JPS6141232Y2 - - Google Patents

Description

[Detailed Description of the Invention] (1) Technical Field of the Invention This invention relates to an improvement in an integrated circuit measuring device in which a probe needle, which was conventionally fixed only by a probe card, is further fixed to another support.

(2) Background of the Technology In the manufacturing process of semiconductor devices, a semiconductor wafer is processed to form a large number of semiconductor devices on the wafer, and each of these devices is individually cut to form each chip. Prior to cutting such a wafer, electrical testing is performed on each device.

The probe card used for such tests is
The rear view is shown in the figure. In the figure, reference numeral 1 indicates a probe card having a size of, for example, 12 cm x 10 cm, 2 indicates a ring-shaped probe needle fixing body made of, for example, resin, and 3 indicates a probe needle. The probe card is a printed circuit board (the printed circuit is not shown), and one end of the probe needle is soldered to the printed circuit, which is connected to the tester via terminals 4.

The arrangement of such a probe card 1 is shown in FIG. 2 in a side sectional view. Note that in FIG. 2 and subsequent figures, the same parts as those already illustrated are designated by the same reference numerals.
In the figure, reference numeral 5 indicates a wafer placed on a stage 6. During the measurement, the stage 6 is raised and the pad of the device portion 7 of the wafer 5 (this is the portion that will become the chip in a later process, so it will be abbreviated as the chip below) is brought into contact with the probe needle 3 for measurement. I do. Although only two probe needles are shown in FIG. 2, more probe needles are actually used. When the measurement is completed, the stage 6 is lowered, moved in one direction, and raised again to bring the next tip into contact with the probe needle.

(3) Prior art and problems Conventionally, 8 to 16 probe needles were arranged on one probe card. For example, in the case of 16 probe needles, it was sufficient to arrange 4 probe needles on one side of the probe card. However, as the density of integrated circuits has increased, nearly 60 probe needles have come to be used.

Under these circumstances, some chips at the edge of the wafer come into contact with the pad with the probe needle, while others do not. Additionally, some probe needles may have elongated tips so that not all probe needles contact the pad with uniform pressure. Furthermore, the first
Some needles, such as the probe needle shown at 3' in the figure, must be bent to be particularly long due to their arrangement. This means that if you try to place all the tip sections of the probe needles in an equal relationship, if there are more probe needles on one side of the probe card than on the other, some needles 3' This is unavoidable because it may be necessary to arrange them as shown. If this happens, the pressure applied to the pad will not be uniform, which will adversely affect the measurement. Additionally, the tip of the probe needle may slip, causing a larger scar and poor contact with the pad. Such problems are
As mentioned above, as the density of integrated circuits increases and the number of test items for each chip increases, the problem will become even worse.

(4) Purpose of the invention In view of the above-mentioned drawbacks of the conventional technology, the present invention aims to provide an integrated circuit measuring device that applies even pressure to the tips of all probe needles even when there are a large number of probe needles arranged on a probe card. The object is to provide a device that accurately contacts the pad of the chip.

(5) Structure of the invention According to the invention, the purpose is to fix a plurality of probe needles to a fixed body attached to a probe card, and connect the tips of the probe needles to pads provided on a device formed on a semiconductor wafer. In a device that measures an integrated circuit by bringing the probe needle into contact with the probe card, the probe needle is fixed to the probe card at a position away from the fixed body attached to the probe card toward the needle tip, and equidistant from the needle tip of the probe needle. This is achieved by providing an integrated circuit measuring device in which a free support, separate from the probe immobilizer, is connected to each probe needle at a certain location.

(6) Example of implementation of the idea Embodiments of the present invention will be described in detail below with reference to the drawings.

3 and 4 are views similar to FIGS. 1 and 2 of an integrated circuit measuring apparatus according to an embodiment of the present invention. In this embodiment, the probe card 1, fixed body 2, and probe needle 3 are the same as those of the conventional one, and the terminal 4, wafer 5, stage 6, and chip 7 are omitted. In this embodiment, the conventional fixing body 2
In addition, a ring-shaped support 8 made of a rigid resin material, for example, is prepared. Fixed body 2 attached to probe card 1 as in the case of the prior art
The tip portion of each probe needle 3 fixed by the above is fixed again to the support 8 by, for example, an adhesive, and then the tip portion is bent appropriately as in the conventional manner so that the needle tip comes into contact with the pad of the tip. Make it. As a result, even if the lengths of the probe needles 3 to the fixed body 2 are uneven, the length of each probe needle 3 from the fixed body 2 to the support body 8 is uniform, so that each needle tip has a uniform length. will be under uniform pressure, and since they will all be in contact with the pads of the chip with uniform pressure, the accuracy of the measurement will be guaranteed.

Although the above embodiment has been described for the case where the probe card has a rectangular shape, the present invention can be practiced even when the probe card has a circular shape, and the shape and function of the support body are completely different. There is nothing that will change.

(7) Effects of the invention As explained above in detail, in the integrated circuit measuring device according to the invention, by providing the support 8, even if the number of probe needles increases, the tips of the probe needles can be made uniform. Since it ensures pressure contact with the pads of the chip, it is highly effective in improving the efficiency and reliability of integrated circuit measurement operations.

[Brief explanation of the drawing]

Figure 1 is a rear view of a conventional probe card, Figure 2 is a back view of a conventional probe card.
This figure is a side sectional view of a conventional integrated circuit measuring device using the probe card of FIG. 1, and FIGS. 3 and 4 are views similar to FIGS. 1 and 2 of the embodiment of the present invention. 1... Probe card, 2... Fixed body, 3,
3'... Probe needle, 4... Terminal, 5...
Wafer, 6... Stage, 7... Chip, 8...
support.

Claims (1)

[Scope of utility model registration request] In an apparatus that measures an integrated circuit by fixing a plurality of probe needles to a fixed body attached to a probe card and bringing the needle tips of the probe needles into contact with pads provided on a device formed on a semiconductor wafer, the probe A probe fixing body that connects probe needles fixed to a card to each probe needle at a position apart from the fixing body attached to the probe card toward the needle tip and equidistant from the needle tip of the probe needle. An integrated circuit measuring device characterized by comprising a support separate from and free from the integrated circuit.