JPS62173733A - Device for measuring signal at high speed - Google Patents

Abstract

PURPOSE:To use a plurality of power supplies having low impedance without altering a pattern even when the position of a power pin for an IC changes by selectively connecting a conductor wiring for power feed having width wider than a microstrip line to a probe. CONSTITUTION:Insulating layer 3 are formed onto the ground conductor surfaces 12 of dielectric substrates 2 with a plurality of microstrip lines shaping matching transmission lines and used as signal lines and probes 1 at the terminals of the lines 4. Conductor wirings 13 for power feed having width wider than the microstrip lines 4 are formed to the insulating layers 3, and the conductor wirings are connected selectively to the probes corresponding to power pads for an IC in the probes 1. Accordingly, patterns corresponding to the arrangement of pins for the IC to be measured need not be altered, and a plurality of power liens having low impedance can be employed.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Application of the Invention] The present invention relates to a high-speed signal measuring device capable of measuring high-speed operating semiconductor integrated circuits in a wafer state, and particularly to a high-speed signal measuring device suitable for reducing the impedance of power supply lines.

[Background of the invention]

In high-speed signal measurement equipment that can measure the characteristics of semiconductor integrated circuits (hereinafter abbreviated as IC) in the wafer state, the probe needle of the equipment is shortened to reduce inductance, and the characteristics of the signal transmission path up to the probe needle are shortened. Matching impedance is important for improving frequency characteristics.

At the same time, it is necessary to keep the impedance of the power supply line (hereinafter abbreviated as power line) as low as possible. In particular, when measuring wafer conditions, the signal ground of the measurement system and the signal ground inside the IC do not necessarily match, so the power supply line often becomes the isometric signal ground, so it is essential to reduce the impedance of the power supply line. .

Japanese Patent Laid-Open No. 59-215737 discloses means for realizing low impedance of a power supply line based on the above viewpoint. This technology has a probe card with a probe needle at the end of a microstrip line used for both signal and power lines, and a probe card with probe needles connected to the microstrip line of the power line, and By connecting a capacitor provided on the ground plane side between the probe needle and the ground plane, the impedance of the power supply line is reduced. This technology can be realized without reducing the density of the probe needle, and the 1.
Although it is excellent in that there is no need to change the microstrip pattern even if the position of the power supply pad of The drawback is that the allowable number of capacitors is limited by the number of capacitors that can be mounted.

[Purpose of the invention]

An object of the present invention is to provide a high-speed signal measurement device that does not require a reduction in the number of microstrip lines, does not require changing the pattern to correspond to the pin arrangement of the IC under test, and can use multiple low-impedance power supply lines. It is about providing.

[Summary of the invention]

In the present invention, a matching transmission path is formed on the ground conductor surface of a dielectric substrate having a plurality of microstrip lines serving as signal lines and a probe needle provided at the end of the microstrip line.

Furthermore, an insulating layer or an insulator is provided, and at least one conductor wiring for power supply having a width wider than the microstrip line is provided on the insulating layer or insulator, and the conductor wiring for power supply is connected to the probe needle. The present invention is characterized in that a plurality of low impedance power supply lines can be used by providing a means for selectively connecting them to those corresponding to the power supply pads of the IC.

[Embodiments of the invention]

Hereinafter, five embodiments of the present invention will be described. An embodiment of the present invention is shown in FIG. 1, and an enlarged sectional view of the vicinity of the probe needle connection portion is shown in FIG. In the figure, 1 is a probe needle, 2 is a ceramic or sapphire substrate or printed circuit board base material on which a microstrip is formed, 4 is a microstrip, 12 is a ground conductor surface of the microstrip, 13 is a power supply line, and 3 is a Microstrip ground conductor plane 12
A ceramic or sapphire substrate, a printed circuit board base material, or an insulating resin coating film such as polyimide for insulating the power supply conductor 13 and the power supply 13, 15 connects the power supply conductor 13, the microstrip 4, and the probe needle 1 with low impedance. conductor for

5 is a flexible film carrier for supporting 15 and ensuring positioning accuracy; 11 is a resin (adhesive) for fixing the probe needle to the microstrip saw board; 10 is a support for fixing the substrate 2; It is the body. FIG. 3 is a perspective view of the structure of the embodiment shown in FIGS. 1 and 2 near the probe needle connection part, and FIG. 3(a) shows the structure of the embodiment shown in FIGS. The needle is also shown slightly away from the connection point. FIG. 3(b) shows the film carrier 5 and the conductor section 15 on it.
The end surface 21 of the conductor pattern 15 is a probe needle corresponding to the power supply conductor 13, and the end surface 22 of the conductor pattern 15 is a probe needle corresponding to the power supply pad of the IC.

And it is connected to the microstrip 4 to which the probe needle is connected.

In the present invention, since the power supply line 13 is provided on a surface different from the microstrip, the width of the power supply line 13 can be increased and the impedance can be lowered. Furthermore, since the power supply line 13 faces the ground plane 12 of the microstrip 2 via the thin insulating layer 3, it itself functions as a capacitor, as described in Japanese Patent Laid-Open No. 59-215737. This eliminates the need for a capacitor for power supply bypass.

Other features of this embodiment include the power supply line 13 and the probe needle 1.
Since the conductor 15 for connecting is provided on the film carrier 5, the conductor pattern 15 can be made sufficiently thick on the side close to the power supply line 13, and the predetermined probe needle corresponding to the power supply pad of the IC can be made on the side close to the microstrip 2. The point is that it can be connected to with high positional accuracy.

FIG. 4 shows an example of how to connect the probe needles 1. As shown in the figure, first, the probe needles 1 are placed on the film carrier 5 on which the conductor pattern 15 is formed, at the same pitch as the microstrip pitch. position and fix it,
A probe needle corresponding to a predetermined power supply pin and a conductive pattern 1ε on the film carrier are electrically connected. A marker 30 for positioning is attached to the portion of the film carrier 5 where the probe needle is fixed.

Next, this film carrier 5 and the microstrip 2
After positioning, they are temporarily attached, and each probe needle 1 and microstrip 2 are electrically connected.

Finally, in order to give the probe needle sufficient mechanical strength,
Insulating resin 1 between probe needle and microstrip board
By solidifying with 1, the structure shown in Fig. 2 can be completed. In this way, by using a film carrier, it becomes possible to easily and accurately connect the probe needle to the power supply line and the signal line microstrip.

Note that the microstrip line connected to the power supply line can be used as is as a voltage sense line. This is an effect in addition to the above-mentioned effects obtained by the present invention.

The support 10 shown in FIG. 1 may be of any type as long as it can fix the microstrip substrate with sufficient strength and positional accuracy.

Further, although it is necessary to insulate the part where the 'ai source line branch line 13 is connected, it is desirable that the other metal parts have a structure in which they can be commonly grounded.

[Effects of the Invention] According to the present invention, without reducing the number of usable pins,
IC t1 again! It is possible to provide a high-speed signal measuring device that can use a plurality of low-impedance power lines without changing the pattern of the microstrip line even if the position of the scanning bin changes.

[Brief explanation of drawings]

FIG. 1 is a bottom view and a cross-sectional view showing an embodiment of the present invention, FIG. 2 is an enlarged cross-sectional view of the vicinity of the probe needle connection point, and FIG.
The figure is a diagram for explaining the shape of the embodiment shown in Figure 1, and Figure 4 is a diagram showing a film carrier for connecting the power supply line and the microstrip, and for easily connecting the probe needle to them. be. DESCRIPTION OF SYMBOLS 1... Probe needle, 2... Substrate on which a microstrip line is formed, 3... Insulating layer, 4... Microstrip line, 12...
...Ground conductor surface, 13...Power line conductor,
5...Film carrier.

Claims (1)

[Claims] 1. A plurality of microstrip lines forming a matching transmission path and serving as signal lines are arranged radially, each of the microstrip lines has a probe needle at its end, and the microstrip line is Further provide an insulating layer or an insulating plate on the ground conductor surface of the dielectric substrate to be formed, or provide an insulating plate, and on the insulating layer or insulating plate, a power supply with a width wider than the microstrip line. 1. A high-speed signal measuring device, comprising at least one conductor wiring, and means for selectively connecting the power supply conductor wiring to the probe needle. 2. The high-speed signal measuring device according to claim 1, wherein the selective connection means is a conductive pattern formed on a film carrier. 3. The wiring width of the conductor pattern on the film carrier is approximately equal to the conductor width of the microstrip line only in the vicinity where it is connected to the microstrip line, and the width of the conductor pattern on the film carrier is approximately equal to the width of the power supply line in other parts. 3. The high-speed signal measuring device according to claim 2, characterized in that the diameter is made thicker. 4. The probe needle is aligned and fixed on the film carrier, electrically connected to the conductor pattern on the film carrier, aligned and electrically connected to the microstrip line, and The high-speed signal measuring device according to claim 2 or 3, wherein the high-speed signal measuring device is fixed. 5. The high-speed signal measuring device according to claim 4, wherein a marker is formed on the film carrier to indicate a fixing point of the probe needle.