JPS5992533A - 樹脂封止形半導体装置の製造方法 - Google Patents

樹脂封止形半導体装置の製造方法

Info

Publication number
JPS5992533A
JPS5992533A JP57202798A JP20279882A JPS5992533A JP S5992533 A JPS5992533 A JP S5992533A JP 57202798 A JP57202798 A JP 57202798A JP 20279882 A JP20279882 A JP 20279882A JP S5992533 A JPS5992533 A JP S5992533A
Authority
JP
Japan
Prior art keywords
resin
semiconductor device
resin layer
support
warpage
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP57202798A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0373141B2 (OSRAM
Inventor
Kenichi Tateno
立野　健一
Masami Yokozawa
横沢　真覩
Hiroyuki Fujii
博之 藤井
Mikio Nishikawa
西川　幹雄
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electronics Corp
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electronics Corp, Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electronics Corp
Priority to JP57202798A priority Critical patent/JPS5992533A/ja
Publication of JPS5992533A publication Critical patent/JPS5992533A/ja
Publication of JPH0373141B2 publication Critical patent/JPH0373141B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H10W74/01—
    • H10W72/884—
    • H10W90/756—

Landscapes

  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
JP57202798A 1982-11-17 1982-11-17 樹脂封止形半導体装置の製造方法 Granted JPS5992533A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP57202798A JPS5992533A (ja) 1982-11-17 1982-11-17 樹脂封止形半導体装置の製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP57202798A JPS5992533A (ja) 1982-11-17 1982-11-17 樹脂封止形半導体装置の製造方法

Publications (2)

Publication Number Publication Date
JPS5992533A true JPS5992533A (ja) 1984-05-28
JPH0373141B2 JPH0373141B2 (OSRAM) 1991-11-20

Family

ID=16463362

Family Applications (1)

Application Number Title Priority Date Filing Date
JP57202798A Granted JPS5992533A (ja) 1982-11-17 1982-11-17 樹脂封止形半導体装置の製造方法

Country Status (1)

Country Link
JP (1) JPS5992533A (OSRAM)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011108699A (ja) * 2009-11-13 2011-06-02 Shindengen Electric Mfg Co Ltd 半導体装置製造用金型、半導体装置の製造方法、および半導体装置

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011108699A (ja) * 2009-11-13 2011-06-02 Shindengen Electric Mfg Co Ltd 半導体装置製造用金型、半導体装置の製造方法、および半導体装置

Also Published As

Publication number Publication date
JPH0373141B2 (OSRAM) 1991-11-20

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