JPS55133549A - Probe card - Google Patents
Probe cardInfo
- Publication number
- JPS55133549A JPS55133549A JP4078079A JP4078079A JPS55133549A JP S55133549 A JPS55133549 A JP S55133549A JP 4078079 A JP4078079 A JP 4078079A JP 4078079 A JP4078079 A JP 4078079A JP S55133549 A JPS55133549 A JP S55133549A
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- pores
- probe
- needles
- needle
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Measuring Leads Or Probes (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Abstract
PURPOSE:To enable checking of bonding wires in high density on a probe card by forming pores vertically passing a substrate, inserting probe needles each having axial elasticity through the pores and electrically connecting the needles to a checking unit. CONSTITUTION:Pores 3 are perforated through a substrate 1 at the positions corresponding to wire bonding pads on the periphery of a portion 2 designated by broken lines where a semiconductor chip is die bonded. A probe needle 6 having a stretchable portion being elastic is inserted into each of the pores 3 of the substrate 1. Wires electrically connected to the stationary portion of the needle 6 projected on the upper surface side of the substrate 1 and to a checking unit and an electrode pattern 4 are formed on the substrate 1. A mark 5 for positioning at measuring time is also formed on the substrate 1.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP4078079A JPS55133549A (en) | 1979-04-03 | 1979-04-03 | Probe card |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP4078079A JPS55133549A (en) | 1979-04-03 | 1979-04-03 | Probe card |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS55133549A true JPS55133549A (en) | 1980-10-17 |
Family
ID=12590132
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP4078079A Pending JPS55133549A (en) | 1979-04-03 | 1979-04-03 | Probe card |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS55133549A (en) |
Cited By (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH01123157A (en) * | 1987-11-09 | 1989-05-16 | Hitachi Ltd | Probe head for semiconductor lsi inspecting apparatus and preparation thereof |
JPH01295185A (en) * | 1988-05-21 | 1989-11-28 | Tokyo Electron Ltd | Inspection device |
US5225771A (en) * | 1988-05-16 | 1993-07-06 | Dri Technology Corp. | Making and testing an integrated circuit using high density probe points |
JPH085662A (en) * | 1994-06-16 | 1996-01-12 | Seiken:Kk | Inspection probe |
JP2001091537A (en) * | 1999-09-24 | 2001-04-06 | Isao Kimoto | Contact and contact assembly using it |
US6528759B2 (en) | 2001-02-13 | 2003-03-04 | Medallion Technology, Llc | Pneumatic inductor and method of electrical connector delivery and organization |
US6530511B2 (en) | 2001-02-13 | 2003-03-11 | Medallion Technology, Llc | Wire feed mechanism and method used for fabricating electrical connectors |
US6584677B2 (en) | 2001-02-13 | 2003-07-01 | Medallion Technology, Llc | High-speed, high-capacity twist pin connector fabricating machine and method |
US6716038B2 (en) | 2002-07-31 | 2004-04-06 | Medallion Technology, Llc | Z-axis connection of multiple substrates by partial insertion of bulges of a pin |
US6729026B2 (en) | 2001-02-13 | 2004-05-04 | Medallion Technology, Llc | Rotational grip twist machine and method for fabricating bulges of twisted wire electrical connectors |
JP2009014480A (en) * | 2007-07-04 | 2009-01-22 | Koyo Technos:Kk | Inspection tool |
JP2013137281A (en) * | 2011-12-28 | 2013-07-11 | Seiko Epson Corp | Probe device |
US8613622B2 (en) | 2011-02-15 | 2013-12-24 | Medallion Technology, Llc | Interconnection interface using twist pins for testing and docking |
WO2020256132A1 (en) * | 2019-06-21 | 2020-12-24 | ユナイテッド・プレシジョン・テクノロジーズ株式会社 | Microfabrication device for metal product, and microfabrication method for metal product |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS4816757B1 (en) * | 1969-04-18 | 1973-05-24 |
-
1979
- 1979-04-03 JP JP4078079A patent/JPS55133549A/en active Pending
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS4816757B1 (en) * | 1969-04-18 | 1973-05-24 |
Cited By (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH01123157A (en) * | 1987-11-09 | 1989-05-16 | Hitachi Ltd | Probe head for semiconductor lsi inspecting apparatus and preparation thereof |
JPH0640106B2 (en) * | 1987-11-09 | 1994-05-25 | 株式会社日立製作所 | Probe head for semiconductor LSI inspection device and manufacturing method thereof |
US5225771A (en) * | 1988-05-16 | 1993-07-06 | Dri Technology Corp. | Making and testing an integrated circuit using high density probe points |
JPH01295185A (en) * | 1988-05-21 | 1989-11-28 | Tokyo Electron Ltd | Inspection device |
JPH085662A (en) * | 1994-06-16 | 1996-01-12 | Seiken:Kk | Inspection probe |
JP2001091537A (en) * | 1999-09-24 | 2001-04-06 | Isao Kimoto | Contact and contact assembly using it |
US6584677B2 (en) | 2001-02-13 | 2003-07-01 | Medallion Technology, Llc | High-speed, high-capacity twist pin connector fabricating machine and method |
US6530511B2 (en) | 2001-02-13 | 2003-03-11 | Medallion Technology, Llc | Wire feed mechanism and method used for fabricating electrical connectors |
US6528759B2 (en) | 2001-02-13 | 2003-03-04 | Medallion Technology, Llc | Pneumatic inductor and method of electrical connector delivery and organization |
US6729026B2 (en) | 2001-02-13 | 2004-05-04 | Medallion Technology, Llc | Rotational grip twist machine and method for fabricating bulges of twisted wire electrical connectors |
US6971415B2 (en) | 2001-02-13 | 2005-12-06 | Medallion Technology, Llc | Rotational grip twist machine and method for fabricating bulges of twisted wire electrical connectors |
US6716038B2 (en) | 2002-07-31 | 2004-04-06 | Medallion Technology, Llc | Z-axis connection of multiple substrates by partial insertion of bulges of a pin |
JP2009014480A (en) * | 2007-07-04 | 2009-01-22 | Koyo Technos:Kk | Inspection tool |
US8613622B2 (en) | 2011-02-15 | 2013-12-24 | Medallion Technology, Llc | Interconnection interface using twist pins for testing and docking |
JP2013137281A (en) * | 2011-12-28 | 2013-07-11 | Seiko Epson Corp | Probe device |
WO2020256132A1 (en) * | 2019-06-21 | 2020-12-24 | ユナイテッド・プレシジョン・テクノロジーズ株式会社 | Microfabrication device for metal product, and microfabrication method for metal product |
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