JP2000030826A - Bga package measuring socket - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a BGA(ball grid array) package measuring socket, in which damage to solder balls is prevented so that a defect in appearance is reduced, and which has a reduced contact resistance so that stable measurement is realized. SOLUTION: An anisotropic conductive rubber sheet 6, in which gold wires 6b are embedded in a rubber sheet 6a made of an insulator is disposed on a measuring board 2, while a connection sheet 7 made of a silicone rubber and the like is disposed on the anisotropic conductive rubber sheet 6. The connection sheet 7 is formed with through holes 7c corresponding to respective positions of solder balls 1c of a BGA package 1, while contacts 7b made of a conductor are fixed in the through holes 7c such that the contacts 7b contact with the anisotropic conductive rubber sheet 6. When the BGA package 1 on the connection sheet 7 is pressed all the solder balls 1c are contacted with the corresponding contacts 7b so that terminals 2a on the measuring board 2 are electrically connected to the solder balls 1c.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a measuring socket for mounting and removing a semiconductor device package when checking the operation of the semiconductor device package, and more particularly to a BGA (Ball Grid Array) package having terminals formed by solder balls. It relates to a socket for measurement.

[0002]

2. Description of the Related Art In a BGA package on which a semiconductor element is formed, terminals are formed by hemispherical solder balls, and when manufactured, a test is carried out by energizing to check whether the terminal operates normally. At the time of the measurement, the solder balls and the terminals on the measurement substrate are conductively connected by the BGA package measurement socket to which the BGA package can be attached and detached.

As shown in FIG. 1, a conventional BGA package measuring socket includes a plurality of Y-shaped contact pins 3 which come into contact with solder balls 1c of a BGA package 1 having a semiconductor element 1b formed on a substrate 1a. Some components are integrally configured by the unit 20. Then, one end 3b of the contact pin 3 is used by being soldered to the measuring substrate 2 by the solder 4.

[0004] As shown in FIG. 2, there is a type in which an anisotropic conductive rubber sheet 6 is laid between a measurement substrate 2 and a BGA package 1. FIG. 3 is an enlarged view of a main part of FIG.
As shown in the figure, the anisotropic conductive rubber sheet 6 is such that a gold wire 6b having a thickness of several μm is embedded in an insulating rubber sheet 6a so as to penetrate parallel to the front and back at a predetermined angle θ at a predetermined interval. Is what is being done.

The BGA package 1 is placed on the anisotropic conductive rubber sheet 6 so that the positions of the terminals 2a on the measurement substrate 2 correspond to the positions of the solder balls 1c. 1c contacts the gold wire 6b, and the gold wire 6b contacts the corresponding terminal 2a.

As shown in FIG. 4, a plurality of extensible contact pins 5 urged by a compression spring 5c on a movable pin 5a slidable in an outer cylinder 5b are integrally formed by a main body 20. There is. Then, the solder ball 1c is brought into contact with one end 5e of the contact pin 5, and the other needle-like end 5d comes into contact with a terminal (not shown) of the measurement substrate 2 for use. I have.

[0007]

However, according to the structure shown in FIG. 1, when the size of the solder ball 1c varies, the small-sized portion of the solder ball 1c contacts the contact surface 3a of the contact pin 3. Otherwise, the measurement of the BGA package 1 cannot be performed. In addition, when even one contact pin 3 is damaged, it is necessary to replace the main body 20 and the measurement substrate 2, and there is a problem that maintenance cost is required.

According to the structure shown in FIGS. 2 and 3, the variation in the size of the solder ball 1c can be absorbed by the elasticity of the anisotropic conductive rubber sheet 6, but the small solder ball 1c ' The contact area with the rubber sheet 6 is reduced, and the number of gold wires 6b in contact with the rubber sheet 6 is reduced. As a result, the contact resistance becomes large and stable measurement cannot be performed. In addition, when the number of the contacting gold wires 6b becomes one or two, when the measurement current is applied, the gold wire 6b burns out and the measurement becomes impossible. There's a problem.

FIG. 5 shows a further enlarged view of the contact portion between the solder ball 1c and the anisotropic conductive rubber sheet 6.
In the anisotropic conductive rubber sheet 6, gold wires 6b slightly protrude from both sides of the rubber sheet 6a in order to prevent poor contact.
Further, since the gold wire 6b is harder than the solder, there is a problem that a spot-like scratch 1d is formed on the solder ball 1c by the protruding gold wire 6b, resulting in poor appearance.

In the case where the measurement substrate 2 is commonly used for different types of BGA packages as shown in FIGS. 6A and 6B, the BGA package 10 of a certain type has anisotropy. A through hole 6c is provided in the conductive rubber sheet 6 at a position corresponding to the predetermined solder ball 10c so that output from the solder ball 10c cannot be taken out. In the BGA package 10 'of another model, the anisotropic conductive rubber sheet 6 In order to prevent the output from the solder ball 10c 'from being provided by providing a through hole 6c' at a position corresponding to the predetermined solder ball 10c ', an expensive anisotropic conductive rubber sheet 6, 6 'Has to be created, so there is a problem that the maintenance cost increases.

According to the configuration shown in FIG. 4, the solder balls 1c
Can be absorbed by the compression spring 5c. However, when the measurement substrate 2 is commonly used for different types of BGA packages 1, the expensive expandable and contractable contacts are used for each model in the same manner as described above. Since it is necessary to create the main body 20 having a large number of pins 5, there is a problem that maintenance costs increase.

SUMMARY OF THE INVENTION It is an object of the present invention to provide a BGA package measuring socket capable of preventing a solder ball from being damaged, reducing appearance defects, and reducing the contact resistance to enable stable measurement. Another object of the present invention is to provide a socket for measuring a BGA package which can reduce maintenance costs.

[0013]

According to a first aspect of the present invention, there is provided a semiconductor device having a plurality of terminals having a plurality of terminals which are conductively connected to a semiconductor element and have curved end faces.
In a BGA package measurement socket in which a GA package is attached and detached at the time of measuring electrical characteristics, a first sheet in which a plurality of conductive wires penetrating from front to back in an elastic insulator is disposed in parallel, and the first sheet is disposed on the first sheet. A second sheet made of an elastic insulator having a plurality of through holes corresponding to the positions of the terminals; and a conductor fixed in the through holes such that one end surface is in contact with the first sheet. The BGA package can be measured by disposing one sheet on a measurement substrate and pressing the terminal into contact with the other end of the conductor.

According to this configuration, the first sheet such as an anisotropic conductive rubber sheet is disposed on the measurement substrate, and the second sheet such as silicon rubber is disposed on the first sheet. Second
A through hole corresponding to each position of the solder ball of the BGA package is provided in the sheet, and a conductor is fitted into the through hole so as to be in contact with the first sheet and is fixedly integrated with the second sheet. . In the BGA package installed on the second sheet, all the solder balls come into contact with the corresponding conductors by pressurization, and furthermore, the conduction between the terminals on the measurement board and the solder balls via the anisotropic conductive rubber sheet. You can get it.

[0015]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described with reference to the drawings. For convenience of explanation, the same members as those in the conventional example of FIGS. 1 to 6 are denoted by the same reference numerals. (A) of FIG.
(B) is a BGA package measuring socket 2 of the present invention.
It is the top view and schematic side view which show one Embodiment.

The BGA package measuring socket 21 is
It comprises a guide frame 8, an anisotropic conductive rubber sheet 6, a connection sheet 7 and a pressing tool 12. A guide frame 8 fixed to the measurement substrate 2 with bolts 9 and nuts 11 has an insertion hole 8a into which the BGA package 1 can be inserted, and a notch 8b into which a finger enters when the BGA package 1 is manually detached. Is provided.

An anisotropic conductive rubber sheet 6 is disposed on the measurement substrate 2. As shown in FIG. 8, a connection sheet 7 in which a contact 7b made of a conductor is fixed to a through hole 7c provided in an insulation sheet 7a made of an elastic insulator such as silicon rubber as shown in FIG. I have. The contact 7b is formed of a material such as a metal such as beryllium copper, copper, or gold, or a conductive resin, and the connection sheet 7 can be formed at low cost by using an inexpensive material. Then, the BGA package 1 is set on the connection sheet 7, and the BGA package 1 is pressed by the pressing tool 12.

When the BGA package 1 is automatically measured, the pressing device 12 is moved from the retracted position indicated by the alternate long and short dash line 12 'to the pressing position (12) by an automatic carrier (not shown), and Pressurization is performed. Then, the solder balls 1c of the BGA package 1 are conductively connected to the measurement substrate 2, and the measurement is performed. Here, a chuck mechanism using a vacuum pressure or the like may be provided in the pressing tool 12 so that the BGA package 1 is chucked by the pressing tool 12 so that the BGA package 1 is attached to and detached from the BGA package measuring socket 21 and transported.

At the time of manual measurement, the pressurizing tool 12 may be provided integrally with the guide frame 8 so as to rotate between the retracted position indicated by the alternate long and short dash line 12 '' and the pressurized position (12). It is desirable that the pressurizing tool 12 be detachable because it can cope with automatic measurement and manual measurement.

FIG. 9 is an enlarged view of a main part of FIG. 9 showing a connection state between the measurement substrate 2 and the BGA package 1 in a pressurized state.
The contact 7b is provided at a position corresponding to the solder ball 1c, and a conical recess 7e provided at one end contacts the solder ball 1c. The flat part 7d at the other end of the contact 7b is in contact with the insulating sheet 6a and the gold wire 6b, and the gold wire 6b is in contact with the terminal 2a of the measurement substrate 2.

According to the BGA package measuring socket 21, even if the size of the solder ball 1c varies as shown in FIG. 9, the solder ball 1c is reliably absorbed by the elastic deformation of the connection sheet 7 and the anisotropic conductive rubber sheet 6. To terminal 2
a and the solder ball 1c are conducted to enable measurement. Since the solder ball 1c is in contact with the contact 7b, the appearance defect can be reduced without causing a spot-like scratch 1d due to the gold wire 6b.

Further, since the shape of the end face of the contact 7b that contacts the solder ball 1c is a conical concave portion 7e, the pitch between the solder ball 1c and the pitch at which the contact 7b is formed can be reduced. If there is an error, the elasticity causes the connection sheet 7 to expand and contract in the pitch direction to absorb the error. Therefore, the solder ball 1c can be brought into linear contact with the inner peripheral wall surface of the concave portion 7e, and it can be prevented that the contact resistance increases due to the point contact. Contact 7
The shape of the concave portion 7e of b may be a pyramid shape and may be in contact with the solder ball 1c at many points, or may be another shape.

Since the shape of the end face of the contact 7b in contact with the anisotropic conductive rubber sheet 6 is a flat plane portion 7d, the contact area between the contact 7b and the anisotropic conductive rubber sheet 6 is as shown in FIG. As described above, it becomes almost constant irrespective of the size of the solder ball 1c.
Can be contacted. Therefore, the contact resistance can be stabilized and stable measurement can be performed, and the gold wire 6b does not burn out when the measurement current flows.

Further, when the measurement substrate 2 is commonly used for different types of BGA packages 1, the connection sheet 7 having no contact 7b at a portion corresponding to the solder ball 1c which is not electrically connected to the measurement substrate 2 is used. May be created for each model. Accordingly, since an inexpensive connection sheet 7 is created instead of creating an expensive anisotropic conductive rubber sheet 6 for each model, maintenance costs can be reduced.

[0025]

According to the first aspect of the present invention, it is possible to prevent the solder balls from being damaged and to reduce the appearance defect, and to keep the number of gold wires in contact with the contacts almost constant to reduce the contact resistance. An increase can be prevented, and stable measurement can be performed. In addition, when a measurement board is commonly used for BGA packages of different models, an inexpensive connection sheet may be created for each model, so that maintenance costs can be reduced. Furthermore, it is possible to support both manual measurement and automatic measurement by attaching a detachable pressurizing tool.

[Brief description of the drawings]

FIG. 1 is a configuration diagram of a conventional BGA package measurement socket.

FIG. 2 is a configuration diagram of another conventional BGA package measuring socket.

3 is an enlarged view of a main part of a socket for measuring a BGA package in FIG. 2;

FIG. 4 is a configuration diagram of another conventional BGA package measuring socket.

FIG. 5 is an enlarged view of a main part of the BGA package measuring socket in FIG. 3;

FIG. 6 is a diagram illustrating a problem of a conventional socket for measuring a BGA package.

FIG. 7 is a configuration diagram of a BGA package measurement socket according to the embodiment of the present invention.

FIG. 8 is a sectional perspective view of a connection sheet of the BGA package measuring socket according to the embodiment of the present invention.

FIG. 9 is a sectional view of a main part of a socket for measuring a BGA package according to the embodiment of the present invention.

[Explanation of symbols]

 1,10 BGA package 1c Solder ball 2 Measurement board 3,5 Contact pin 6 Anisotropic conductive rubber sheet 6b Gold wire 7 Connection sheet 7b Contact 8 Guide frame 12 Pressing tool

Claims (1)

[Claims] 1. A BGA package measuring socket in which a BGA package having a plurality of terminals having a curved surface and electrically connected to a semiconductor element and having a curved surface is detachably attached at the time of measuring electrical characteristics. A first sheet in which a plurality of conducting wires are embedded in parallel, a second sheet made of an elastic insulator disposed on the first sheet and having a plurality of through holes corresponding to the positions of the terminals, and one end face And a conductor fixed in the through-hole so as to be in contact with the first sheet. The first sheet is disposed on the substrate for measurement, and the terminal is pressed against the other end surface of the conductor. A BGA package measurement socket characterized in that the measurement of a BGA package can be performed by using the same.