JPS60102798A - プリント配線板の製造方法 - Google Patents
プリント配線板の製造方法Info
- Publication number
- JPS60102798A JPS60102798A JP21012783A JP21012783A JPS60102798A JP S60102798 A JPS60102798 A JP S60102798A JP 21012783 A JP21012783 A JP 21012783A JP 21012783 A JP21012783 A JP 21012783A JP S60102798 A JPS60102798 A JP S60102798A
- Authority
- JP
- Japan
- Prior art keywords
- holes
- printed wiring
- copper foil
- manufacturing
- etching
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000000034 method Methods 0.000 title claims description 16
- 239000003973 paint Substances 0.000 claims description 16
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 15
- 239000011889 copper foil Substances 0.000 claims description 15
- 238000004519 manufacturing process Methods 0.000 claims description 15
- 238000005530 etching Methods 0.000 claims description 13
- 238000005553 drilling Methods 0.000 claims description 3
- 238000010438 heat treatment Methods 0.000 claims description 3
- 239000000463 material Substances 0.000 description 11
- 229910052709 silver Inorganic materials 0.000 description 7
- 239000004332 silver Substances 0.000 description 7
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 6
- 239000000758 substrate Substances 0.000 description 6
- 238000003780 insertion Methods 0.000 description 4
- 230000037431 insertion Effects 0.000 description 4
- 238000004080 punching Methods 0.000 description 4
- 238000001723 curing Methods 0.000 description 3
- 230000006866 deterioration Effects 0.000 description 3
- 230000017525 heat dissipation Effects 0.000 description 3
- 239000011295 pitch Substances 0.000 description 3
- 238000005336 cracking Methods 0.000 description 2
- 238000003825 pressing Methods 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000013007 heat curing Methods 0.000 description 1
- 150000003378 silver Chemical class 0.000 description 1
Landscapes
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP21012783A JPS60102798A (ja) | 1983-11-09 | 1983-11-09 | プリント配線板の製造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP21012783A JPS60102798A (ja) | 1983-11-09 | 1983-11-09 | プリント配線板の製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS60102798A true JPS60102798A (ja) | 1985-06-06 |
| JPH0365673B2 JPH0365673B2 (enrdf_load_stackoverflow) | 1991-10-14 |
Family
ID=16584233
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP21012783A Granted JPS60102798A (ja) | 1983-11-09 | 1983-11-09 | プリント配線板の製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS60102798A (enrdf_load_stackoverflow) |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5069557A (enrdf_load_stackoverflow) * | 1973-10-01 | 1975-06-10 | ||
| JPS5516398A (en) * | 1978-07-13 | 1980-02-05 | Kernenergieverwert Ges Fuer | Device for preparing circuit connection and soldering connection |
| JPS5673496A (en) * | 1979-11-20 | 1981-06-18 | Matsushita Electric Ind Co Ltd | Method of fabricating bothhside printed circuit board |
| JPS5891696A (ja) * | 1981-11-26 | 1983-05-31 | 松下電器産業株式会社 | 両面スルホ−ル印刷配線板の製造方法 |
-
1983
- 1983-11-09 JP JP21012783A patent/JPS60102798A/ja active Granted
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5069557A (enrdf_load_stackoverflow) * | 1973-10-01 | 1975-06-10 | ||
| JPS5516398A (en) * | 1978-07-13 | 1980-02-05 | Kernenergieverwert Ges Fuer | Device for preparing circuit connection and soldering connection |
| JPS5673496A (en) * | 1979-11-20 | 1981-06-18 | Matsushita Electric Ind Co Ltd | Method of fabricating bothhside printed circuit board |
| JPS5891696A (ja) * | 1981-11-26 | 1983-05-31 | 松下電器産業株式会社 | 両面スルホ−ル印刷配線板の製造方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0365673B2 (enrdf_load_stackoverflow) | 1991-10-14 |
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