JPS60130147A - 半導体装置の製造方法 - Google Patents

半導体装置の製造方法

Info

Publication number
JPS60130147A
JPS60130147A JP58239103A JP23910383A JPS60130147A JP S60130147 A JPS60130147 A JP S60130147A JP 58239103 A JP58239103 A JP 58239103A JP 23910383 A JP23910383 A JP 23910383A JP S60130147 A JPS60130147 A JP S60130147A
Authority
JP
Japan
Prior art keywords
film
lead
semiconductor element
electrode
length
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP58239103A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0221653B2 (enExample
Inventor
Kenzo Hatada
畑田　賢造
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP58239103A priority Critical patent/JPS60130147A/ja
Publication of JPS60130147A publication Critical patent/JPS60130147A/ja
Publication of JPH0221653B2 publication Critical patent/JPH0221653B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H10W72/701—
    • H10W72/01204—
    • H10W72/077—

Landscapes

  • Wire Bonding (AREA)
JP58239103A 1983-12-19 1983-12-19 半導体装置の製造方法 Granted JPS60130147A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP58239103A JPS60130147A (ja) 1983-12-19 1983-12-19 半導体装置の製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP58239103A JPS60130147A (ja) 1983-12-19 1983-12-19 半導体装置の製造方法

Publications (2)

Publication Number Publication Date
JPS60130147A true JPS60130147A (ja) 1985-07-11
JPH0221653B2 JPH0221653B2 (enExample) 1990-05-15

Family

ID=17039848

Family Applications (1)

Application Number Title Priority Date Filing Date
JP58239103A Granted JPS60130147A (ja) 1983-12-19 1983-12-19 半導体装置の製造方法

Country Status (1)

Country Link
JP (1) JPS60130147A (enExample)

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5619054U (enExample) * 1979-07-20 1981-02-19
JPS57152147A (en) * 1981-03-16 1982-09-20 Matsushita Electric Ind Co Ltd Formation of metal projection on metal lead

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5619054U (enExample) * 1979-07-20 1981-02-19
JPS57152147A (en) * 1981-03-16 1982-09-20 Matsushita Electric Ind Co Ltd Formation of metal projection on metal lead

Also Published As

Publication number Publication date
JPH0221653B2 (enExample) 1990-05-15

Similar Documents

Publication Publication Date Title
JPH0357618B2 (enExample)
US7470568B2 (en) Method of manufacturing a semiconductor device
JPS6149432A (ja) 半導体装置の製造方法
JPH06295939A (ja) 半導体装置
JPH04233244A (ja) 集積回路アセンブリ
JPS61214444A (ja) 半導体装置
JPS60130147A (ja) 半導体装置の製造方法
JPS61287238A (ja) 半導体装置の製造方法
JPS60130132A (ja) 半導体装置の製造方法
JPS60111433A (ja) 半導体装置の製造方法
JP2652222B2 (ja) 電子部品搭載用基板
JPH01286430A (ja) 半導体チップの実装方法
JP2000299399A (ja) 半導体装置
JPS6086853A (ja) 半導体装置の製造方法
JP2870251B2 (ja) マルチチップモジュールの製造方法
JP2004158895A (ja) 半導体装置の製造方法
JP2867547B2 (ja) 導電突起の形成方法
JPS6290939A (ja) 半導体装置
JPH01112741A (ja) 集積回路の接続方法
JPH02156647A (ja) Ｔａｂ用テープキャリア
JPH06232199A (ja) フリップチップｉｃの実装構造
JPH0628274B2 (ja) 半導体装置製造用フィルム・キャリア・テープ
JPS5835952A (ja) 半導体集積回路装置
JPH0258245A (ja) 半導体装置
JPH10303254A (ja) 半導体素子搭載用テープキャリア、およびそのテープキャリアを使用した半導体装置