JPS6349378B2 - - Google Patents
Info
- Publication number
- JPS6349378B2 JPS6349378B2 JP58179602A JP17960283A JPS6349378B2 JP S6349378 B2 JPS6349378 B2 JP S6349378B2 JP 58179602 A JP58179602 A JP 58179602A JP 17960283 A JP17960283 A JP 17960283A JP S6349378 B2 JPS6349378 B2 JP S6349378B2
- Authority
- JP
- Japan
- Prior art keywords
- film
- metal film
- bump
- forming
- bumps
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000002184 metal Substances 0.000 claims description 25
- 229910052751 metal Inorganic materials 0.000 claims description 25
- 229920001721 polyimide Polymers 0.000 claims description 22
- 239000010931 gold Substances 0.000 claims description 12
- 229920002120 photoresistant polymer Polymers 0.000 claims description 11
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 10
- 229910052737 gold Inorganic materials 0.000 claims description 10
- 238000000034 method Methods 0.000 claims description 10
- 238000004519 manufacturing process Methods 0.000 claims description 9
- 238000005530 etching Methods 0.000 claims description 5
- 238000007747 plating Methods 0.000 claims description 5
- 230000004888 barrier function Effects 0.000 claims description 4
- 238000009792 diffusion process Methods 0.000 claims description 4
- 229910052759 nickel Inorganic materials 0.000 claims description 3
- 229910052763 palladium Inorganic materials 0.000 claims description 3
- 238000000151 deposition Methods 0.000 claims description 2
- 150000002739 metals Chemical class 0.000 claims description 2
- 239000000126 substance Substances 0.000 claims description 2
- 239000003795 chemical substances by application Substances 0.000 claims 1
- 238000000576 coating method Methods 0.000 description 6
- 239000010410 layer Substances 0.000 description 6
- 239000004642 Polyimide Substances 0.000 description 5
- 239000011248 coating agent Substances 0.000 description 5
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 230000001681 protective effect Effects 0.000 description 2
- 229910021578 Iron(III) chloride Inorganic materials 0.000 description 1
- 239000012790 adhesive layer Substances 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000013043 chemical agent Substances 0.000 description 1
- VNNRSPGTAMTISX-UHFFFAOYSA-N chromium nickel Chemical compound [Cr].[Ni] VNNRSPGTAMTISX-UHFFFAOYSA-N 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- RBTARNINKXHZNM-UHFFFAOYSA-K iron trichloride Chemical compound Cl[Fe](Cl)Cl RBTARNINKXHZNM-UHFFFAOYSA-K 0.000 description 1
- 229910052750 molybdenum Inorganic materials 0.000 description 1
- 229910001120 nichrome Inorganic materials 0.000 description 1
- 238000000059 patterning Methods 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 229910052715 tantalum Inorganic materials 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/10—Bump connectors ; Manufacturing methods related thereto
- H01L24/11—Manufacturing methods
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/11—Manufacturing methods
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/12—Structure, shape, material or disposition of the bump connectors prior to the connecting process
- H01L2224/13—Structure, shape, material or disposition of the bump connectors prior to the connecting process of an individual bump connector
- H01L2224/13001—Core members of the bump connector
- H01L2224/13099—Material
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01022—Titanium [Ti]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01024—Chromium [Cr]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01029—Copper [Cu]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01042—Molybdenum [Mo]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01046—Palladium [Pd]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01073—Tantalum [Ta]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01078—Platinum [Pt]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01079—Gold [Au]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/14—Integrated circuits
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Wire Bonding (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP58179602A JPS6072249A (ja) | 1983-09-28 | 1983-09-28 | 集積回路の製造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP58179602A JPS6072249A (ja) | 1983-09-28 | 1983-09-28 | 集積回路の製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6072249A JPS6072249A (ja) | 1985-04-24 |
| JPS6349378B2 true JPS6349378B2 (enrdf_load_stackoverflow) | 1988-10-04 |
Family
ID=16068609
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP58179602A Granted JPS6072249A (ja) | 1983-09-28 | 1983-09-28 | 集積回路の製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6072249A (enrdf_load_stackoverflow) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01166542A (ja) * | 1987-12-22 | 1989-06-30 | Fujitsu Ltd | 半導体装置の製造方法 |
| JP2003006813A (ja) * | 2001-06-20 | 2003-01-10 | Shinka Jitsugyo Kk | 薄膜磁気ヘッドおよびその製造方法 |
-
1983
- 1983-09-28 JP JP58179602A patent/JPS6072249A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6072249A (ja) | 1985-04-24 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US4272561A (en) | Hybrid process for SBD metallurgies | |
| US4978423A (en) | Selective solder formation on printed circuit boards | |
| US4451554A (en) | Method of forming thin-film pattern | |
| JPS6349378B2 (enrdf_load_stackoverflow) | ||
| JPH02253628A (ja) | 半導体装置の製造方法 | |
| JPH02224336A (ja) | 半導体装置の製造方法 | |
| JPS6083350A (ja) | 集積回路の製造方法 | |
| JPS6336548A (ja) | 半導体装置及びその製造方法 | |
| JPS6329940A (ja) | 半導体装置の製造方法 | |
| JPH03198342A (ja) | 半導体装置の製造方法 | |
| JPH06342796A (ja) | 突起電極の形成方法 | |
| JPS61141158A (ja) | バンプ電極形成方法 | |
| JPH0312933A (ja) | 半導体装置の製造方法 | |
| JPS5950095B2 (ja) | 半導体装置の製造方法 | |
| JPH03110835A (ja) | 半導体装置の製造方法 | |
| JPS6019661B2 (ja) | 電極形成法 | |
| JPH04274703A (ja) | 金属箔ひずみゲージの電極形成方法 | |
| JPS6156879B2 (enrdf_load_stackoverflow) | ||
| JPS5911647A (ja) | 半導体装置の製造方法 | |
| JPH04278543A (ja) | 半導体装置及びその製造方法 | |
| JPH01113911A (ja) | 薄膜磁気ヘッドの製造方法 | |
| JPS5915181B2 (ja) | 半導体装置の製造方法 | |
| JPH01112512A (ja) | 薄膜磁気ヘッドの電極形成方法 | |
| JPS6070747A (ja) | 半導体装置の製造方法 | |
| JPS5910227A (ja) | 半導体装置の製造方法 |