Manufacture of hardenable water-containing molding material and molded body |
| JPH0445471B2 (en) * | 1982-12-16 | 1992-07-24 | Dynamit Nobel Ag | |
| JPS6024031A (en) * | 1983-07-19 | 1985-02-06 | Telmec Co Ltd | Semiconductor wafer prober |
| JPH0441496B2 (en) * | 1983-07-19 | 1992-07-08 | Tokyo Electron Ltd | |
| JPH08274133A (en) * | 1993-05-18 | 1996-10-18 | Tokyo Electron Ltd | Semiconductor wafer prober |
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