JPS6010747A - 自動チツプ付装置 - Google Patents
自動チツプ付装置Info
- Publication number
- JPS6010747A JPS6010747A JP58119090A JP11909083A JPS6010747A JP S6010747 A JPS6010747 A JP S6010747A JP 58119090 A JP58119090 A JP 58119090A JP 11909083 A JP11909083 A JP 11909083A JP S6010747 A JPS6010747 A JP S6010747A
- Authority
- JP
- Japan
- Prior art keywords
- tray
- chip
- chips
- magazine
- trays
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H10P72/50—
-
- H10P72/3411—
Landscapes
- Die Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP58119090A JPS6010747A (ja) | 1983-06-30 | 1983-06-30 | 自動チツプ付装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP58119090A JPS6010747A (ja) | 1983-06-30 | 1983-06-30 | 自動チツプ付装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6010747A true JPS6010747A (ja) | 1985-01-19 |
| JPH0354467B2 JPH0354467B2 (OSRAM) | 1991-08-20 |
Family
ID=14752642
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP58119090A Granted JPS6010747A (ja) | 1983-06-30 | 1983-06-30 | 自動チツプ付装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6010747A (OSRAM) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100365543B1 (ko) * | 2000-08-30 | 2002-12-26 | 동양반도체장비 주식회사 | 반도체패키지 제조 장비의 엘리베이터 장치 |
| US6599077B2 (en) * | 1999-08-25 | 2003-07-29 | Maxtor Corporation | Material delivery system for clean room-like environments |
| JP2010208647A (ja) * | 2009-03-09 | 2010-09-24 | Honda Motor Co Ltd | 物品収納トレー及び物品収納トレーの搬送方法 |
-
1983
- 1983-06-30 JP JP58119090A patent/JPS6010747A/ja active Granted
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6599077B2 (en) * | 1999-08-25 | 2003-07-29 | Maxtor Corporation | Material delivery system for clean room-like environments |
| KR100365543B1 (ko) * | 2000-08-30 | 2002-12-26 | 동양반도체장비 주식회사 | 반도체패키지 제조 장비의 엘리베이터 장치 |
| JP2010208647A (ja) * | 2009-03-09 | 2010-09-24 | Honda Motor Co Ltd | 物品収納トレー及び物品収納トレーの搬送方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0354467B2 (OSRAM) | 1991-08-20 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN107613664B (zh) | 载具植板装置及其操作方法 | |
| US4775281A (en) | Apparatus and method for loading and unloading wafers | |
| US6722840B2 (en) | Wafer ring supplying and returning apparatus | |
| WO2015037099A1 (ja) | 対基板作業システム、作業方法、およびフィーダ移し替え方法 | |
| JPH09270595A (ja) | 電子部品装着装置および装着ヘッド装置 | |
| US20020192059A1 (en) | Methods and apparatus for transferring electrical components | |
| JPS6010747A (ja) | 自動チツプ付装置 | |
| JPH11330189A (ja) | 搬送装置 | |
| JP3119041B2 (ja) | 電子部品供給装置および電子部品供給方法 | |
| JP2555982B2 (ja) | 半導体装置の移載装置 | |
| JPH06135504A (ja) | チップ供給装置 | |
| JP2018150177A (ja) | ワーク移送システム | |
| JPH10284888A (ja) | 電子部品実装装置および電子部品実装方法 | |
| JP2000211718A (ja) | 切断パ―ツ搬出装置 | |
| JP2011108871A (ja) | 基板供給装置、基板供給方法、実装基板回収装置、及び実装基板回収方法 | |
| JP3954250B2 (ja) | 部品装着方法 | |
| JP2021077686A (ja) | ピックアップ方法、及び、ピックアップ装置 | |
| JP6713567B2 (ja) | 対基板作業システム | |
| CN116422650B (zh) | 一种等离子清洗设备 | |
| JP3116829B2 (ja) | チップ供給装置 | |
| JP3522131B2 (ja) | 産業ロボット装置 | |
| JP6505888B2 (ja) | 対基板作業システム | |
| JPH06155218A (ja) | ワークの搬入・搬出制御方法およびその装置 | |
| CN121400077A (en) | Method for changing arrangement of substrate working machine and supporting member | |
| JP2505699B2 (ja) | 穿孔装置におけるワ―ク供給方法及びその装置 |