JPH0292966U - - Google Patents
Info
- Publication number
- JPH0292966U JPH0292966U JP120289U JP120289U JPH0292966U JP H0292966 U JPH0292966 U JP H0292966U JP 120289 U JP120289 U JP 120289U JP 120289 U JP120289 U JP 120289U JP H0292966 U JPH0292966 U JP H0292966U
- Authority
- JP
- Japan
- Prior art keywords
- solder
- attachment area
- wiring pattern
- forming body
- area
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910000679 solder Inorganic materials 0.000 claims description 23
- 238000007689 inspection Methods 0.000 claims description 3
- 238000005476 soldering Methods 0.000 claims 1
- 239000000758 substrate Substances 0.000 claims 1
- 230000015572 biosynthetic process Effects 0.000 description 2
Description
第１図は、本考案の一実施例を示す基板の側面
図、第２図は、第１図に於ける矢視Ａ方向からの
平面図、第３図は、第２図に於ける半田付け前の
検査用パツドの拡大図、第４図は、第１図に於け
る検査用パツドの拡大図である。
１１……基板、１２……電子部品、１３……配
線パターン、１４……検査用パツド、１４ａ……
第一の半田付着領域、１４ｂ……非半田付着領域
、１４ｃ……第二の半田付着領域、１６ａ……第
一の半田形成体、１６ｂ……第二の半田形成体、
１６ｃ……凹部、１８……検査用接触子。
1 is a side view of a board showing an embodiment of the present invention, FIG. 2 is a plan view from the direction of arrow A in FIG. 1, and FIG. 3 is a view of the solder in FIG. FIG. 4 is an enlarged view of the test pad before attachment, and FIG. 4 is an enlarged view of the test pad in FIG. 1. 11... Board, 12... Electronic component, 13... Wiring pattern, 14... Inspection pad, 14a...
First solder attachment area, 14b...non-solder attachment area, 14c...second solder attachment area, 16a...first solder formation body, 16b...second solder formation body,
16c... recess, 18... contact for inspection.
Claims (1)
れており電気的な検査を行うのに用いられる検査
用パツドであつて、前記配線パターンと電気的に
接続されている第一の半田付着領域と、この第一
の半田付着領域の周囲に形成された非半田付着領
域と、この非半田付着領域の周囲に形成された第
二の半田付着領域とを具備したことを特徴とする
基板の配線パターンの検査用パツド。 (2) 基板上に形成された配線パターンに延設さ
れており電気的な検査を行うのに用いられる検査
用パツドであつて、前記配線パターンと電気的に
接続されている第一の半田付着領域と、この第一
の半田付着領域の周囲に形成された非半田付着領
域と、この非半田付着領域の周囲に形成された第
二の半田付着領域とを具備しており、前記第一の
半田付着領域に形成された半球状の第一の半田形
成体と、前記第二の半田付着領域に形成された隆
起状の第二の半田形成体と、前記非半田付着領域
により前記第一の半田形成体と前記第二の半田形
成体との間に形成された凹部とを具備したことを
特徴とする基板の配線パターンの検査用パツド。[Claims for Utility Model Registration] (1) An inspection pad that extends over a wiring pattern formed on a board and is used for electrical testing, which is electrically connected to the wiring pattern. a first solder attachment area, a non-solder attachment area formed around the first solder attachment area, and a second solder attachment area formed around the non-solder attachment area. A pad for inspecting circuit board wiring patterns. (2) A test pad extending over a wiring pattern formed on a substrate and used for electrical testing, the first solder attachment being electrically connected to the wiring pattern. a non-solder adhesion area formed around the first solder adhesion area, and a second solder adhesion area formed around the non-solder adhesion area; The hemispherical first solder forming body formed in the solder attachment area, the protruding second solder forming body formed in the second solder attachment area, and the non-solder attachment area form the first solder forming body. 1. A pad for inspecting a wiring pattern on a board, comprising a recess formed between a solder forming body and the second soldering forming body.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP120289U JPH0292966U (en) | 1989-01-11 | 1989-01-11 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP120289U JPH0292966U (en) | 1989-01-11 | 1989-01-11 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0292966U true JPH0292966U (en) | 1990-07-24 |
Family
ID=31200887
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP120289U Pending JPH0292966U (en) | 1989-01-11 | 1989-01-11 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0292966U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1997031510A1 (en) * | 1994-07-26 | 1997-08-28 | Advantest Corporation | Electrode pad for electric signal connection |
| JP2009170474A (en) * | 2008-01-10 | 2009-07-30 | Seiko Instruments Inc | Circuit board and manufacturing method thereof and electronic equipment |
-
1989
- 1989-01-11 JP JP120289U patent/JPH0292966U/ja active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1997031510A1 (en) * | 1994-07-26 | 1997-08-28 | Advantest Corporation | Electrode pad for electric signal connection |
| JP2009170474A (en) * | 2008-01-10 | 2009-07-30 | Seiko Instruments Inc | Circuit board and manufacturing method thereof and electronic equipment |