JPS57102057A - Semiconductor device - Google Patents

Semiconductor device

Info

Publication number
JPS57102057A
JPS57102057A JP17725780A JP17725780A JPS57102057A JP S57102057 A JPS57102057 A JP S57102057A JP 17725780 A JP17725780 A JP 17725780A JP 17725780 A JP17725780 A JP 17725780A JP S57102057 A JPS57102057 A JP S57102057A
Authority
JP
Japan
Prior art keywords
circuit element
semiconductor element
electrically
pellet
conductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP17725780A
Other languages
Japanese (ja)
Inventor
Yasutoshi Kurihara
Komei Yatsuno
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP17725780A priority Critical patent/JPS57102057A/en
Publication of JPS57102057A publication Critical patent/JPS57102057A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/07—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L29/00
    • H01L25/072—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L29/00 the devices being arranged next to each other
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item

Abstract

PURPOSE:To enable to arrange easily a circuit element for substitution in a semiconductor device by a method wherein a space is reserved on a conductor plate as to enable to provide a reserve circuit element of the same kind with a circuit element provided on the conductor plate at the electrically and thermally equivalent position with the existing circuit element. CONSTITUTION:The first conductor 1 is provided on a metal supporter 2 interposig an insulator 3 between then. Moreover the second conductors 4, 4' are provided on the first conductor 1 interposing insulators 5, 5' between then. At this time, the second conductors 4, 4' are arranged as to become equivalent electrically and thermally to both of the semiconductor element pellet 6 and another semiconductor element pellet 8 to be substituted therefor. Accordingly even when electric connection between the semiconductor element pellet 6 and the other member is failed, the other semiconductor element pellet 8 for substitution can be arranged at once at the electrically and thermally equivalent position.
JP17725780A 1980-12-17 1980-12-17 Semiconductor device Pending JPS57102057A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP17725780A JPS57102057A (en) 1980-12-17 1980-12-17 Semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP17725780A JPS57102057A (en) 1980-12-17 1980-12-17 Semiconductor device

Publications (1)

Publication Number Publication Date
JPS57102057A true JPS57102057A (en) 1982-06-24

Family

ID=16027906

Family Applications (1)

Application Number Title Priority Date Filing Date
JP17725780A Pending JPS57102057A (en) 1980-12-17 1980-12-17 Semiconductor device

Country Status (1)

Country Link
JP (1) JPS57102057A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5984458A (en) * 1982-11-04 1984-05-16 Mitsubishi Electric Corp Gate turn off thyristor assembled body
JP2019519087A (en) * 2016-03-12 2019-07-04 ニンボー サニー オプテック カンパニー，リミテッド Array imaging module and molded photosensitive assembly, and method of manufacturing the same for electronic devices

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5984458A (en) * 1982-11-04 1984-05-16 Mitsubishi Electric Corp Gate turn off thyristor assembled body
JP2019519087A (en) * 2016-03-12 2019-07-04 ニンボー サニー オプテック カンパニー，リミテッド Array imaging module and molded photosensitive assembly, and method of manufacturing the same for electronic devices

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