JPH01162271U - - Google Patents

Info

Publication number
JPH01162271U
JPH01162271U JP1989051701U JP5170189U JPH01162271U JP H01162271 U JPH01162271 U JP H01162271U JP 1989051701 U JP1989051701 U JP 1989051701U JP 5170189 U JP5170189 U JP 5170189U JP H01162271 U JPH01162271 U JP H01162271U
Authority
JP
Japan
Prior art keywords
printed circuit
circuit board
substrate
holes
lead
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1989051701U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPH01162271U publication Critical patent/JPH01162271U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/306—Lead-in-hole components, e.g. affixing or retention before soldering, spacing means
    • H05K3/308—Adaptations of leads
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/115—Via connections; Lands around holes or via connections
    • H05K1/116—Lands, clearance holes or other lay-out details concerning the surrounding of a via
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10431—Details of mounted components
    • H05K2201/10507—Involving several components
    • H05K2201/10545—Related components mounted on both sides of the PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10636—Leadless chip, e.g. chip capacitor or resistor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10651—Component having two leads, e.g. resistor, capacitor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10742—Details of leads
    • H05K2201/1075—Shape details
    • H05K2201/10757—Bent leads
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/14—Related to the order of processing steps
    • H05K2203/1446—Treatment after insertion of lead into hole, e.g. bending, cutting, caulking or curing of adhesive but excluding soldering
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3447—Lead-in-hole components
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Structure Of Printed Boards (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第１図は本考案の一実施例を示すプリント回路
基板の一部の平面図、第２図は第１図の―に
おける断面図、第３図は本考案の別の実施例を示
すプリント回路基板の一部の平面図、第４図は第
３図の―における断面図である。 １……孔、２……プリント回路基板、３ａ，３
ｂ，１５ａ，１５ｂ……めつきリング、４，６，
７，９ａ，９ｂ，１７，１８……導体トラツク、
５，８，１０……チツプ、１１……プリント回路
板の第１表面、１２……素子、１３ａ，１３ｂ…
…リード、１４……プリント回路板の第２表面、
１６ａ，１６ｂ……リード端部。 Fig. 1 is a plan view of a part of a printed circuit board showing one embodiment of the present invention, Fig. 2 is a sectional view at - in Fig. 1, and Fig. 3 is a printed circuit showing another embodiment of the present invention. A plan view of a part of the substrate, and FIG. 4 is a sectional view taken along the line - in FIG. 1... Hole, 2... Printed circuit board, 3a, 3
b, 15a, 15b...Plating ring, 4, 6,
7, 9a, 9b, 17, 18... conductor track,
5, 8, 10... Chip, 11... First surface of printed circuit board, 12... Element, 13a, 13b...
...Lead, 14...Second surface of printed circuit board,
16a, 16b...Lead ends.

Claims (1)

【実用新案登録請求の範囲】 １ 素子１２をそなえ、該素子のリード１３ａ，
１３ｂは基板の第１表面１１から孔１を通つて延
在し、基板の第２表面１４から突出したリード端
部１６ａ，１６ｂは側方に前記の第２表面上に曲
げられるようにしたプリント配線基板において、
リード端部１６ａ，１６ｂは素子１２の縦方向に
対して略々直角に反対方向に曲げられたことを特
徴とするプリント回路基板。 ２ 他の回路部分の導体トラツク１７，１８が基
板の第２表面１４上で素子１２のリード１３ａ，
１３ｂの孔１の間を延在する請求項１記載のプリ
ント回路基板。 ３ 関係の導体９ａ，９ｂを有する別の表面取付
素子１０が孔１の間に配設された請求項２記載の
プリント回路基板。[Claims for Utility Model Registration] 1. An element 12, a lead 13a of the element,
13b extends from the first surface 11 of the substrate through the hole 1, and the lead ends 16a, 16b projecting from the second surface 14 of the substrate are bent laterally onto said second surface. In the wiring board,
A printed circuit board characterized in that the lead ends 16a and 16b are bent in opposite directions at substantially right angles to the longitudinal direction of the element 12. 2. The conductor tracks 17, 18 of other circuit parts are connected to the leads 13a, 13 of the element 12 on the second surface 14 of the substrate.
A printed circuit board according to claim 1, extending between the holes 1 of 13b. 3. A printed circuit board as claimed in claim 2, characterized in that a further surface-mounted element (10) having associated conductors (9a, 9b) is arranged between the holes (1).
JP1989051701U 1988-05-06 1989-05-02 Pending JPH01162271U (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE8806029U DE8806029U1 (en) 1988-05-06 1988-05-06 Electrical circuit board with printed wiring

Publications (1)

Publication Number Publication Date
JPH01162271U true JPH01162271U (en) 1989-11-10

Family

ID=6823783

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1989051701U Pending JPH01162271U (en) 1988-05-06 1989-05-02

Country Status (5)

Country Link
JP (1) JPH01162271U (en)
DE (1) DE8806029U1 (en)
ES (1) ES1010155Y (en)
FR (1) FR2631201B3 (en)
IT (1) IT216550Z2 (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6457789A (en) * 1987-08-28 1989-03-06 Mitsubishi Electric Corp Electronic component mounting structure
JP4825720B2 (en) * 2007-04-19 2011-11-30 矢崎総業株式会社 Printed wiring board

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6049665B2 (en) * 1975-10-23 1985-11-02 東洋インキ製造株式会社 Curable paint composition
JPS6293993A (en) * 1985-10-19 1987-04-30 松下電器産業株式会社 Electronic circuit device and mounting of the same
JPS6364388A (en) * 1986-09-04 1988-03-22 松下電器産業株式会社 Method of mounting circuit components

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6049665B2 (en) * 1975-10-23 1985-11-02 東洋インキ製造株式会社 Curable paint composition
JPS6293993A (en) * 1985-10-19 1987-04-30 松下電器産業株式会社 Electronic circuit device and mounting of the same
JPS6364388A (en) * 1986-09-04 1988-03-22 松下電器産業株式会社 Method of mounting circuit components

Also Published As

Publication number Publication date
FR2631201A3 (en) 1989-11-10
DE8806029U1 (en) 1988-06-30
ES1010155Y (en) 1990-05-01
FR2631201B3 (en) 1990-03-09
IT216550Z2 (en) 1991-09-16
IT8921001V0 (en) 1989-05-03
ES1010155U (en) 1989-12-01

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