JPH0310570U - - Google Patents

Info

Publication number
JPH0310570U
JPH0310570U JP7123289U JP7123289U JPH0310570U JP H0310570 U JPH0310570 U JP H0310570U JP 7123289 U JP7123289 U JP 7123289U JP 7123289 U JP7123289 U JP 7123289U JP H0310570 U JPH0310570 U JP H0310570U
Authority
JP
Japan
Prior art keywords
sealing agent
heat
leads
substrate
land portion
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP7123289U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP7123289U priority Critical patent/JPH0310570U/ja
Publication of JPH0310570U publication Critical patent/JPH0310570U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Description

【図面の簡単な説明】[Brief explanation of drawings]

図は全て本考案の一実施例を説明するもので、
第１図はリード付き部品の実装状態を示す平面図
、第２図は第１図の−線に沿う拡大断面図、
第３図はヒートシールチツプの底面図、第４図は
実装工程の説明図である。 １……フレキシブルプリント配線板、２……ベ
ースフイルム、３……回路パターン、３ａ……ラ
ンド部、４……部品、４ａ……リード、５……ヒ
ートシールチツプ、６……フイルム切片、７……
導電性ヒートシール剤、７ａ……第１接続部、７
ｂ……第２接続部、７ｃ……連結部、８……絶縁
性ヒートシール剤。 All figures are for explaining one embodiment of the present invention.
Fig. 1 is a plan view showing the mounted state of the leaded component, Fig. 2 is an enlarged sectional view taken along the - line in Fig. 1,
FIG. 3 is a bottom view of the heat-sealed chip, and FIG. 4 is an explanatory diagram of the mounting process. DESCRIPTION OF SYMBOLS 1...Flexible printed wiring board, 2...Base film, 3...Circuit pattern, 3a...Land part, 4...Component, 4a...Lead, 5...Heat seal chip, 6...Film section, 7 ……
Conductive heat sealing agent, 7a...first connection part, 7
b...Second connection part, 7c...Connection part, 8...Insulating heat sealing agent.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 基板上に形成された回路パターンのランド部に
対し、リード付き部品のリードを接続・固定する
ものにおいて、フイルム切片に導電性ヒートシー
ル剤と該導電性ヒートシール剤を包囲する絶縁性
ヒートシール剤とを塗布してヒートシールチツプ
を形成し、このヒートシールチツプを前記リード
を載置した前記基板に熱圧着することにより、前
記ランド部とリードとを導電性ヒートシール剤を
介して導通することを特徴とするリード付き部品
の実装構造。 In a device that connects and fixes the leads of a leaded component to the land portion of a circuit pattern formed on a substrate, a conductive heat sealing agent is attached to a film section and an insulating heat sealing agent surrounding the conductive heat sealing agent. and forming a heat-sealed chip by applying a heat-sealing agent, and thermocompression-bonding the heat-sealed chip to the substrate on which the leads are placed, thereby establishing electrical continuity between the land portion and the leads via a conductive heat-sealing agent. A mounting structure for leaded components featuring:
JP7123289U 1989-06-20 1989-06-20 Pending JPH0310570U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP7123289U JPH0310570U (en) 1989-06-20 1989-06-20

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP7123289U JPH0310570U (en) 1989-06-20 1989-06-20

Publications (1)

Publication Number Publication Date
JPH0310570U true JPH0310570U (en) 1991-01-31

Family

ID=31608078

Family Applications (1)

Application Number Title Priority Date Filing Date
JP7123289U Pending JPH0310570U (en) 1989-06-20 1989-06-20

Country Status (1)

Country Link
JP (1) JPH0310570U (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002096593A (en) * 2000-09-21 2002-04-02 Zebra Pen Corp Grip for writing instrument
JP2005211240A (en) * 2004-01-28 2005-08-11 Shimano Inc Fishing boots
JP5073813B2 (en) * 2008-03-28 2012-11-14 株式会社パイロットコーポレーション Writing instrument grip

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6120074B2 (en) * 1976-10-21 1986-05-20 Nippon Electric Co

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6120074B2 (en) * 1976-10-21 1986-05-20 Nippon Electric Co

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002096593A (en) * 2000-09-21 2002-04-02 Zebra Pen Corp Grip for writing instrument
JP4620234B2 (en) * 2000-09-21 2011-01-26 ゼブラ株式会社 Writing instrument grip
JP2005211240A (en) * 2004-01-28 2005-08-11 Shimano Inc Fishing boots
JP4489449B2 (en) * 2004-01-28 2010-06-23 株式会社シマノ Fishing boots
JP5073813B2 (en) * 2008-03-28 2012-11-14 株式会社パイロットコーポレーション Writing instrument grip

Similar Documents

Publication Publication Date Title
JPH0310570U (en)
JP2571902Y2 (en) Electronic component mounting structure
JP2674394B2 (en) Tape carrier package mounting device
JPS5932151Y2 (en) Multilayer connection structure of flexible printed wiring board
JPS63119272U (en)
JPH0292966U (en)
JPH0466780U (en)
JPS59127268U (en) Hybrid integrated circuit device
JPS6230380U (en)
JPS6398678U (en)
JPS6298254U (en)
JPH033799U (en)
JPS59138264U (en) Wiring board equipment
JPS5974760U (en) Double-sided printed wiring body
JPS6457649U (en)
JPS63197334U (en)
JPH0448661U (en)
JPH02130995A (en) Printed-wiring board device
JPH03106758U (en)
JPS61131871U (en)
JPS63182571U (en)
JPH0336478U (en)
JPH01179460U (en)
JPS633154U (en)
JPS62142875U (en)