JPH0441496B2 - - Google Patents

Info

Publication number
JPH0441496B2
JPH0441496B2 JP58132180A JP13218083A JPH0441496B2 JP H0441496 B2 JPH0441496 B2 JP H0441496B2 JP 58132180 A JP58132180 A JP 58132180A JP 13218083 A JP13218083 A JP 13218083A JP H0441496 B2 JPH0441496 B2 JP H0441496B2
Authority
JP
Japan
Prior art keywords
chip
wafer
defective
mark
semiconductor wafer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP58132180A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6024031A (ja
Inventor
Junichi Inoe
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tokyo Electron Ltd
Original Assignee
Tokyo Electron Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Electron Ltd filed Critical Tokyo Electron Ltd
Priority to JP13218083A priority Critical patent/JPS6024031A/ja
Publication of JPS6024031A publication Critical patent/JPS6024031A/ja
Publication of JPH0441496B2 publication Critical patent/JPH0441496B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
JP13218083A 1983-07-19 1983-07-19 半導体ウエハプロ−バ Granted JPS6024031A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP13218083A JPS6024031A (ja) 1983-07-19 1983-07-19 半導体ウエハプロ−バ

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP13218083A JPS6024031A (ja) 1983-07-19 1983-07-19 半導体ウエハプロ−バ

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP13943393A Division JPH08274133A (ja) 1993-05-18 1993-05-18 半導体ウエハプローバ

Publications (2)

Publication Number Publication Date
JPS6024031A JPS6024031A (ja) 1985-02-06
JPH0441496B2 true JPH0441496B2 (enrdf_load_stackoverflow) 1992-07-08

Family

ID=15075249

Family Applications (1)

Application Number Title Priority Date Filing Date
JP13218083A Granted JPS6024031A (ja) 1983-07-19 1983-07-19 半導体ウエハプロ−バ

Country Status (1)

Country Link
JP (1) JPS6024031A (enrdf_load_stackoverflow)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0727930B2 (ja) * 1986-03-27 1995-03-29 ロ−ム株式会社 ウエハプロ−バ
US4965515A (en) * 1986-10-15 1990-10-23 Tokyo Electron Limited Apparatus and method of testing a semiconductor wafer
JPH07111985B2 (ja) * 1986-11-17 1995-11-29 東京エレクトロン株式会社 プロ−ブ装置
JP2818551B2 (ja) * 1995-05-31 1998-10-30 山形日本電気株式会社 半導体ウェハのマーキング装置
JP2726651B2 (ja) * 1996-04-22 1998-03-11 東京エレクトロン株式会社 不良素子へのマーキング方法
JP2019091773A (ja) * 2017-11-14 2019-06-13 三菱電機株式会社 半導体装置用評価装置および半導体装置の評価方法

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5717873A (en) * 1980-07-04 1982-01-29 Mitsubishi Electric Corp Inspection method of semiconductor element
JPS5818936A (ja) * 1981-07-27 1983-02-03 Toshiba Corp 半導体素子の選別方式

Also Published As

Publication number Publication date
JPS6024031A (ja) 1985-02-06

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