JPS5932154A - はんだバンプの形成方法 - Google Patents
はんだバンプの形成方法Info
- Publication number
- JPS5932154A JPS5932154A JP57142933A JP14293382A JPS5932154A JP S5932154 A JPS5932154 A JP S5932154A JP 57142933 A JP57142933 A JP 57142933A JP 14293382 A JP14293382 A JP 14293382A JP S5932154 A JPS5932154 A JP S5932154A
- Authority
- JP
- Japan
- Prior art keywords
- solder
- forming
- bump
- plating
- film
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 229910000679 solder Inorganic materials 0.000 title claims abstract description 27
- 238000000034 method Methods 0.000 title claims description 17
- 238000007747 plating Methods 0.000 claims abstract description 18
- 229910052782 aluminium Inorganic materials 0.000 claims abstract description 4
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims abstract description 4
- 229910052737 gold Inorganic materials 0.000 claims abstract description 4
- 229910052802 copper Inorganic materials 0.000 claims abstract description 3
- 229910052750 molybdenum Inorganic materials 0.000 claims abstract description 3
- 230000004888 barrier function Effects 0.000 claims abstract 3
- 229910052804 chromium Inorganic materials 0.000 claims abstract 2
- 230000015572 biosynthetic process Effects 0.000 claims description 5
- 239000004065 semiconductor Substances 0.000 claims description 5
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 3
- 239000010931 gold Substances 0.000 claims description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 2
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 claims description 2
- 239000010949 copper Substances 0.000 claims description 2
- 239000011733 molybdenum Substances 0.000 claims description 2
- 229910001120 nichrome Inorganic materials 0.000 claims description 2
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 claims 1
- 239000011651 chromium Substances 0.000 claims 1
- 239000007787 solid Substances 0.000 claims 1
- 229910052751 metal Inorganic materials 0.000 abstract description 7
- 239000002184 metal Substances 0.000 abstract description 7
- 229910052759 nickel Inorganic materials 0.000 abstract description 3
- 230000001681 protective effect Effects 0.000 abstract description 2
- 229910018487 Ni—Cr Inorganic materials 0.000 abstract 1
- 238000005530 etching Methods 0.000 description 5
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 4
- 229920002120 photoresistant polymer Polymers 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 238000005275 alloying Methods 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 210000001217 buttock Anatomy 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 239000010985 leather Substances 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000001259 photo etching Methods 0.000 description 1
- 231100000444 skin lesion Toxicity 0.000 description 1
- 206010040882 skin lesion Diseases 0.000 description 1
- 239000002689 soil Substances 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/10—Bump connectors ; Manufacturing methods related thereto
- H01L24/11—Manufacturing methods
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/11—Manufacturing methods
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/12—Structure, shape, material or disposition of the bump connectors prior to the connecting process
- H01L2224/13—Structure, shape, material or disposition of the bump connectors prior to the connecting process of an individual bump connector
- H01L2224/13001—Core members of the bump connector
- H01L2224/13099—Material
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01013—Aluminum [Al]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01024—Chromium [Cr]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01029—Copper [Cu]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01042—Molybdenum [Mo]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01078—Platinum [Pt]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01079—Gold [Au]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/013—Alloys
- H01L2924/014—Solder alloys
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP57142933A JPS5932154A (ja) | 1982-08-18 | 1982-08-18 | はんだバンプの形成方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP57142933A JPS5932154A (ja) | 1982-08-18 | 1982-08-18 | はんだバンプの形成方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5932154A true JPS5932154A (ja) | 1984-02-21 |
| JPH0226780B2 JPH0226780B2 (enrdf_load_stackoverflow) | 1990-06-12 |
Family
ID=15327015
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP57142933A Granted JPS5932154A (ja) | 1982-08-18 | 1982-08-18 | はんだバンプの形成方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5932154A (enrdf_load_stackoverflow) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6226544U (enrdf_load_stackoverflow) * | 1985-07-30 | 1987-02-18 | ||
| JPH0290622A (ja) * | 1988-09-28 | 1990-03-30 | Seiko Instr Inc | 金バンプの形成方法 |
| US5175609A (en) * | 1991-04-10 | 1992-12-29 | International Business Machines Corporation | Structure and method for corrosion and stress-resistant interconnecting metallurgy |
| US5266522A (en) * | 1991-04-10 | 1993-11-30 | International Business Machines Corporation | Structure and method for corrosion and stress-resistant interconnecting metallurgy |
| JPH07201871A (ja) * | 1993-12-10 | 1995-08-04 | Internatl Business Mach Corp <Ibm> | 金属コンタクト形成方法 |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5224466A (en) * | 1975-08-20 | 1977-02-23 | Matsushita Electric Ind Co Ltd | Semiconductor electrode formation method |
| JPS52102670A (en) * | 1976-02-25 | 1977-08-29 | Hitachi Ltd | Formation of extruding electrode in semiconductor device |
| JPS5469382A (en) * | 1977-11-14 | 1979-06-04 | Nec Corp | Production of semiconductor device |
-
1982
- 1982-08-18 JP JP57142933A patent/JPS5932154A/ja active Granted
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5224466A (en) * | 1975-08-20 | 1977-02-23 | Matsushita Electric Ind Co Ltd | Semiconductor electrode formation method |
| JPS52102670A (en) * | 1976-02-25 | 1977-08-29 | Hitachi Ltd | Formation of extruding electrode in semiconductor device |
| JPS5469382A (en) * | 1977-11-14 | 1979-06-04 | Nec Corp | Production of semiconductor device |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6226544U (enrdf_load_stackoverflow) * | 1985-07-30 | 1987-02-18 | ||
| JPH0290622A (ja) * | 1988-09-28 | 1990-03-30 | Seiko Instr Inc | 金バンプの形成方法 |
| US5175609A (en) * | 1991-04-10 | 1992-12-29 | International Business Machines Corporation | Structure and method for corrosion and stress-resistant interconnecting metallurgy |
| US5266522A (en) * | 1991-04-10 | 1993-11-30 | International Business Machines Corporation | Structure and method for corrosion and stress-resistant interconnecting metallurgy |
| US5442239A (en) * | 1991-04-10 | 1995-08-15 | International Business Machines Corporation | Structure and method for corrosion and stress-resistant interconnecting metallurgy |
| JPH07201871A (ja) * | 1993-12-10 | 1995-08-04 | Internatl Business Mach Corp <Ibm> | 金属コンタクト形成方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0226780B2 (enrdf_load_stackoverflow) | 1990-06-12 |
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