JPS556868A - Semiconductor device - Google Patents

Semiconductor device

Info

Publication number
JPS556868A
JPS556868A JP7953578A JP7953578A JPS556868A JP S556868 A JPS556868 A JP S556868A JP 7953578 A JP7953578 A JP 7953578A JP 7953578 A JP7953578 A JP 7953578A JP S556868 A JPS556868 A JP S556868A
Authority
JP
Japan
Prior art keywords
electrodes
group
belonging
outside
lead wires
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP7953578A
Other languages
Japanese (ja)
Other versions
JPS6115587B2 (en
Inventor
Toshio Kasuga
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp, Nippon Electric Co Ltd filed Critical NEC Corp
Priority to JP7953578A priority Critical patent/JPS556868A/en
Publication of JPS556868A publication Critical patent/JPS556868A/en
Publication of JPS6115587B2 publication Critical patent/JPS6115587B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/79—Apparatus for Tape Automated Bonding [TAB]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto

Abstract

PURPOSE: To perform stable connecting work, by arranging electrodes for drawing- out to the outside in plural rows along at least one side of elements, and by making the height of internal electrodes higher than that of external electrodes to the side.
CONSTITUTION: Electrodes 21 for drawing-out to the outside belonging to the first group and electrodes 22 for drawing-out to the outside belonging to the second group are arranged in parallel along one side of a semiconductor element 1. Both electrodes 21 and 22 are disposed so that the height of the electrodes 22 beonging to the second group located at portions inner than the side of the element be made higher than that of the electrodes 21 belonging to the first group positioned at portions outer than the electrodes 22. Lead wires 31 for drawing-out to the outside guide connected to the electrodes 21 belonging to the first group and lead wires 32 for drawing-out to the outside guide connected to the electrodes 22 belonging to the second group are insulated by means of an insulating plate 4 with thermal resistance. Faulty short circuit is prevented because the lead wires 32 for drawing out to the outside guide connected to the electrodes 22 belonging to the second group do not contact with the electrodes 21 belonging to the first group.
COPYRIGHT: (C)1980,JPO&Japio
JP7953578A 1978-06-29 1978-06-29 Semiconductor device Granted JPS556868A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP7953578A JPS556868A (en) 1978-06-29 1978-06-29 Semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP7953578A JPS556868A (en) 1978-06-29 1978-06-29 Semiconductor device

Publications (2)

Publication Number Publication Date
JPS556868A true JPS556868A (en) 1980-01-18
JPS6115587B2 JPS6115587B2 (en) 1986-04-24

Family

ID=13692680

Family Applications (1)

Application Number Title Priority Date Filing Date
JP7953578A Granted JPS556868A (en) 1978-06-29 1978-06-29 Semiconductor device

Country Status (1)

Country Link
JP (1) JPS556868A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5524479A (en) * 1978-08-09 1980-02-21 Nec Corp Semiconductor
JPS5773957A (en) * 1980-10-27 1982-05-08 Nec Corp Internal connection structure for multi-terminal package
JPH0195539A (en) * 1987-10-07 1989-04-13 Toshiba Corp Semiconductor device

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6521019B2 (en) 2017-10-03 2019-05-29 マツダ株式会社 Control device for a vehicle with multistage automatic transmission

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5524479A (en) * 1978-08-09 1980-02-21 Nec Corp Semiconductor
JPS5773957A (en) * 1980-10-27 1982-05-08 Nec Corp Internal connection structure for multi-terminal package
JPH0195539A (en) * 1987-10-07 1989-04-13 Toshiba Corp Semiconductor device

Also Published As

Publication number Publication date
JPS6115587B2 (en) 1986-04-24

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