JPS61154044A - Probe card of prober - Google Patents

Abstract

PURPOSE:To dispose precisely the electrodes of a probe card by using photographic printing techniques, to enable the measurement of a substance having many portions to be measured, and to facilitate handling, by a construction wherein electrodes formed of conductors having elasticity, such as conductive rubber, are struck on the substrate of the probe card formed of a transparent material such as glass, and the electrodes are pressed on the substance to be measured. CONSTITUTION:The substrate 11 of a probe card is formed of a transparent material such as glass. The electrodes 12 of the probe card are formed of conductors having elasticity, such as conductive rubber, and are disposed on the substrate 11 of the probe card by using photographic printing techniques or the like. Position-matching marks 13 are fitted on the substrate 11 of the probe card. The electrodes 12 of the probe card, which correspond to conventional probes, are formed in conformity with an electrode pattern of a semi-conductor element, and measurement is conducted by pressing the electrodes of the element directly thereon. Accordingly a warp or others of the semiconductor element can be absorbed by the elasticity of these electrodes 12 of the probe card. Since the position-matching marks 13 are fitted on the portions not affecting the characteristics of the element, the position-matching of the element with the probe card can be executed with ease.

Description

DETAILED DESCRIPTION OF THE INVENTION [Industrial Field of Application] The present invention relates to a probe car 1'KIgt of a prober used for manufacturing, measuring and inspecting characteristics of semiconductor devices.

[Conventional technology]

It is difficult to manufacture semiconductor devices with good characteristics across the entire wafer, and there are many cases where the entire device becomes defective due to a defect in just a small part of the wafer. To prevent this, it is important to examine the characteristics of each part and, if a defective part is found, take appropriate measures to maintain a certain level of yield in the manufacture of semiconductor devices. Furthermore, even if no treatment is taken, it is essential to confirm the characteristics. The device for measuring this characteristic is generally called a proper, and the one on which the substrate κ probe is placed in pressure contact with the object to be measured is called a prober probe card.● Figure 43 is a bottom view of a conventional probe card. , the probe card is composed of a substrate IK and a plurality of probes 2. Generally, such a probe card has a number of probes 2 on a substrate 1, so that it is possible to measure many parts of a semiconductor device at once.

FIG. 4 is a front view showing the state in which the probe card shown in FIG. 3 is pressed into contact with the object to be measured. 3 is a substrate of a semiconductor element such as silicon, 4 is an electrode of the semiconductor element, and the probe card is arranged as shown in the figure. The characteristics are measured using a curve tracer (not shown) or the like.

[Problem that the invention seeks to solve]

Semiconductor devices are generally manufactured with precision in the micron range, so the probes 2 of the probe card must also be manufactured in the micron range, and current technology has limits to accuracy and the pitch of the measurement points is limited. If it is clogged, it cannot be manufactured. In addition, the probe 2 is exposed and difficult to protect, and the accuracy is easily lost due to a slight impact.Furthermore, pressing the probe 2 may damage the electrode 4, and if done incorrectly, the underlying substrate 3 of semiconductor elements such as silicon may be damaged. It may also injure the
Requires considerable care in use or storage. Furthermore, since the alignment of the probe 2 and the electrode 4 of the semiconductor element involves physical alignment, a certain amount of training is required, and the alignment method must be considered for each type of semiconductor element.

The present invention solves the above-mentioned problems, and provides a probe card for a probe card that uses photo printing technology to arrange the electrodes of the probe card with high accuracy, can measure objects with many measurement points, and is easy to handle. The purpose is to

[Means for solving problems]

The present invention uses a transparent material such as glass for the substrate of the probe card, uses a stretchable conductor such as conductive rubber for the electrodes of the probe card, and uses photo printing technology to arrange the electrodes on the substrate of the probe card. This was done using a method to ensure a highly accurate finish.

[Effect]

In the present invention, the electrode of the probe card, which corresponds to the conventional probe, is precisely finished using photo printing technology along the electrode pattern of the semiconductor element, so there is no problem with accuracy that prevents measurement, and there is no problem with the structure. Since it can have a certain area, it can withstand use even if it is slightly damaged or peeled off, and is easy to handle. In the case of measurement, the electrodes of the semiconductor element are directly pressed against each other. Therefore, warping of the semiconductor element can be absorbed by the elasticity of the electrodes of the probe card.

〔Example〕

FIG. 1 is a bottom view showing one embodiment of a probe card of a prober according to the present invention. In the figure, 11 is a substrate of the probe card, 12 is an electrode of the probe card, and 13 is an alignment mark. The substrate 11 of the probe card is made of a transparent material such as glass. The electrodes 12 of the probe card are made of a stretchable conductor such as conductive rubber, and are arranged on the substrate 11 of the probe card by photo printing technology or the like. The alignment mark 13 is on the substrate 1 of the probe card.
It is installed on 1. On the right, for measurement, each electrode 1
From 2, conductive wires are molded on printed wiring made of aluminum or steel, or on the board 11, and the wires are drawn out.

In this invention, the electrode 12 of a probe card, which corresponds to a conventional probe, is constructed along the electrode pattern of a semiconductor element, and measurements are made by directly pressing the electrode of the element. Therefore, warping of the semiconductor element can be absorbed by the elasticity of the electrode 12 of this probe card. Furthermore, since the alignment mark 13 is provided in a portion that does not affect the characteristics of the element, alignment between the element and the probe card can be easily performed.

FIG. 2 is a front view showing the state in which the probe card of the prober shown in FIG. Then, the characteristics are measured using a curve tracer (not shown) or the like in the same way as before.

As described above, since the present invention uses photo printing technology to arrange the electrodes 12 of the probe card, it can be finished with high precision.Currently, semiconductor elements themselves are also patterned using photo printing technology, so accuracy can be improved. There are no problems that prevent measurement, and since the structure can be made to have a certain area, it can withstand use even if it gets scratched or peeled off, and it is much easier to handle than a probe type. . Once the master is created, the rest can be easily made by copying, so it can be done inexpensively, and alignment marks are attached to make alignment easier.Furthermore, the wiring can be printed or molded. Therefore, the shape can be made very simple.

〔Effect of the invention〕

As mentioned above, the present invention uses photo printing technology to arrange the electrodes of the probe card, so it can be finished with high precision, and even objects with many measurement points can be measured with high precision, and alignment work is facilitated. Furthermore, it is easy to handle and inexpensive.

[Brief explanation of drawings]

Fig. s1 is a bottom view showing an embodiment of the probe card of the prober according to the present invention, Fig. 2 is a front view showing the state in which the probe card of the prober of Fig. 1 is pressed against the object to be measured, and Fig. 3 is a conventional probe. A bottom view showing the card, and FIG. 4 is a front view showing the state in which the probe card shown in FIG. Probe card probe, 3.14・
... Substrate of semiconductor element, 4.15 ... Electrode of semiconductor element, 12 ... Electrode of probe card, 13 ... Provided on substrate 11 of probe card alignment marks.

Claims (1)

[Claims] The probe card substrate is made of transparent material such as glass.
A probe card for a prober, characterized in that an electrode made of a stretchable conductor such as conductive rubber is attached and the electrode is pressed into contact with an object to be measured.