JPS596844U - 樹脂封止型半導体装置 - Google Patents

樹脂封止型半導体装置

Info

Publication number
JPS596844U
JPS596844U JP10160982U JP10160982U JPS596844U JP S596844 U JPS596844 U JP S596844U JP 10160982 U JP10160982 U JP 10160982U JP 10160982 U JP10160982 U JP 10160982U JP S596844 U JPS596844 U JP S596844U
Authority
JP
Japan
Prior art keywords
resin
semiconductor device
encapsulated semiconductor
recorded
lapped
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP10160982U
Other languages
English (en)
Japanese (ja)
Other versions
JPH041733Y2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html
Inventor
小林　安久
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp filed Critical NEC Corp
Priority to JP10160982U priority Critical patent/JPS596844U/ja
Publication of JPS596844U publication Critical patent/JPS596844U/ja
Application granted granted Critical
Publication of JPH041733Y2 publication Critical patent/JPH041733Y2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
JP10160982U 1982-07-05 1982-07-05 樹脂封止型半導体装置 Granted JPS596844U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP10160982U JPS596844U (ja) 1982-07-05 1982-07-05 樹脂封止型半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10160982U JPS596844U (ja) 1982-07-05 1982-07-05 樹脂封止型半導体装置

Publications (2)

Publication Number Publication Date
JPS596844U true JPS596844U (ja) 1984-01-17
JPH041733Y2 JPH041733Y2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 1992-01-21

Family

ID=30239875

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10160982U Granted JPS596844U (ja) 1982-07-05 1982-07-05 樹脂封止型半導体装置

Country Status (1)

Country Link
JP (1) JPS596844U (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0373737U (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) * 1989-11-20 1991-07-24

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS55105951U (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) * 1979-01-18 1980-07-24
JPS55111348U (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) * 1979-10-02 1980-08-05

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS55105951U (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) * 1979-01-18 1980-07-24
JPS55111348U (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) * 1979-10-02 1980-08-05

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0373737U (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) * 1989-11-20 1991-07-24

Also Published As

Publication number Publication date
JPH041733Y2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 1992-01-21

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