JPS60100673A - Formation of wiring pattern by masked vapor deposition - Google Patents

Abstract

PURPOSE:To enable formation of a pattern having excellent accuracy in the stage of forming a wiring pattern on the surface of a substrate by masked vapor deposition by using a magnetic material to constitute either of a mesh for forming a metallic mask or a foil layer on which the wiring pattern is formed. CONSTITUTION:A metallic mask 1 consisting of a mesh 2 and a foil layer 3 formed of Ni or stainless steel on which a wiring pattern is formed is adhered to a substrate 4 for vapor deposition in a vacuum chamber 6 in the stage of forming the wiring pattern by masked vapor deposition on said substrate. At least one of the mesh 2 or the foil layer 3 is constituted of a magnetic material and is strongly attracted to the substrate 4 by a magnet 5. Since a material 8 to be deposited by evaporation is deposited in this state to the substrate, the material 8 is prevented from spreading to the spacing between the layer 3 and the material 4 and the pattern having high accuracy is formed.

Description

[Detailed Description of the Invention] [Technical Field of the Invention] The present invention relates to a method for forming a wiring pattern by mask vapor deposition, and more specifically, a method for forming a desired thin film pattern on a desired substrate using a specific metal mask. The present invention relates to a method of forming a wiring pattern by mask vapor deposition.

[Prior art]

Conventionally, as a method for forming this type of thin film pattern, a predetermined circuit 1f! - In order to obtain a broken pattern, it was necessary to overlap multiple masks, which required a large number of masks, and the overlay accuracy was poor (or it was not possible to form a highly accurate pattern (@ Kaisho 58-67
(See Publication No. 044).

[Summary of the invention]

This invention was made in order to eliminate the drawbacks of the conventional products as described above, and it is made of a foil/1'=l integral structure in which a pattern is formed on the mesh part, which becomes the base part, by means such as plating. By using a metal mask, the purpose is to vapor-deposit and form a relatively complicated wiring pattern using a single mask.

[Embodiments of the invention]

Figure 1 is a cross-sectional view showing one embodiment of the present invention, and 1 indicates a metal mask, which is composed of a mesh 2 and a foil layer 2 on which a wiring pattern is formed. Reference numeral 4 denotes an object to be deposited, which is mounted in close contact with the metal mask 1 so that the wiring pattern provided on the metal mask 1 can be patterned accurately.
Ru.

Here, for the metal mask 1, a wiring pattern is formed by applying nickel foil on a stainless steel mesh or a copper mesh by electroforming or the like. The wiring pattern can be formed at the same time as electroforming, or it can be patterned by means such as photolithography after electroforming is applied to the entire surface.

The mesh 21 of the metal mask 1 or the foil layer 3 on which the wiring pattern is formed is small (one of the requirements of this invention is that either one is made of a magnetic material, which will be described later). This is important to ensure close contact with the object 4 and to prevent the vapor deposited material 8 from getting around between the foil layer 3 and the object 4 to be vapor deposited.

FIG. 2 shows a partial plan view of FIG. 1, and 31 is the foil layer 3.
This shows a part of the pattern formed in the above, and shows an open area where a predetermined portion of the foil of the foil layer 3 is removed in order for the vapor deposit 8 that has passed through the mensch 2 to selectively adhere to the object 4 to be vapor deposited. shows.

Here, it is preferable that the mesh and the pattern intersect diagonally, and by taking this into account as much as possible at the stage of designing the circuit pattern, it is possible to create an accurate and precise pattern.
can be vapor-deposited.

Of course, there is no problem even if there is a pattern parallel to mesh 2.

Fig. 3 schematically shows how a wiring pattern is actually formed by vapor deposition, and 6 is a vapor deposition chamber;
indicates a magnet, T indicates a holder, and 8 indicates a deposit.

Here, the magnet 5 has a plurality of small pieces arranged at predetermined positions so that the metal mask 1 can evenly adhere to the object to be deposited 4, but it is also possible to use a sorted magnet or a suitable electromagnet. It is. In addition, the strength of the magnet is small enough to penetrate the object 4 to be evaporated (it is enough to attract one metal mask and stick closely to the object 4 to be evaporated. T holds the object 4, etc. to be evaporated, and usually The holder has a structure that allows rotation and revolution, and can hold a plurality of objects 4 to be deposited.

Reference numeral 8 indicates a deposit made of minute particles heated and evaporated by a heating source such as an electron beam (not shown), which flies at an appropriate speed and penetrates the pattern of the metal mask 1 to form the deposited material 4.
A desired wiring pattern is formed.

Note that the deposit 8 is preferably made of a multilayer metal such as chromium or copper in order to ensure the degree of adhesion with the deposit 4.

Further, the foil layer 3 on which the wiring pattern is formed is kept for a required period of time l! to prevent the mesh 2 from shading the area. In order to obtain I, a thickness of 0.5 μm or more is required. Although there is no particular limit to the upper limit, there are restrictions from the manufacturing of the metal mask 1 and the like.

In the above embodiment, the metal mask 1 was applied as a metal base, but it is effective to coat it with gold or other plating to improve the cleaning effect.

Furthermore, if there is no problem even if the metal mask 1 is deposited with the front and back sides reversed, it goes without saying that the front and back sides can be freely selected.

〔Effect of the invention〕

As described above, in this invention, since the metal mask is made of a magnetic material, it can be brought into close contact with the substrate, and therefore, accurate and precise wiring patterns can be formed on an insulating substrate such as ceramic with a single metal mask. be able to. In addition, there is an advantage that circuit boards can be provided quickly and at low cost.

[Brief explanation of drawings]

FIG. 1 is a sectional view of the metal mask, FIG. 2 is a partial plan view of the metal mask, and FIG. 3 is a schematic diagram showing the state of vapor deposition. In the figure, 1 is a metal mask, 2 is a mesh, 3 is a foil layer on which a wiring pattern is formed, 4 is an object to be deposited, 5 is a magnet, 6 is a deposition chamber, T is a holder, 8 is a deposition material, and 31 is a desired This is an opening provided in a part of the foil layer for forming a wiring pattern. Note that the same symbols that must be in the middle indicate the same or equivalent parts. Agent Masuo Oiwa (2 others)

Claims (2)

[Claims] (1) In a method of forming a wiring pattern on a substrate by vapor deposition using a metal mask, the metal mask is made of a magnetic material, and the metal mask is
A method for forming a wiring pattern using mask evaporation, characterized in that N is vapor-deposited on the substrate in a dense manner by using a mask vapor deposition method. (2) The metal mask consists of two layers: a mesh and a foil on which a substantial pattern is formed, the foil has a predetermined thickness, and at least 10,000 of the mesh and the foil are made of magnetic material. Claim No. (11) characterized in that
Mask vapor deposition 1c, J-ru wiring pattern formation method as described in 1.