JPS60231341A - 半導体装置 - Google Patents
半導体装置Info
- Publication number
- JPS60231341A JPS60231341A JP59086825A JP8682584A JPS60231341A JP S60231341 A JPS60231341 A JP S60231341A JP 59086825 A JP59086825 A JP 59086825A JP 8682584 A JP8682584 A JP 8682584A JP S60231341 A JPS60231341 A JP S60231341A
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor device
- ceramic substrate
- cap
- recess
- heat sink
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
- H10W76/60—Seals
Landscapes
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP59086825A JPS60231341A (ja) | 1984-04-27 | 1984-04-27 | 半導体装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP59086825A JPS60231341A (ja) | 1984-04-27 | 1984-04-27 | 半導体装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS60231341A true JPS60231341A (ja) | 1985-11-16 |
| JPH031835B2 JPH031835B2 (enFirst) | 1991-01-11 |
Family
ID=13897585
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP59086825A Granted JPS60231341A (ja) | 1984-04-27 | 1984-04-27 | 半導体装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS60231341A (enFirst) |
-
1984
- 1984-04-27 JP JP59086825A patent/JPS60231341A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPH031835B2 (enFirst) | 1991-01-11 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| EXPY | Cancellation because of completion of term |