JPH0226780B2 - - Google Patents

Info

Publication number
JPH0226780B2
JPH0226780B2 JP57142933A JP14293382A JPH0226780B2 JP H0226780 B2 JPH0226780 B2 JP H0226780B2 JP 57142933 A JP57142933 A JP 57142933A JP 14293382 A JP14293382 A JP 14293382A JP H0226780 B2 JPH0226780 B2 JP H0226780B2
Authority
JP
Japan
Prior art keywords
forming
electrode
plating
barrier film
solder
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP57142933A
Other languages
English (en)
Japanese (ja)
Other versions
JPS5932154A (ja
Inventor
Kenichi Ogawa
Masahiko Kawada
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Seiko Instruments Inc
Original Assignee
Seiko Instruments Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Seiko Instruments Inc filed Critical Seiko Instruments Inc
Priority to JP57142933A priority Critical patent/JPS5932154A/ja
Publication of JPS5932154A publication Critical patent/JPS5932154A/ja
Publication of JPH0226780B2 publication Critical patent/JPH0226780B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/10—Bump connectors ; Manufacturing methods related thereto
    • H01L24/11—Manufacturing methods
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/11—Manufacturing methods
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/12—Structure, shape, material or disposition of the bump connectors prior to the connecting process
    • H01L2224/13—Structure, shape, material or disposition of the bump connectors prior to the connecting process of an individual bump connector
    • H01L2224/13001—Core members of the bump connector
    • H01L2224/13099—Material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01013—Aluminum [Al]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01024—Chromium [Cr]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01029—Copper [Cu]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01042—Molybdenum [Mo]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01078—Platinum [Pt]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01079—Gold [Au]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/013—Alloys
    • H01L2924/014—Solder alloys

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)
JP57142933A 1982-08-18 1982-08-18 はんだバンプの形成方法 Granted JPS5932154A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP57142933A JPS5932154A (ja) 1982-08-18 1982-08-18 はんだバンプの形成方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP57142933A JPS5932154A (ja) 1982-08-18 1982-08-18 はんだバンプの形成方法

Publications (2)

Publication Number Publication Date
JPS5932154A JPS5932154A (ja) 1984-02-21
JPH0226780B2 true JPH0226780B2 (enrdf_load_stackoverflow) 1990-06-12

Family

ID=15327015

Family Applications (1)

Application Number Title Priority Date Filing Date
JP57142933A Granted JPS5932154A (ja) 1982-08-18 1982-08-18 はんだバンプの形成方法

Country Status (1)

Country Link
JP (1) JPS5932154A (enrdf_load_stackoverflow)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6226544U (enrdf_load_stackoverflow) * 1985-07-30 1987-02-18
JPH0290622A (ja) * 1988-09-28 1990-03-30 Seiko Instr Inc 金バンプの形成方法
US5266522A (en) * 1991-04-10 1993-11-30 International Business Machines Corporation Structure and method for corrosion and stress-resistant interconnecting metallurgy
US5175609A (en) * 1991-04-10 1992-12-29 International Business Machines Corporation Structure and method for corrosion and stress-resistant interconnecting metallurgy
US5384283A (en) * 1993-12-10 1995-01-24 International Business Machines Corporation Resist protection of ball limiting metal during etch process

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5224466A (en) * 1975-08-20 1977-02-23 Matsushita Electric Ind Co Ltd Semiconductor electrode formation method
JPS52102670A (en) * 1976-02-25 1977-08-29 Hitachi Ltd Formation of extruding electrode in semiconductor device
JPS6059742B2 (ja) * 1977-11-14 1985-12-26 日本電気株式会社 半導体装置およびその製造方法

Also Published As

Publication number Publication date
JPS5932154A (ja) 1984-02-21

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