JPS60100673A - マスク蒸着による配線パタ−ンの形成方法 - Google Patents

マスク蒸着による配線パタ−ンの形成方法

Info

Publication number
JPS60100673A
JPS60100673A JP20695383A JP20695383A JPS60100673A JP S60100673 A JPS60100673 A JP S60100673A JP 20695383 A JP20695383 A JP 20695383A JP 20695383 A JP20695383 A JP 20695383A JP S60100673 A JPS60100673 A JP S60100673A
Authority
JP
Japan
Prior art keywords
metal mask
vapor deposition
mask
wiring pattern
pattern
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP20695383A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6338421B2 (enExample
Inventor
Takashi Kondo
隆 近藤
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP20695383A priority Critical patent/JPS60100673A/ja
Publication of JPS60100673A publication Critical patent/JPS60100673A/ja
Publication of JPS6338421B2 publication Critical patent/JPS6338421B2/ja
Granted legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/04—Coating on selected surface areas, e.g. using masks
    • C23C16/042—Coating on selected surface areas, e.g. using masks using masks
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C21/00—Accessories or implements for use in connection with applying liquids or other fluent materials to surfaces, not provided for in groups B05C1/00 - B05C19/00
    • B05C21/005—Masking devices
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/04—Coating on selected surface areas, e.g. using masks
    • C23C14/042—Coating on selected surface areas, e.g. using masks using masks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/14—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using spraying techniques to apply the conductive material, e.g. vapour evaporation
    • H05K3/143—Masks therefor

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Vapour Deposition (AREA)
  • Electrodes Of Semiconductors (AREA)
  • Physical Vapour Deposition (AREA)
JP20695383A 1983-11-02 1983-11-02 マスク蒸着による配線パタ−ンの形成方法 Granted JPS60100673A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP20695383A JPS60100673A (ja) 1983-11-02 1983-11-02 マスク蒸着による配線パタ−ンの形成方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP20695383A JPS60100673A (ja) 1983-11-02 1983-11-02 マスク蒸着による配線パタ−ンの形成方法

Publications (2)

Publication Number Publication Date
JPS60100673A true JPS60100673A (ja) 1985-06-04
JPS6338421B2 JPS6338421B2 (enExample) 1988-07-29

Family

ID=16531750

Family Applications (1)

Application Number Title Priority Date Filing Date
JP20695383A Granted JPS60100673A (ja) 1983-11-02 1983-11-02 マスク蒸着による配線パタ−ンの形成方法

Country Status (1)

Country Link
JP (1) JPS60100673A (enExample)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63206465A (ja) * 1987-02-20 1988-08-25 Fujitsu Ltd 導体パタ−ンの製造方法
FR2648156A1 (fr) * 1989-06-07 1990-12-14 Ppg Industries Inc Appareil et methode pour deposer par pulverisation cathodique un revetement sur un substrat
JPH1050478A (ja) * 1996-04-19 1998-02-20 Toray Ind Inc 有機電界発光素子およびその製造方法
JP2003060219A (ja) * 2001-06-04 2003-02-28 Fuji Electric Corp Res & Dev Ltd 薄膜太陽電池とその製造方法
JP2008047585A (ja) * 2006-08-11 2008-02-28 Brother Ind Ltd 配線基板の製造方法およびマスク

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63206465A (ja) * 1987-02-20 1988-08-25 Fujitsu Ltd 導体パタ−ンの製造方法
FR2648156A1 (fr) * 1989-06-07 1990-12-14 Ppg Industries Inc Appareil et methode pour deposer par pulverisation cathodique un revetement sur un substrat
JPH1050478A (ja) * 1996-04-19 1998-02-20 Toray Ind Inc 有機電界発光素子およびその製造方法
JP2003060219A (ja) * 2001-06-04 2003-02-28 Fuji Electric Corp Res & Dev Ltd 薄膜太陽電池とその製造方法
JP2008047585A (ja) * 2006-08-11 2008-02-28 Brother Ind Ltd 配線基板の製造方法およびマスク

Also Published As

Publication number Publication date
JPS6338421B2 (enExample) 1988-07-29

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