JPH041733Y2 - - Google Patents

Info

Publication number
JPH041733Y2
JPH041733Y2 JP1982101609U JP10160982U JPH041733Y2 JP H041733 Y2 JPH041733 Y2 JP H041733Y2 JP 1982101609 U JP1982101609 U JP 1982101609U JP 10160982 U JP10160982 U JP 10160982U JP H041733 Y2 JPH041733 Y2 JP H041733Y2
Authority
JP
Japan
Prior art keywords
resin
mold
sealed
semiconductor device
product
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP1982101609U
Other languages
English (en)
Japanese (ja)
Other versions
JPS596844U (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP10160982U priority Critical patent/JPS596844U/ja
Publication of JPS596844U publication Critical patent/JPS596844U/ja
Application granted granted Critical
Publication of JPH041733Y2 publication Critical patent/JPH041733Y2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
JP10160982U 1982-07-05 1982-07-05 樹脂封止型半導体装置 Granted JPS596844U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP10160982U JPS596844U (ja) 1982-07-05 1982-07-05 樹脂封止型半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10160982U JPS596844U (ja) 1982-07-05 1982-07-05 樹脂封止型半導体装置

Publications (2)

Publication Number Publication Date
JPS596844U JPS596844U (ja) 1984-01-17
JPH041733Y2 true JPH041733Y2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 1992-01-21

Family

ID=30239875

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10160982U Granted JPS596844U (ja) 1982-07-05 1982-07-05 樹脂封止型半導体装置

Country Status (1)

Country Link
JP (1) JPS596844U (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2529690Y2 (ja) * 1989-11-20 1997-03-19 天龍工業株式会社 衝撃エネルギ吸収装置付き乗物用座席

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS607484Y2 (ja) * 1979-01-18 1985-03-13 日本電気ホームエレクトロニクス株式会社 電子部品の樹脂モ−ルド装置
JPS55111348U (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) * 1979-10-02 1980-08-05

Also Published As

Publication number Publication date
JPS596844U (ja) 1984-01-17

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