JPS605136U - 半導体装置 - Google Patents

半導体装置

Info

Publication number
JPS605136U
JPS605136U JP8548283U JP8548283U JPS605136U JP S605136 U JPS605136 U JP S605136U JP 8548283 U JP8548283 U JP 8548283U JP 8548283 U JP8548283 U JP 8548283U JP S605136 U JPS605136 U JP S605136U
Authority
JP
Japan
Prior art keywords
semiconductor equipment
abstract
recorded
electronic filing
semiconductor device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP8548283U
Other languages
English (en)
Inventor
塩井 俊二
Original Assignee
ロ−ム株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by ロ−ム株式会社 filed Critical ロ−ム株式会社
Priority to JP8548283U priority Critical patent/JPS605136U/ja
Publication of JPS605136U publication Critical patent/JPS605136U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。

Description

【図面の簡単な説明】
第1図はこの考案に係る半導体装置の一実施0を示す斜
視図、第2図はこの考案の他の実施例を  ヒ  示す
斜視図である。 1・・・・・・モールド部、2・・四半導体素子、3,
3′ ・・・・・・リード端子。

Claims (1)

    【実用新案登録請求の範囲】
  1. モールド部の形状が六角形であることを特徴2する半導
    体装置。
JP8548283U 1983-06-03 1983-06-03 半導体装置 Pending JPS605136U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP8548283U JPS605136U (ja) 1983-06-03 1983-06-03 半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8548283U JPS605136U (ja) 1983-06-03 1983-06-03 半導体装置

Publications (1)

Publication Number Publication Date
JPS605136U true JPS605136U (ja) 1985-01-14

Family

ID=30215450

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8548283U Pending JPS605136U (ja) 1983-06-03 1983-06-03 半導体装置

Country Status (1)

Country Link
JP (1) JPS605136U (ja)

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS52106674A (en) * 1976-03-05 1977-09-07 Hitachi Ltd Semiconductor device
JPS53140971A (en) * 1977-05-16 1978-12-08 Fujitsu Ltd Electronic parts package

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS52106674A (en) * 1976-03-05 1977-09-07 Hitachi Ltd Semiconductor device
JPS53140971A (en) * 1977-05-16 1978-12-08 Fujitsu Ltd Electronic parts package

Similar Documents

Publication Publication Date Title
JPS605136U (ja) 半導体装置
JPS597542U (ja) 温度ヒユ−ズ
JPS60101756U (ja) 半導体装置用リ−ドフレ−ム
JPS58180643U (ja) 半導体装置のパツケ−ジ
JPS6071146U (ja) 半導体装置
JPS581331U (ja) 自在ブラシ
JPS5834740U (ja) 半導体装置
JPS59189979U (ja) リ−ド線止め具
JPS6094834U (ja) 半導体装置
JPS60194337U (ja) 半導体装置用モ−ルド金型
JPS60181048U (ja) 半導体装置用リ−ドフレ−ム
JPS5937747U (ja) 半導体装置
JPS6063953U (ja) 半導体装置
JPS6015763U (ja) ダブル配線端子
JPS6059814U (ja) ネジ
JPS5925167U (ja) ジヤンパユニツト
JPS58107076U (ja)
JPS5923750U (ja) 半導体装置
JPS6033439U (ja) 半導体装置
JPS6033451U (ja) 樹脂封止型半導体装置
JPS6052635U (ja) リ−ドフレ−ム
JPS59273U (ja) ネジ
JPS60101755U (ja) 半導体装置
JPS6030544U (ja) 半導体装置
JPS58135957U (ja) 半導体装置