JPH0328465U - - Google Patents
Info
- Publication number
- JPH0328465U JPH0328465U JP8956889U JP8956889U JPH0328465U JP H0328465 U JPH0328465 U JP H0328465U JP 8956889 U JP8956889 U JP 8956889U JP 8956889 U JP8956889 U JP 8956889U JP H0328465 U JPH0328465 U JP H0328465U
- Authority
- JP
- Japan
- Prior art keywords
- pellets
- probe
- convex
- wiring pattern
- semiconductor wafer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000523 sample Substances 0.000 claims description 6
- 239000004065 semiconductor Substances 0.000 claims description 6
- 239000008188 pellet Substances 0.000 claims description 5
- 238000010586 diagram Methods 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
Landscapes
- Measuring Leads Or Probes (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Description
第１図と第２図は本考案に係る半導体装置の特
性測定装置の実施例を示すプローブカードの要部
の側断面図と平面図、第３図は第１図プローブカ
ードの配線パターン先端部と凸状電極の接触状態
を示す要部側面図、第４図はペレツトが形成され
た半導体ウエーハの平面図、第５図は従来の半導
体装置の特性測定装置の一具体例を示す概略側面
図、第６図と第７図は第５図装置の要部であるプ
ローブカードの部分側断面図と平面図、第８図と
第９図は第６図及び第７図プローブカードの測定
ピンの先端ニードルとバンプ電極の接触状態を示
す各部分側面図である。
１……半導体ウエーハ、１ａ……ペレツト、４
……凸状電極、８……プリント基板、８ａ……プ
リント基板下面、９……配線パターン、９ａ……
先端部。
1 and 2 are a side sectional view and a plan view of the main parts of a probe card showing an embodiment of the semiconductor device characteristic measuring device according to the present invention, and FIG. 3 is a tip of the wiring pattern of the probe card shown in FIG. 1. FIG. 4 is a plan view of a semiconductor wafer on which pellets are formed, and FIG. 5 is a schematic side view showing a specific example of a conventional semiconductor device characteristic measuring device. , Figures 6 and 7 are partial side sectional views and plan views of the probe card, which is the main part of the device in Figure 5, and Figures 8 and 9 are diagrams of the measurement pins of the probe card in Figures 6 and 7. FIG. 6 is a partial side view showing a state of contact between a tip needle and a bump electrode. 1...Semiconductor wafer, 1a...Pellet, 4
...Convex electrode, 8...Printed board, 8a...Bottom surface of printed board, 9...Wiring pattern, 9a...
tip.
Claims (1)
ペレツト上に配設された１又は多数の凸状電極に
測子を接触させてペレツトの電気的特性を測定す
る装置において、 測子となる各先端部が上記凸状電極の配設パタ
ーンに対応する配線パターンをプリント基板下面
に形成したことを特徴とする半導体装置の特性測
定装置。[Claims for Utility Model Registration] An apparatus for forming a large number of pellets on a semiconductor wafer and measuring the electrical characteristics of the pellets by bringing a probe into contact with one or more convex electrodes arranged on each pellet. . A characteristic measuring device for a semiconductor device, characterized in that a wiring pattern is formed on the lower surface of a printed circuit board, each tip portion serving as a probe corresponding to the arrangement pattern of the convex electrode.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8956889U JPH0328465U (en) | 1989-07-28 | 1989-07-28 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8956889U JPH0328465U (en) | 1989-07-28 | 1989-07-28 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0328465U true JPH0328465U (en) | 1991-03-20 |
Family
ID=31639142
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8956889U Pending JPH0328465U (en) | 1989-07-28 | 1989-07-28 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0328465U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0677296A (en) * | 1992-05-29 | 1994-03-18 | Eejingu Tesuta Kaihatsu Kyodo Kumiai | Probing electrode for integrated circuit element wafer |
| KR200476835Y1 (en) * | 2013-12-31 | 2015-04-14 | 대우조선해양 주식회사 | Air duct structure with heat insulation and sound absorption effect |
-
1989
- 1989-07-28 JP JP8956889U patent/JPH0328465U/ja active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0677296A (en) * | 1992-05-29 | 1994-03-18 | Eejingu Tesuta Kaihatsu Kyodo Kumiai | Probing electrode for integrated circuit element wafer |
| KR200476835Y1 (en) * | 2013-12-31 | 2015-04-14 | 대우조선해양 주식회사 | Air duct structure with heat insulation and sound absorption effect |