JPH0513526A - Semiconductor device - Google Patents

Abstract

PURPOSE:To make a contact pin having a large diameter and high allowable stylus pressure usable for inspections so as to improve the reliability of the inspections by adjacently arranging lands having different lengths measured from the edge of a substrate. CONSTITUTION:Rectangular lands 2a the length of which from the edge of a thick-film substrate 1 is l1 and rectangular lands 2b the length of which from the edge of the substrate 1 is l2 are alternately arranged in the end section of the substrate 1. Circuit inspections are performed by bringing a pencil type contact pin into contact with the lands 2a and 2b. After inspection, leads are fitted to the lands 2a and 2b. In case the contact pin is to be brought into contact with the point on the lands 2b at a distance l1/2 from the front end of the lands 2b when the pitch A of the lands 2a and 2b and the internal B between contact pins are constant, the radius (r) of the contact pin becomes r=[{(l2-l1)<2>+A<2>}<1/2>-B]/2. Therefore, the radius (r) of the contact pin can be increased by increasing the value (l2-l1).

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor device, such as a hybrid integrated circuit device, in which lands are arranged on a substrate.

[0002]

2. Description of the Related Art FIG. 3 is a plan view showing a conventional semiconductor device, in which 1 is a thick film substrate. Rectangular lands 2, 2, ... Are arranged at a pitch A on the edge of the thick film substrate 1. The lands 2, 2, ... Are contacted with pencil-type contact pins 3, 3, ... As shown in FIG. 3 and 4, r is the contact pin 3, 3,
, Radius B indicates the distance between the contact pins 3, 3 ,. After inspecting the circuit as described above, the leads are attached to the lands 2, 2, ....

[0003]

In the semiconductor device as described above, the predetermined distance B between the contact pins 3, 3 must be maintained in order to avoid contact between the contact pins 3, 3, .... Therefore, when the land pitch A is short, the radius r of the contact pins 3, 3, ... Is reduced, and it becomes necessary to perform precise and difficult processing on the probe card for fixing the contact pins 3, 3 ,. Was there. When the diameter of the contact pin is reduced, the allowable current capacity is reduced, and the stylus pressure that can be applied to the pin is reduced, so that reliable contact cannot be made and accurate inspection cannot be performed.

The present invention has been made in view of the above circumstances and uses contact pins having a large diameter and a high allowable stylus pressure by arranging lands having different lengths from the edge of a substrate adjacent to each other. It is an object of the present invention to provide a semiconductor device capable of improving the reliability of inspection without requiring precise and difficult processing on the probe card.

[0005]

In a semiconductor device according to the present invention, lands having different lengths from the edge of the substrate are arranged next to each other on a substrate on which a plurality of leads are to be mounted. .

[0006]

By arranging lands having different lengths from the edge of the substrate adjacent to each other, the diameter is large and the allowable stylus pressure is high when the land pitch and the contact pin spacing are set to predetermined values. It becomes possible to use the use of contact pins.

[0007]

1 is a plan view showing a semiconductor device according to the present invention, in which 1 is a thick film substrate. At the end of the thick film substrate ₁ , there are rectangular lands 2a, 2a, ..., Which have a length l ₁ from the edge of the thick film substrate, and l ₂ (l ₂ > l ₁ ) from the edge. Rectangular lands 2b, 2b, ... Are alternately arranged. A indicates the pitch of the lands 2a and 2b. The lands 2, 2, ... Are contacted with pencil-type contact pins 4, 4, ... As shown in FIG. 1 and 2, r is a contact pin 4,
The radius of 4, ..., B represents the distance between the contact pins 4, 4 ,. After inspecting the circuit as described above, lands 2a, 2a, ... And lands 2b, 2b ,.

When the land pitch A and the contact pin spacing B are constant, in the conventional semiconductor device shown in FIG. 4, the relational expression of 2r + B = A is established, so that the radius r of the contact pin is r = (A -B) / 2. On the other hand, in the semiconductor device of the present invention shown in FIG.
, b, 2b, ... If the contact pins 4, 4, ... Are brought into contact with the position of l _1/2 from the tip thereof (2r
Since the relational expression of + B) ² = A ² + (l ₂ −l ₁ ) ² is established, the radius r of the contact pin is r = [{(l ₂ −l ₁ )
² + A ^{2} 1/2} -B] is / 2. Therefore, l ₂ −l ₁
The radius of the contact pin can be increased by increasing.

[0009]

As described above, in the semiconductor device of the present invention, since the lands having different lengths from the edge of the substrate are arranged adjacent to each other, use of the contact pin having a large diameter and a high allowable stylus pressure is used. It is possible to improve the reliability of the inspection. Further, when the diameter of the contact pin is large, it is not necessary to perform precise and difficult processing on the probe card, the life of the contact pin itself is extended, and its maintainability is improved, and the present invention has excellent effects. .

[Brief description of drawings]

FIG. 1 is a plan view showing a semiconductor device according to the present invention.

FIG. 2 is a perspective view showing an implementation state when a contact pin is brought into contact with a land to perform an inspection.

FIG. 3 is a plan view showing a conventional semiconductor device.

FIG. 4 is a side view showing an implementation state when a contact is brought into contact with a conventional land to perform an inspection.

[Explanation of symbols]

 1 Thick film substrate 2a land 2b land

Claims (1)

Claim: What is claimed is: 1. In a semiconductor device in which a plurality of leads are to be mounted along an edge of a substrate, lands having different lengths from the edge of the substrate are adjacent to each other. A semiconductor device characterized in that the semiconductor devices are arranged in a row.