JPS59214235A - Method and apparatus for inspecting semiconductor wafer - Google Patents

Abstract

PURPOSE:To carry out adjustment-free inspection without giving any damage on the surface of semiconductor wafer connecting pad by supplying the power after pressurizingly placing in contact a pressure sensitive and multi-directional electrical conductive rubber sheets with a connecting pad of semiconductor wafer circuit. CONSTITUTION:A circuit 2 having various functions and a connecting pad 3 are provided on a semiconductor wafer 1. A pressure sensitive and multi-directional electrical conductive rubber sheet 4 is provided at the upper part of wafer 1 and this sheet is pressurized while it is in contact with the connecting pad 3 of semiconductor wafer circuit. Thereby the functions of wafer circuit can be checked quickly and easily without positioning or balance adjustment which normally requires a long period of time.

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a method and apparatus for testing a semiconductor wafer, and more specifically, the present invention relates to a method and apparatus for testing a semiconductor wafer, and more specifically, a non-directional conductive rubber sheet is pressed onto the surface of a semiconductor wafer, which is an object to be tested. By contacting and energizing the jig circuit board and the contact probe,
The present invention relates to a method and equipment for inspecting whether the functions of a semiconductor wafer circuit are good or bad.

Conventionally, as a method for inspecting whether the functions of a semiconductor wafer circuit are good or bad, a device such as the one shown in the cross-sectional view of Figure 1 is used to inject tungsten into the connection pad (b) of the semiconductor wafer circuit (a). A method has been implemented in which the functionality of the semiconductor is tested by bringing the prober needle (/N) into contact with the prober needle, energizing it, and connecting it to an electrical control device.

However, according to the above conventional method, since the tungsten blowbark 1) is thin and hard needle-shaped, the connection pad surface (o) of the semiconductor wafer that comes into contact with the tungsten blowbark 1) is thin and hard.
were scratched, causing defects in electrical connections such as wire bonding.

Unfortunately, the tungsten prober must be positioned according to the position and shape of the semiconductor connection pad, and complicated balance adjustments must be made, making these adjustments difficult. The drawback was that it took a long time to assemble.

Therefore, the present invention eliminates and improves the drawbacks of the above-mentioned conventional method, and instead of using a tungsten prober, a pressure-sensitive anisotropically conductive rubber sheet is pressed into contact with the connection pad of the semiconductor wafer circuit and energized. The present invention proposes a new method and device for testing semiconductor wafers that does not damage the surface of connection pads, does not require adjustment of testing equipment, and is quick and easy.

Embodiments of the present invention will be specifically described below with reference to the drawings.

FIG. 2 is a sectional view showing an example of the semiconductor wafer inspection apparatus of the present invention.

In this drawing, (1) is a semiconductor wafer, and circuits having various functions are usually provided on the surface of the silicone wafer, and connection pads are provided around the circuits. (2) is a circuit having various secret functions, and for example, a circuit having functions such as a memory, an LSI such as a CPU, a normal IC, a hybrid IC, or an analog IC is formed. (3) is a connection pad, which is connected to the circuits having the various functions described above and is electrically connected to the outside by wire bonding or the like.

Next, (4) is a pressure-sensitive anisotropic conductive rubber sheet,
By compressing this conductive rubber sheet, conductivity is developed. That is, the conductive proboscis that is scattered in different directions in this sheet-like material is compressed to develop conductivity, and a portion of the sheet-like material is electrically conductive.

In the present invention, the conductive rubber sheet material is pressed while being in contact with the connection pad (3) of the semiconductor wafer circuit, so that the surface of the connection pad is coated with a conventional tungsten prober. To easily and quickly inspect the functional quality of a semiconductor wafer circuit without causing any damage as in the field, and without requiring positioning that takes a long time or f'd mfffl balance adjustment of a tungsten prober. It is characterized by This is based on the fact that the conductive rubber sheet becomes conductive when compressed, and the principle feature is to utilize this characteristic.

(5) is an inspection jig circuit board, and ordinary printed circuit boards, flexible printed circuit boards, multilayer printed circuit boards, ceramic boards, etc. are used.

As shown in the plan view of FIG. 3, this jig circuit board has test edges (6) corresponding to connection pads of a semiconductor wafer circuit.
and a contact probe pad (7) are connected by a lead wire (8), and these are provided on the surface of this circuit board.

On the other hand, (9) in FIG. 2 is a fixture for mounting the circuit board of the test jig, and is made of various materials such as metal or plastic. (1
0) is a contact probe, which is usually made of a conductive material such as metal with a diameter of about 1 to 2H, and has a pointed tip.
It is easy to fit into the contact pad hole. Therefore, by pressing it into a clamped state using a pressurizing device, it fits into the pad (7) of the circuit board of the test jig and is electrically connected by energization.

This contact probe is attached to either or both of the insulating plate (11) and the adjacent smooth plate (work 2).

Yes, the contact probe is connected to the electrical control equipment via the connection cord (15).

On the other hand, on the supporting stand side of the pressurizing device directly facing this, an insulating plate (11), for example, a plastic insulating plate and a smooth plate (
12) For example, there is a smooth plate made of metal, and an elastic body (14), such as a smooth plate having cushioning properties such as rubber or plastic foam, is attached to the surface of the insulating plate via an adhesive layer (13). It is being In this case, the conductive rubber sheet-like object (4) and the elastic body (14
) in order to press it smoothly, accurately, and uniformly in a cushioned state.

FIG. 3 is a plan view of the test jig circuit board. In this drawing, reference numeral (6) is the test end, which is a body portion of a conductive material usually made of copper foil or various metal layers. (7) is a pad for a contact probe, and is a conductive hole drilled in the jig circuit board. (8) is a take-out circuit that electrically connects the test end and the contact probe. Usually, the copper foil layer of the printed circuit board is the part where the circuit is formed by etching.

When the semiconductor wafer circuit inspection apparatus of the present invention configured as described above is pressed and energized, the contact probe and the circuit board of the inspection jig circuit board and the anisotropically conductive e-rubber sheet form. By applying electricity to the connection pads of the object to be inspected via the object, the functional quality of various semiconductor wafer circuits can be easily and quickly inspected through electrical control.

In other words, according to the present invention, it is possible to simply and quickly test the functionality of a semiconductor without damaging the connection pads or the like of the semiconductor.

[Brief explanation of the drawing]

FIG. 1 is a sectional view of a conventional semiconductor wafer inspection apparatus, FIG. 2 is a sectional view of the semiconductor wafer inspection apparatus of the present invention, and FIG. 3 is a plan view of a circuit board of an inspection jig. (1)... Semiconductor wafer, (2)...
・・・・・・Circuit with various functions, (3)・・・・・・
・・・Connection pad, (4)・・・・・・Pressure-sensitive anisotropic conductive rubber sheet, (5)・・・・・・・・・
Inspection jig circuit board, (6)......Detection end,
(7)・・・・・・Takeout circuit, (8)・・・・・・
... Pad for contact probe, (9) ...
...Mounting tool, (10)...Contact probe, (11)...Insulation plate, (12)...
..... Flat plate slip, (13) ..... Adhesive layer, (14) ..... Elastic body, (15) ...
...Connection code. Name of Patent Applicant IBIDEN Co., Ltd. Representative Jun Taga Part 1 Figure 7-(〜-- / 3rd (6)

Claims (1)

[Claims] 1. A semiconductor wafer of an object to be inspected and an inspection jig circuit board are directly faced, and a pressure-sensitive anisotropically conductive rubber sheet is placed between the semiconductor wafer and the inspection jig circuit board. 1. A method for inspecting a semiconductor wafer, which comprises sandwiching an object, pressurizing and energizing the two together, and inspecting the functionality of a semiconductor wafer circuit via an electric control device. 2. A test jig circuit board is provided that presses a rubber sheet-like object and energizes the surface of a semiconductor wafer to be inspected. It is equipped with an inspection end, an extraction circuit connected to the test end, and a contact probe pad connected to the test end, the contact probe is mounted on a smooth plate or an insulating plate adjacent to the same, and the contact probe is attached to a smooth plate or an insulating plate adjacent thereto, and the semiconductor wafer circuit connection pad and jig are provided. A semiconductor wafer inspection device comprising an electric control device disposed so as to directly face the inspection end of a circuit board and connected thereto, and a pressurizing device for clamping these together.