JP2557685B2 - Probe card - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION Object of the Invention (Field of Industrial Application) The present invention relates to a probe card arranged in a wafer prober or the like and used for test measurement of a semiconductor device or the like.

(Prior Art) In general, a large number of integrated circuits formed on the surface of a semiconductor wafer are electrically tested and measured in the manufacturing process. For example, electrical connection between an integrated circuit on a semiconductor wafer and a measuring device is often performed by a probe terminal called a probe card.

FIG. 2 shows an example of the configuration of a conventional probe card, which is a substrate 1 formed of a printed circuit board or the like.
The opening 1a is provided in the opening 1a, and the support ring 2 is fixed along the periphery of the opening 1a. The support ring 2 has an inclined surface 2a that is inclined from the outer peripheral direction toward the inner peripheral direction at the lower portion, and a large number of probes 3 are directed to the center direction of the support ring 2 on the inclined surface 2a. It is fixed so as to project. Further, one end 3a of the probe 3 is electrically connected to the conductive layer 4 formed on the substrate 1, and the conductive layer 4 is used for connecting a measuring device provided on the end of the substrate 1. It is connected to the terminal. Then, the other end 3b of the probe 3 is connected to the electrode pad on the semiconductor wafer to establish electrical connection with the measuring instrument.

By the way, in recent years, in order to shorten the inspection time, it has been attempted to increase the frequency of a measurement signal of a measuring instrument such as an IC tester to increase the speed. Further, the number of integrated circuits to be measured that use a high frequency is increasing, and therefore the probe card is also required to have compatibility with a high frequency signal.

Therefore, in order to prevent noise increase and signal attenuation due to high-frequency signals, measures such as sufficient impedance matching of the conductive layer 4 provided on the substrate 1 have been taken.

(Problems to be Solved by the Invention) However, in the conventional probe card described above, since the support ring 2 has only a role of positioning and fixing the probe 3, it is formed on the probe 3 and the substrate 1. The electrical connection with the conductive layer 4 is made by connecting the end 3a of the probe 3 to the conductive layer 4. Therefore, the probe 3
The length of the probe becomes long, for example, about 25 mm to 35 mm, interference between the probes 3 is likely to occur, noise, crosstalk, etc. occur, and the measurement accuracy deteriorates. Further, there are JP-A-51-32181 and JP-A-58-162045. However, it has not been put to practical use.

The present invention has been made to address such a problem of the conventional technique, and provides a probe card in which factors that reduce measurement accuracy such as noise and crosstalk are reduced during measurement by a high frequency signal. Has an aim.

[Configuration of the Invention] (Means for Solving the Problem) That is, according to the present invention, a plurality of probes are provided in the opening along the opening of the substrate having the opening and on which the first wiring pattern is printed and printed. A probe card having an annular probe support fixedly provided so as to project in the direction of the center of the part, wherein the probe support is made of insulating ceramics, and is attached to the probe support. A second wiring pattern, which corresponds to the first wiring pattern and extends from the upper surface of the support to the lower surface through the side surface, is printed and located in a portion near the inner surface of the lower surface of the probe support. So that the probe is connected and fixed on the second wiring pattern, and the probe and the first wiring pattern are electrically connected via the second wiring pattern. Is characterized by.

The invention according to claim 2 is characterized in that the probe is made of tungsten.

(Operation) In the probe card of the present invention, the wiring pattern is formed on the probe support fixed along the opening of the substrate,
The probe is fixed to this wiring pattern and electrical connection is made. This makes it possible to significantly reduce the length of the probe as compared with the conventional probe card. Therefore, interference between the probes is reduced, and noise and crosstalk can be significantly reduced even when a high frequency signal is used.

(Example) Next, the Example of the probe card of this invention is described with reference to drawings.

Substrate composed of printed circuit board made of resin etc.
11 has a circular opening 11a with a diameter of several centimeters.
The support ring 12 made of an insulating material such as ceramics such as alumina is fixed to the protrusion 12a formed at the inner end of the support ring 12 along the periphery of the opening 11a. The support ring 12 has an inclined surface 12b that is inclined downward from the outer week to the inner week side at the lower portion, reaches the upper surface 12d from the inclined surface 12b through the side surface 12c, and the probe 14 described later. The wiring patterns 13 are formed according to the number of lines.

The probe 14 is electrically connected to each of the inner peripheral end portions of the wiring pattern 13 formed on the inclined surface 12b of the support ring 12 and is inclined downward toward the center of the opening 11a. It is fixedly supported so as to project. This probe
14 is, for example, W, Pd, Be-C having a diameter of about 200 μm to 250 μm
It is made of u alloy or the like, and its tip 14a is bent downward, and the tip has a small diameter of, for example, about 50 μm. By connecting and fixing the length of the probe 14 to the corresponding wiring pattern thus formed on the support ring 12, it is possible to shorten the length to, for example, about 5 mm. The closer this connecting portion is to the inner end of the inclined surface 12b, the shorter the length of the probe 14 can be formed. Further, the probe 14 can be further shortened if it has a structure without a bent portion at the tip, and can be further shortened if it is set vertically.

On the other hand, the end of the wiring pattern 13 located on the upper surface 12d of the support ring 12 is electrically connected to the conductive layer 15 formed on the substrate 11, and the conductive layer 15 is the end of the substrate 11. Are connected to the measuring equipment connection terminals (not shown) arranged in the above.

In the probe card of this embodiment having the above configuration, the opening 12
A semiconductor wafer is arranged under the semiconductor wafer, and the tip of the probe 14 is brought into contact with an electrode pad having a size of, for example, about 100 μm × 80 μm formed on the semiconductor wafer, and the connection terminal provided on the substrate 11 is connected. Is connected to a measuring device as an electrode, and a test measurement of an integrated circuit formed on a semiconductor wafer is performed.

According to this embodiment, since the probe is electrically connected and fixed to the wiring pattern provided on the support ring, the length of the probe can be significantly shortened as compared with the conventional probe card. It will be possible. For example, a conventional probe having a length of 25 mm to 35 mm can exhibit the same function with a probe having a length of about 5 mm. Therefore, the interference between the probes when a high frequency signal is used is greatly reduced, and noise, crosstalk, etc. due to this high frequency signal can be significantly reduced as compared with the conventional case.

[Advantages of the Invention] As described above, in the probe card of the present invention, noise and crosstalk due to a high-frequency signal can be significantly reduced as compared with the related art, and thus the measurement accuracy can be significantly improved. Become.

[Brief description of drawings]

FIG. 1 is a sectional view showing the structure of the main part of a probe card according to an embodiment of the present invention, and FIG. 2 is a sectional view showing the structure of the main part of a conventional probe card. 11 ... Substrate, 11a ... Opening, 12 ... Support ring, 13
...... Wiring pattern, 14 …… Probe, 15 …… Conductive layer

Claims (2)

(57) [Claims] 1. A plurality of probes are provided so as to be fixed so as to project toward the center of the opening along the opening of a substrate having an opening and on which a first wiring pattern is printed and printed. A probe card to which an annular probe support is fixed, wherein the probe support is made of insulating ceramics, and the probe support corresponds to the first wiring pattern, and A second wiring pattern, which extends from the upper surface of the support to the lower surface via the side surface, is printed and arranged so that it is located near the inner side of the lower surface of the probe support.
By connecting and fixing the probe on the second wiring pattern,
A probe card characterized in that the probe and the first wiring pattern are electrically connected via the second wiring pattern. 2. The probe card according to claim 1, wherein the probe is made of tungsten.