JPS56148071A - Multiple needle type probe - Google Patents

Multiple needle type probe

Info

Publication number
JPS56148071A
JPS56148071A JP5265580A JP5265580A JPS56148071A JP S56148071 A JPS56148071 A JP S56148071A JP 5265580 A JP5265580 A JP 5265580A JP 5265580 A JP5265580 A JP 5265580A JP S56148071 A JPS56148071 A JP S56148071A
Authority
JP
Japan
Prior art keywords
insulating plate
wires
needles
nickel
holes
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP5265580A
Other languages
Japanese (ja)
Other versions
JPS6023315B2 (en
Inventor
Masao Okubo
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Japan Electronic Materials Corp
Original Assignee
Japan Electronic Materials Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Japan Electronic Materials Corp filed Critical Japan Electronic Materials Corp
Priority to JP55052655A priority Critical patent/JPS6023315B2/en
Publication of JPS56148071A publication Critical patent/JPS56148071A/en
Publication of JPS6023315B2 publication Critical patent/JPS6023315B2/en
Expired legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07364—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch
    • G01R1/07378—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch using an intermediate adapter, e.g. space transformers

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
  • Measuring Leads Or Probes (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)

Abstract

PURPOSE:To obtain the probe for a high-density integrated circuit by arranging an insulating plate whose area is larger than that of an insulating plate wherein a plurality of needles are held over said lower insulating plate, and arranging connecting conductors in the same distribution as the needles. CONSTITUTION:The first square insulating plate 22 and the second insulating plate 23 whose area is four times that of said insulating plate 22 are arranged so that a specified distance is provided in-between with supporting poles 24. The end of an arm 7 is fixed to the center of the plate 23. A plurality of holes are provided in the corresponding positions at the peripheral parts of the plates 22 and 23. Through said holes, are inserted and fixed pipes 25 comprising thin plates of nickel, stainless steel, and the like. Lead wires 26 comprising fine wires of gold, copper, nickel, and the like on which insulation coverings are applied are soldered to the upper ends of the pipes 25 which are protruded from the insulating plate 23. The wires are bundles and extended to each circuit of a printed board.
JP55052655A 1980-04-21 1980-04-21 Multi-point probe Expired JPS6023315B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP55052655A JPS6023315B2 (en) 1980-04-21 1980-04-21 Multi-point probe

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP55052655A JPS6023315B2 (en) 1980-04-21 1980-04-21 Multi-point probe

Publications (2)

Publication Number Publication Date
JPS56148071A true JPS56148071A (en) 1981-11-17
JPS6023315B2 JPS6023315B2 (en) 1985-06-06

Family

ID=12920866

Family Applications (1)

Application Number Title Priority Date Filing Date
JP55052655A Expired JPS6023315B2 (en) 1980-04-21 1980-04-21 Multi-point probe

Country Status (1)

Country Link
JP (1) JPS6023315B2 (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60142531A (en) * 1983-12-28 1985-07-27 Yokowo Mfg Co Ltd Inspection device for circuit substrate and the like
EP0965847A2 (en) * 1998-06-19 1999-12-22 Kabushiki Kaisha Linear Circuit Electrode spacing conversion adaptor

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60142531A (en) * 1983-12-28 1985-07-27 Yokowo Mfg Co Ltd Inspection device for circuit substrate and the like
JPH0249536B2 (en) * 1983-12-28 1990-10-30 Yoko Seisakusho Kk
EP0965847A2 (en) * 1998-06-19 1999-12-22 Kabushiki Kaisha Linear Circuit Electrode spacing conversion adaptor
EP0965847A3 (en) * 1998-06-19 2001-05-02 Kabushiki Kaisha Linear Circuit Electrode spacing conversion adaptor
US6331118B1 (en) 1998-06-19 2001-12-18 Kabushiki Kaisha Linear Circuit Electrode spacing conversion adaptor

Also Published As

Publication number Publication date
JPS6023315B2 (en) 1985-06-06

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