JPH0373141B2 - - Google Patents
Info
- Publication number
- JPH0373141B2 JPH0373141B2 JP57202798A JP20279882A JPH0373141B2 JP H0373141 B2 JPH0373141 B2 JP H0373141B2 JP 57202798 A JP57202798 A JP 57202798A JP 20279882 A JP20279882 A JP 20279882A JP H0373141 B2 JPH0373141 B2 JP H0373141B2
- Authority
- JP
- Japan
- Prior art keywords
- resin
- support
- resin layer
- back side
- view
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H10W74/01—
-
- H10W72/884—
-
- H10W90/756—
Landscapes
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP57202798A JPS5992533A (ja) | 1982-11-17 | 1982-11-17 | 樹脂封止形半導体装置の製造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP57202798A JPS5992533A (ja) | 1982-11-17 | 1982-11-17 | 樹脂封止形半導体装置の製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5992533A JPS5992533A (ja) | 1984-05-28 |
| JPH0373141B2 true JPH0373141B2 (OSRAM) | 1991-11-20 |
Family
ID=16463362
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP57202798A Granted JPS5992533A (ja) | 1982-11-17 | 1982-11-17 | 樹脂封止形半導体装置の製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5992533A (OSRAM) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5189062B2 (ja) * | 2009-11-13 | 2013-04-24 | 新電元工業株式会社 | 半導体装置製造用金型、半導体装置の製造方法、および半導体装置 |
-
1982
- 1982-11-17 JP JP57202798A patent/JPS5992533A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5992533A (ja) | 1984-05-28 |
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