JPH041733Y2 - - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a resin molding mold for manufacturing a resin molded semiconductor device.

In the encapsulation process, which is part of the manufacturing process for resin-encapsulated semiconductor devices using conventional resin encapsulation molds, as shown in Figure 1, the lead frame is first fixed inside the encapsulation mold. 1A), and then encapsulated with resin (FIG. 1B). A common method is to divide the mold into two parts after the resin has completely solidified, and use an ejector rod to push a part of the semiconductor device to take out the product (FIG. 1C).

In this process, the resin adheres well to the mold, so in the ejection process shown in C in Figure 1, a part of the resin adheres to the mold and remains on the mold side, resulting in chipping and chipping of the product.
This often caused defects such as cracks. This phenomenon is less likely to occur when the surface of the semiconductor device container has a mirror surface, and more likely to occur when the surface is a so-called matte surface with fine irregularities. However, in a container whose surface is made of only a mirror surface, the surface of the product tends to become dirty due to the influence of dirty parts of the mold during the resin sealing process in the large area, which lowers the product value. Furthermore, it is difficult to stamp product names etc. on mirror surfaces. There has been a conventional method of making only the stamping surface matte in order to improve the stamping performance, but with this method, stains tend to be noticeable on the wide surface facing the stamping surface. Further, the part shown in FIG. 1, ie, the part where the resin flows into the mold (hereinafter referred to as the gate part), must be removed together with the product when the product is removed from the mold. However, this gate part has a larger contact area with the mold than other parts, and is also very thin, so it is a part where detachment failures are likely to occur and the container is likely to chip or crack.

The purpose of the present invention is to provide a resin-sealing mold for a semiconductor device in which the surface of the product is resistant to staining and measures are taken to address the areas where chips and cracks are most likely to occur.

According to the present invention, in a resin sealing mold for semiconductor devices, only one surface into which the resin flows is JIS B0601
A resin-sealed mold is obtained, which has a mirror surface corresponding to the lap finish specified by the method, and all other surfaces are matte rough surfaces with irregularities of 0.1 to 0.8 microns. The surface that has the part where the resin flows is prone to chipping and cracking, so this part is made into a mirror surface. On the other hand, all other surfaces are made rough in consideration of product contamination. The roughness of 0.1 to 0.8 microns was determined from a practical standpoint, taking into consideration both chipping, cracking, and staining.

The present invention will be explained below based on examples.

FIG. 2 is a perspective view showing an embodiment of a resin-sealed semiconductor device manufactured using a resin-sealed mold according to the present invention. This is one in which resin is injected from one of the two surfaces from which external leads are not led out, and only that surface is made up of a specified mirror surface 9, and the other surfaces are made of a specified matte surface 8. are doing.

In this way, during the resin sealing process, the resin inlet part that is the most difficult to separate from the mold is made of a mirror surface that is easy to separate from, so there is less cracking compared to a completely matte one.
Defects such as chips are less likely to occur, and yields can be expected to improve. In addition, compared to a fully mirrored container, most of the container is made of a matte surface, so it is less susceptible to dirt from the mold, making it possible to produce products with high commercial value, as well as being easy to stamp. It is.

Furthermore, when a semiconductor device is slid on a rail and automatically attached to a printed circuit board, etc., the direction of the device can be easily detected by measuring the reflectance using light, making it easy to prevent the wrong direction when attaching. It is convenient for

Furthermore, even when only the gate portion of the sealing mold, which wears quickly, is to be replaced, the mirror surface allows for good contact with other surfaces, making it easy to replace, and equipment costs can be reduced.

[Brief explanation of the drawing]

FIGS. 1A to 1C are cross-sectional views showing the manufacturing process of a resin-sealed semiconductor device using a conventional resin-sealed mold. FIG. 2 is a perspective view showing an embodiment of a resin-sealed semiconductor device manufactured using a resin-sealed mold according to the present invention. 1... Semiconductor element, 2... Resin sealing mold, 3...
... Lead frame, 4 ... Resin, 5 ... Gate section, 6 ... Extrusion rod, 7 ... External lead, 8 ...
... Matte surface, 9... Glossy surface.

Claims (1)

[Scope of utility model registration request] In a resin-sealed mold for a resin-sealed semiconductor device in which a plurality of external leads are led out from two of the four side surfaces, one of the surfaces corresponding to the four side surfaces of the inner wall of the resin-sealed mold , only one surface into which the resin flows is made of a mirror surface equivalent to lap finishing, and all the remaining surfaces of the inner wall of the resin sealing mold are
A resin-sealed mold characterized by a matte rough surface having irregularities of 0.1 to 0.8 microns.